COVER STORY » Packaging
COVER STORY » Packaging Inspection Solutions Meister D inspection capability Source: Koh Young The systems Meister S, D, and D+ combine the proven Moiré technology and modern optical configurations to reliably support the inspection of shiny components in 2D and 3D. With their newly developed technology, they are the perfect fit for the inspection of SiPs on SMT electronic board assemblies, among other critical applications. The brand-new systems feature this extra capability as an expansion of Koh Young’s superior AOI technology with a different optical system configuration compared to the Zenith series (different lighting system). With these systems, users can overcome critical challenges in the manufacturing line. The latest Meister system is optimized for the inspection of dies and ensures the fastest, most accurate measurement with an 8-projector inspection probe tailored to typical SiP components including microchips and tiny chips. The shadowing problems caused by small and narrow gaps are a thing of the past. The very high precision of the inspection results is assured by the camera subsystem featuring 25 MP and 3,5 um resolution. With ongoing miniaturization, the requirements for higher resolution inspection systems are also increasing. At least 100 pixels must be available for a single repeatable measurement of the finest and smallest feature. Also, the flatter angle of the projection units enables the measurement of low heights and compensation of interfering reflections. The system allows full and uncompromised 3D inspection of dies, as well as of cracks on 0201M (008004-in) SMDs. The new evolution is based on Koh Young‘s proven inspection technology, now em- ployed in a novel way and available for other critical tasks. In basing the new solution on the proven platform, Koh Young made sure that its customers can expect extremely reliable results with the highest possible confidence. Accurate measurements are guaranteed. And, as such, the user benefits of the Meister systems are clear. With their high accuracy, these systems drastically minimize the number of unidentified defects and, in turn, increase the production yield with a secured higher quality. As it comes down to the in-sight of all electronics manufacturers, having more accurate data on the localization of possible defects in the early stages of production is key for adding value and saving costs. Conclusion Advanced packaging is becoming much more prevalent in the market, thanks, in part, to its advantages over traditional device packaging methods. However, board complexity and shiny die surface make the inspection process in the manufacturing line more challenging. The industry requires a highprecision inspection solution to overcome these challenges. When looking for the appropriate system to choose, it is of very high priority that the product manufactured is known in detail, then the decisive criteria can be set, and the optimum equipment solution can be selected. With a competent partner as the solution provider, finding a capable and appropriate system meeting the requirements of advanced packaging is not rocket science. It is of the utmost importance that customers are able to rely upon a solid and trustful partner who provides suitable experience of the market, technology, and process demands. Koh Young, the leading 3D measurement-based inspection solutions provider, has now launched the Meister S, D, and D+, the next generation of systems for extended repeatability and accuracy for use with even more sophisticated advanced packaging devices. www.kohyoung.com 20 EPP Europe » 11 | 2021
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