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EPP Europe P2.2020

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TEST + QUALITY ASSURANCE PRODUCT UPDATES High-precision 3D sensing technology solutions Auto Resistance Sensor (ARS) with CyberSpectrum software enables real-time resistance measurements of plating cell contacts in semiconductor application. CyberOptics Corporation, a global developer and manufacturer of high-precision 3D sensing technology solutions, has recently released its In-line Particle Sensor (IPS) and Auto Resistance Sensor (ARS) for semiconductor tool set-up and equipment diagnostics, and the WX3000 metrology and inspection system for wafer-level and advanced packaging applications. An extension of the industry-leading Wafer- Sense and ReticleSense Airborne Particle Sensor (APS) technology that is documented by fabs as the Best Known Method (BKM), Source: CyberOptics The In-line Particle Sensor (IPS) with CyberSpectrum software detects particles in gas and vacuum lines in semiconductor process equipment. the In-line Particle Sensor (IPS) with Cyber- Spectrum software detects particles in gas and vacuum lines 24/7 in semiconductor process equipment. The IPS quickly identifies monitors and enables troubleshooting of particles down to 0.1 μm. The new WaferSense Auto Resistance Sensor (ARS) with CyberSpectrum software for semiconductor tool set-up and diagnostics enables real-time resistance measurements of plating cell contacts in semiconductor Electrochemical Deposition (ECD) applications. Source: CyberOptics Process and equipment engineers in semiconductor fabs can speed equipment qualification, shorten equipment maintenance cycles, lower equipment expenses and optimize preventative maintenance plans. “Whether it’s used in the front-end, mid-end or back-end of the semiconductor fab, our high-precision sensor technology is delivering significant improvements in yields, processes, productivity and through-put,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. The WX3000 system focuses on wafer-level and advanced packaging metrology and inspection. Performing two to three times faster than alternate technologies at data processing speeds in excess of 75 million 3D data points per second, the NanoResolution Multi-Reflection Suppression (MRS) sensorenabled WX3000 systems deliver throughput greater than 25 wafers per hour. 100 % 3D and 2D metrology and inspection can be completed simultaneously at high speed, as compared to an alternate, slow method that requires two separate scans for 3D and 2D and only a sampling of a few die. The proprietary NanoResolution MRS sensor meticulously identifies and rejects multiple reflections caused by shiny and mirror-like surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements. Ensuring high quality for screen printing Like Harley Davidson, Google, Microsoft, and Apple, Laritech was started by enthusiastic engineers working in their garage. This newly published case study, including interviews with Joel Butler, Vice President of Manufacturing and Matthew Banks, SMT Manager, explores how the company grew and how Koh Young helped them reach their goal of manufacturing excellence and exceptional quality. Laritech has Koh Young 8030–2 SPIs and Zenith LiTE AOIs connected with the KSmart smart factory solution software. Joel and Matt explain the selection process, why they chose Koh Young, and the installation process, as well as their experience with the equipment and with Koh Young as a partner. Joel Butler, Vice President of Manufacturing, explains, “Everybody knows screen printing is the core of quality. If you don‘t get that right, nothing else matters. When we got our first Koh Young SPI, we had a large board with around 4,000 components, plus 50 different BGAs. We saw our yields increase overnight.” Brent Fischthal, Sr. Manager, Americas Marketing and Regional Sales at Koh Young added, “we really enjoy working with companies like Laritech and with people like Joel and Matt who have an enthusiasm for what they do and the way they serve their customer. It really is an honor to be involved in their success story and we thank them for taking the time to talk to us about it.” The video on the use case can be found here:; Source: Laritech Laritech uses an SPI, AOI and a software solution from Koh Young to help them reach their manufacturing goals. 56 EPP EUROPE November 2020

Investing in 3D AOI for THT line E.D.&A. NV (Kalmthout) is one of Belgium’s most advanced electronics production company, which earned them the title of “Factory of the Future” in 2016 and 2019. They are always looking for innovations to adapt their manufacturing process which recently prompted them in buying the Viscom 3D automated optical inspection system S3016 ultra. With their multidisciplinary team of engineers, E.D.&A. offers hardware and embedded software solutions for, amongst others, machine and equipment manufacturers. For the production of these solutions they use their own ultramodern automated assembly lines. They are the frontrunners when it comes to quality, flexibility, efficiency and short lead times thanks to a thorough automation. The company is expanding: To continue to meet customer’s demand, they have major plans including the construction of a new production hall and the increasing of their production capacity. For the 3D inspection of the THT line, E.D.&A. carried out an extensive market E.D.&A. chose the S3016 ultra for the inspection of their THT line. study and did many tests and measurements to determine which machine best correlated with their demands and wishes. This guided them to the impressive performance of the S3016 ultra, which combines high accuracy with ease of use. The 3D AOI system inspects PCB bottom sides precisely even under extreme cycle times. The great inspection scope covers SMD, THT, press-fit and selective solder joints in full 3D. Thanks to the special sensor technology, accurate Source: Viscom AG measurements of soldering and THT pin lengths can be performed. Besides measuring pins, algorithms make fast detection of open solder joints, solder bridges, missing pins and other defects possible. Unique to Viscom are the eight angled cameras that complete the orthogonal image and guarantee a shadow-free inspection. The clear color images are displayed from all 9 perspectives to the operator, allowing for a smooth verification of the quality of the connections. “As Factory of the Future staying up-to-date is not enough, but looking to the future is the only motto. That is why reinventing oneself and observing evolutions closely is crucial. Especially when certainties of the past are suddenly uncertain, it is of utmost importance that we look ahead, think ahead and stay ahead – just like E.D.&A. and Viscom”, so Tom Van Tongelen from Smd-Tec, sales representative of Viscom for the Benelux countries. AOI solution designed for THT processes Seho Systems GmbH, a manufacturer of complete solutions for soldering processes and automated production lines, is the right partner when innovative ideas are required. With the PowerVision, the company focuses on two key points in the manufacturing of THT assemblies: Continuous quality assurance and cost-efficient production processes. The PowerVision stands for fast, automated optical inspection, and it is particularly designed for THT processes. The system can be configured depending on the manufacturing requirements: For component placement inspection in front of a wave or a selective soldering machine, or for solder joint inspection after wave or selective soldering processes, or as a combination of both inspection tasks, integrated into the same module to save space. The system reliably detects typical placement defects, such as presence of components or polarity, and soldering defects like incomplete solder joints, solder bridges or solder balls, for instance. Additionally, the system is capable of reading and processing product IDs. The stand-alone variant of the Seho PowerVision can be flexibly integrated into each fully automated production line. Moreover, the system can be directly integrated in many of the company’s selective soldering systems, thus providing additional benefits, particularly in terms of floor space and board handling costs. Generation of test plans is performed easily and comfortably at any PC using an offline teach program. Basic data can be taken from Gerber data, DXF files or from any digital image file (camera or scan). A simple wizard leads the operator through the programming procedure. Moreover, the comprehensive and individually expandable component library includes component-specific test elements, as well as an automatic inspection search to simplify programming. Even optimization of a test plan that usually requires temporary interruption of the production to adjust parameters can be made offline. Thus, the AOI system will be permanently available for production. PowerVision software provides analyzing tools that can draw conclusions on the current production. These tools include a heatmap that visualizes error frequencies based on their geometrical location on the PCB and a trend analysis that effectively supports optimization of the test program. The detected defects can easily and Source: Seho Systems GmbH The PowerVision detects typical placement as well as soldering defects and is capable of reading and processing product IDs. quickly be classified using the intuitive interface of the SehOverify software. Based on this classification of the test results, the software module Seho spc calculates and graphically displays different statistical key figures such as first pass yield, false calls rates or defect rates (FCPMO/DPMO). The benefits are obvious: Early identification of defects allows a fast increase of the overall manufacturing quality. Simultaneously, production costs can be sustainably reduced due to automated inspection and computerassisted rework. EPP EUROPE November 2020 57