5 years ago

EPP Europe P2.2017

  • Text
  • Automated
  • Components
  • Productronica
  • Electronics
  • Manufacturing
  • November
  • Assembly
  • Solder
  • Inspection
  • Soldering


TRADE SHOWS + EVENTS Source: Bence Kovacs Source: Bence Kovacs Source: Bence Kovacs Source: Bence Kovacs Jonas Ernst, Fuji Machine MFG (Europe) GmbH. Karthik Vijay, Indium Corporation. Rainer Krauss, Ersa GmbH. Gábor Tójav, Koh Young Europe GmbH. Jonas Ernst, Fuji Machine MFG (Europe) GmbH Cutting Edge Technologies: for your high-quality pick and placement process When reaching for a perfect production, many factors can influence the outcome. Over the years, not only has there been an increase in complexity of products and a demand for faster production, there‘s also been an increase in labor changeover that has become challenging to deal with. According to the speaker, there are four factors that affect quality: man, machine, material, and method. With these factors in mind, a few points should be followed to be the most successful. At first, the correct parts need to be in the correct order. The main concept is to automate as much as possible, however, not everything can be automated. This means there is still a great need for operators, and guidance is essential to be the most productive. Opening communication, not only, between operators and machines, but also throughout all machines that are part of the line. Creating a connection between all machines and software will enable each machine to learn how the operation should work. Lastly, being able to monitor the process at all times, even remotely, and analyzing the current situation of the process, will optimize all aspects of the line. Karthik Vijay, Indium Corporation Minimizing QFN Voiding during SMT Assembly Products, especially in the automotive industry, have now more electrification, sensors, and hybrid technology. This is why the topic of voiding is a common issue in the manufacturing industry. The three most important aspects when engineering flux is decreasing the overall percentage of void, the positioning of the void, and breaking up the size of the void. To reduce the amount of voids, the peak temperature, the speed of the process window for the reflow profile, the texture of the flux, the temperature of the soaking process, and the ball melting point should also be considered. The speaker also discussed the effects that pad design used for reflow profiles have on voids, depending on the fluxes used. Solutions that can be used, depending on your needs, are a short reflow profile, which reduces the void average, while the long hot profile is better for reducing larger voids. Using a vent, as well as, vacuum soldering, are also possibilities, as these methods decrease the amount and size of voids. Placing flat flux coated preforms is also a solution, when keeping the placement force in mind. Even though there may be different levels of criteria of voiding, it is becoming more stringent and is an important part of zero defect production. Rainer Krauss, Ersa GmbH Zero defect strategy- feasible or wishful thinking? Many factors can contribute to errors within manufacturing, however, many of those cannot be changed. For instance, PCB, components, and the environment do not give a lot of legroom for drastic improvements. Instead, manufacturers should focus on altering details within the operators, process, and machines. Giving the right tools to the operator and having full control of the entire process, all while making machines more intelligent, is the key for a zero defect strategy. Requirements within manufacturing should be Smart, future oriented systems with modular design, flexible software platforms, and oriented towards Industry 4.0 or cloud based applications. It is also imperative to know what is going on within the process, from beginning to end. A Smart machine should be able to document the quality of the process. Machines should also know to alert the operator when something is out of its parameter, but only after running a few tests. With the company’s Versacam, Versascan, and Versaeye, the process is controlled with sensors and cameras, ensuring that components are in the correct position and are not missing, all while documenting all details throughout the process. Nevertheless, as the speaker indicated, “A zero defect production is not black and white. It is cost and product driven; has to deliver 100% good quality. Especially when it comes to safety parts, we cannot make any compromises.” Gábor Tójav, Koh Young Europe GmbH Zero defect production in the course of time Even though technology is evolving at a rapid pace, the goal of reaching zero defect has never changed. To be the most successful, the speaker discussed the importance of human-machine communication, implementing “the clever way” into your production, to be able to see the entire line. In doing so, the first step to take is to set up best practices throughout the entire line. The following steps should ensure to continuously have a high First Pass Yield. With the company’s solutions, all aspects of the line is measured and controlled. It records all details of materials used, including its height, 16 EPP EUROPE November 2017

István Latos, Nordson Matrix. Source: Bence Kovacs François Amblard, Vi Technology. Source: Bence Kovacs After presentations, short Q&A took place to answer any questions visitors had. Source: Bence Kovacs width, surface, and length. The process also tracks the offset X/Y, coplanarity, FMI, etc. Receiving information, including the offset range, predicts problems before they occur, which also improves throughput, as the amount of scraps decreases, reducing waste and costs. Specific details about each component is also useful to have, including measurements of the solder joint, joint volume, slope, solder angle, height of the joint, etc. The speaker also discussed the difficulty of dealing with a large quantity of data and how close to impossible it is to do without the help of machines. This is why creating a clever platform, which builds communication between man and machine, is necessary. The operators can handle programing and tuning, while the machines use intelligent monitoring to optimize the process, in order to obtain precise information. István Latos, Nordson Matrix Committed to speed- Unique X-ray inspection systems and technologies setting new standards in high volume production environment To reach an optimal production line with zero defect, key factors should be followed when using an inspection system. The first is to achieve the most speed and stability, all while maximizing the coverage of defects. According to the speaker, being able to flexibly use 4 inspection technologies, Transmission 2D Imaging, Oblique 2.5D Imaging, Thomosynthesis 3D, and the company’s Slice Filter Technique, in one system, will minimize cycle time while inspecting all defects. For instance, inspecting a double-sided board is no longer a Source: Bence Kovacs Guests had the opportunity to network and further discuss new strategies to minimize risks within the electronics manufacturing industry. challenge, as the system can examine both sides without difficulty. Another important factor to follow is to not occupy the line. The machines within the line should be brought up to speed as fast as possible. The speaker specifically discussed using an offline program approach and a global library. Using these methods, a large quantity of boards can be tested for quality as the production is running, as the machine compares each item to a golden board. The final factor is ensuring a proper calibration within each machine. Having automation calibration, where it is transparent to the owner, all while keeping a constant resolution, will enable communication between all machines, and optimize the production line. François Amblard, Vi Technology Reaching quality production faster by revealing and leveraging the information buried in SPI & AOI data Although detecting defects has become easier, due to continuous improvements within SPI and AOI machines, manufacturers are now running into new challenges. Due to lack of resources, tolerances are not being set correctly while production is running. Many of them are blindly set, which creates uncertainty at the end of the production line. All information from the SPI and AOI need to be gathered to pin point exactly where tolerances need to be adjusted. This is what is called the Feed Forward concept, where all images of SPI are also transferred to the AOI. For example, if the SPI detects a defect that isn‘t one, and the AOI does not detect it at all, then the tolerance needs to be enlarged at the SPI. Another problem that can arise is the compilation of large amounts of data, as the speaker pointed out that throughout one day of production, a line can accumulate one terabyte of information. With a smart purging process, only information on defects found with the SPI and AOI is kept, all other data is automatically thrown away. Finding the root cause of issues can also be challenging. Although this is not a perfect solution, the company has data analysis with drill down capability. This means, a line can give automatic attribution to defects depending on where in the line the problem is found. For instance, if a defect is found at SPI, it will automatically attribute it to print, and so on. By using this method, it goes further than the traditional statistical process control tools, which is normally used today. (cp) Next year‘s event will take place at Királyi Kastély on May 17, 2018. EPP EUROPE November 2017 17