1 year ago

EPP Europe P2.2018

  • Text
  • Inspection
  • November
  • Manufacturing
  • Solder
  • Electronics
  • Software
  • Assembly
  • Components
  • Soldering
  • Solutions


TEST + QUALITY ASSURANCE PRODUCT UPDATES Fast and reliable inspection of THT assemblies An angled-view camera module in the AOI system THT Line, from Göpel electronic GmbH, enables higher fault detection, especially for hidden components. In addition, the automated test program generation and optimization with MagicClick is also available, considerably speeding up AOI programming for inspection of THT assemblies. The THT Line is an AOI system designed for parallel inspection of components and solder joints of THT assemblies. With an angledview camera module, labels and markings that are visible only on the side of components can be detected. The camera module, with up to eight angled-view cameras, also offers increased fault detection for hidden components. For example, components be- hind down-holders can be detected. The camera module is height-adjustable, which guarantees an inspection height of 80 mm and a component clearance of up to 140 mm. On the software side, the THT Line now has MagicClick, a software tool that provides fully automated test program generation and optimization, particularly for THT solder joints. With just one click and in the shortest time, an AOI test program including component library is created. In this way, a productionready test program is available in only a few minutes, resulting in significant cost savings and efficient AOI use even for the smallest volumes. Source: Göpel electronic GmbH The THT Line is an AOI system designed for parallel inspection of components and solder joints of THT assemblies. Flying probe systems with faster test time and lower costs Source: atg Luther & Maelzer An A7–24 with a customized manual loading and unloading unit. atg Luther & Maelzer GmbH extended its range of flying probe test systems by launching a line for test areas of up to 40 ’’ width. The oversized systems complement the standard line which can load boards with sizes of up to 27 ’’ width. Special network technology and aerospace applications are driving the demand for high test coverage and 4-wire testing (Kelvin test) for large PCBs. However, 4– or 8-head solutions are not satisfying customer requirements for speed and throughput. The unique and industry architecture of the flying probe system makes it possible to use a higher number of probes per test area resulting in faster test time and lower cost of test. To meet these requirements, the company launched the 16-, 20– and 24-head machines with test areas of up to 40 ’’ width. Depending on the number of test heads, the resulting maximum test area sizes are 40 ’’ x 40 ’’, 40 ’’ x 50 ’’ or 40 ’’ x 60 ’’. The Sales Director for Europe and responsible Product Manager, Peter Brandt, highlights: “The new systems make our high end test methods now also available for the test of oversized PCBs. When considering that the 24 head version allows up to 15,000 contacts per minute, it is a significant leap forward for our customers.” Reliable pick and place handler for volume production The Xcerra MT9510 XP pick-and-place handler successfully passed the onsite buyoff for an automotive LED test application at a leading lighting manufacturer. The solution enables the customer to test high volumes of LED devices with best temperature performance. It leverages the exceptional temperature accuracy of the MT9510 test handler to ensure full temperature control during test, while the LEDs are turned on and producing heat. In addition, its configuration accounts for the sensitive surface areas of the LEDs, which must not be touched while handling the de- vice. All dedicated hardware is integrated in the conversion kit and does not change the base handler, maintaining full flexibility and not impacting any loading, soaking, sorting, or unloading core functions. Syariffuddin A. Kamarudin, Product Manager, comments: “Our solutions replace the previously applied hand test method, with obvious advantages in production volume and reliability. Reliability has been of highest importance for the customer, as the LEDs are used in the automotive industry.” The MT9510 XP can test high volumes of LED devices with best temperature performance. Source: Xcerra Corporation 62 EPP EUROPE November 2018

In-line 3D multi-function inspection and measurement system The MRS-enabled SQ3000 from CyberOptics Corporation has multi-process capabilities, including 3D AOI, SPI and CMM applications. It offers a combination of accuracy and speed with the Multi-Reflection Suppression (MRS) sensor technology, which identifies and rejects reflections caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for highly accurate measurement, making the MRS technology an ideal solution for a wide range of applications with exacting requirements. The Ultra-High Resolution (UHR) MRS sensor enhances the SQ3000 platform, delivering superior inspection performance, suited for the 0201 metric process and micro-electronic applications, where an even greater degree of inspection reliability is critical. The system has been widely used for 3D AOI and can now be used for 3D SPI for accuracy, repeatability and reproducibility – even on the smallest paste deposits. Combined with the easy-to-use software, SPI has reached a new level of precision for the most stringent requirements. Additionally, the SQ3000 can be used to attain accurate coordinate measurements faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours. The first in-line CMM includes a software suite for use in industrial metrology, semiconductor, microelectronics and SMT Source: CyberOptics Corporation The MRS-enabled SQ3000 system has 3D AOI, SPI and CMM capabilities. applications. Customers can use the 3D multi-function system to improve yields, quality and operational efficiencies in their facilities. Solder paste inspection with M2M communication Source: Yamaha IM Division Yamaha Motor Corporation USA‘s Intelligent Machinery (IM) Division announces the launch of the YSi-SP, The 2D and 3D SPI machine offers volumetric measurement and has powerful process optimization capability. the first advanced 3D solder paste inspection (SPI) machine. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto a PCB, offering true volumetric measurement and powerful process optimization capability. The YSi-SP performs high-speed, high-accuracy 2D and 3D solder paste inspection with a single head, employing image high-resolution switch-over for exceptional flexibility in a single machine. The solution seamlessly communicates with other Yamaha machines to perform such Industry 4.0 tasks as automatic changeover, solder misalignment adjustment, and automatic conversion of glue inspection data from the dispenser. This is all possible due to the company’s expertise as a manufacturer of a full lineup of integrated SMT assembly equipment. While offering a comprehensive Statistical Process Control (SPC) data package, the YSi-SP can also be equipped with various optional features including bonding and foreign matter inspection. In making the announcement, George Babka, Sales General Manager, said, “The launch of the YSi-SP enables us to supply all of the primary machines required for mounting processes under the Yamaha brand. This includes printers, dispensers, solder paste inspection, surface mounters and automated optical inspection (AOI) systems. This enables our customers to build their production lines with the highest capabilities, efficiency, and quality.” EPP EUROPE November 2018 63

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