3 years ago

EPP Europe P2.2020

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PCB + ASSEMBLY PRODUCT UPDATES Injection principle in vapour phase soldering Whether in aerospace technology, medical electronics, e-mobility and automotive, power electronics, LED production or in the aerospace & defence sector – the areas of application for reflow soldering are diverse. Electronic components only function in end devices thanks to high-quality soldering of the electronic contact points. But what if the components on the circuit board are very large or of high-mass? Or if vacuum soldering processes need to be realised inline? This is where the efficiency of condensation soldering (vapour phase soldering) stands out, for example with the Condenso series systems from Rehm Thermal Systems. The heat transfer is up to ten times higher than with convection soldering, so even large, high-mass boards can be reliably processed in a stable atmosphere and with the added advantage of their innovative vacuum technology. Condensation with injection principle Vapour phase soldering is not a new invention, but with the company’s patented systems within the Condenso series, a greater range of flexibility is provided for the soldering process than can be achieved with other more conventional methods. The usage of an injection principle and the control of the temperature, the number of injections, as well as its quantity, and the pressure (vacuum) facilitates more precise and more diverse reflow profiling. The soldering process takes place in a hermetically sealed process chamber. With condensation soldering, a film of liquid builds up with the aid of the heat-conducting medium, Galden, which is distributed throughout the entire process chamber and The Condenso series provides a greater range of flexibility for the soldering process. surrounds the whole assembly and evaporates. The vapour condenses for as long as the assembly takes to reach a soldering temperature of between 240 and 260 °C. Galden is perfluoropolyether, a liquid polymer that consists of carbon, fluorine and oxygen. Rehm uses the patented injection principle to achieve better control of the condensation phase. In the process, exactly the right quantity of Galden is added at the correct time. With this procedure, the latent heat that is released during the change in state of the medium from its vaporous form to a liquid is then used to warm up an assembly evenly and constantly. Galden is a self-limited medium. This offers additional safety as the components cannot overheat. Vacuum – for maximum reliability This condensation principle with vacuum has proven to be extremely efficient and reliable in practice. Due to the increased demand for high-performance electronics and safety-relevant electronic components, a vacuum soldering process is increasingly sought after. The vacuum technology of the Condenso is therefore used in an extremely varied range of processes. Reflow soldering reduces oxidation and increases solder joint reliability by reducing voids. This results in soldering points with a surface bonding percentage of up to 99 %. In addition, a vacuum can already be drawn during the heating phase before the actual soldering process. This facilitates not only a more even distribution of the Galden vapor in the process room but also the degassing of solvent and moisture from the soldering paste. Furthermore, in addition to the temperature, the atmosphere can also be varied over the entire time in the process chamber. Proven technology – adapted for the entire series The range of condensation soldering systems from the company has been continuously expanded due to market requirements. Thus, their customers now have access to optimised production equipment for the condensation soldering processes. The flexible system variants of the Condenso smart series can be integrated in an extremely broad range of production environments. Regardless of whether batch operation, inline connection or soldering in the run-through process is required, Rehm provides maximum process reliability for all areas. Source: Rehm Thermal Systems GmbH Manual cleaning bath concentration measurement Source: Zestron Europe The bath analyzer is a manual test that enables a reliable concentration measurement of cleaning baths. In order to achieve good cleaning results consistently, the cleaner concentration in the cleaning bath should remain constant. The concentration can change through various process factors like carry-over or thinning. It is therefore advisable to check the concentration over time. A simple method for regular concentration checks is the Zestron Bath analyzer. The quick manual test enables a reliable and exact concentration measurement of cleaning baths whether new or used. In addition, the inexpensive test method is compact and portable, enabling flexible usage throughout the production environment. For the bath concentration measurement of alkaline cleaning media, the Bath analyzer 10 is recommended, because it also indicates the alkalinity of the cleaner using a color code. The Bath analyzer 20 was designed exclusively for the measurement of pH-neutral cleaning media. The Zestron Eye is an automatic method that displays cleaning agent concentration measurement results in real time and is an alternative to the manual Bath Analyzer products. 48 EPP EUROPE November 2020

Soldering solution adapts to all future requirements With the SelectLine platform, Seho developed a selective soldering system that provides the highest precision and solder joint quality and features maximum flexibility. The machine concept is consistently modular, thus ensuring clear cost benefits. Several modules with different dimensions can be configurated individually with fluxer, preheatings, soldering units, cooling modules, selective brush unit and AOI system. Thus, it adapts to virtually any manufacturing requirement and if the production conditions should change, it may be expanded, the configuration can be modified, or SelectLine modules can be shifted to different manufacturing lines at any time. Up to six soldering units and more than 15 parallel workstations can be integrated in one system. Electro-magnetic soldering units with innovative nozzles for mini-wave and multi-wave soldering processes are part of the standard machine equipment. Maximum throughput requirements are met with the Synchro concept, patented by Seho. This intelligent software feature coordinates the soldering process with several soldering units for one assembly type in such a way that the cycle time is nearly halved without the need for significant investment. If different products are manufactured in mixed operation, the SmartSplit function ensures automatic split of the available soldering units, thus providing maximum throughput rates. Automatic ultrasonic cleaning of solder nozzles is another highlight in the soldering area. The solder nozzle is gently cleaned and completely re-wetted. The SelectLine is ideally suited for using the new LongLife mini-wave solder nozzle. This new nozzle features a lifetime that is at least three times longer than that of conventional nozzles. Therefore, the an- The SelectLine platform can be easily be expanded or modified if the production conditions should change. nual savings potential is remarkable. Maintenance requirements for the new nozzle are significantly reduced. The LongLife solder nozzle does not need to be cleaned or re-activated throughout a complete production shift. In addition, there is no activation needed prior to production start. Moreover, the solution is perfectly prepared for the constantly growing requirements in the manufacturing of next-generation products, such as 5G antennas or LED technology. By means of an automatic software switch, the system is able to process virtually endlessly long PCBs. The software automatically coordinates and optimizes the assembly transport and the positioning of the process stations. As the individual processing stations thereby do not have to match the actual length of the assemblies, it stands out for its very compact design. This minimizes production floor costs, resulting in an excellent cost-efficiency. The SelectLine provides a complete hardware and software package for 100 % automated process control. The flux quantity monitoring system and gradientcontrolled temperature profiles in the preheat area, automatic monitoring of the nitrogen quantity and nitrogen quality, the touchless wave height control or automatic setup control and tool measurement are only some of the monitoring functions that ensure a reliable process. The machine can be equipped with a selective brush system for automatic removal of solder balls and an AOI system for automatic inspection of solder joints immediately after the soldering or brushing process. The advantages are obvious: Safe and reliable processes on the one hand and reduced overall production costs on the other hand. IPTE strenghtens its presence in E-Mobility On October 22nd this year, AZL together with an international industrial consortium consisting of automotive OEM Audi and suppliers along the value chain, including IPTE, will launch a joint project to develop a multi-material battery casing. The 8-month product development will start with an international market analysis as well as a concept study in which different multi-material component concepts including production scenarios will be developed and evaluated with regard to their costs. Finally, a final multi-material battery casing is designed in detail, which will be manufactured as a prototype in a follow-up project. Source: Seho EPP EUROPE November 2020 49