5 months ago

EPP Europe P2.2022

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TEST & QUALITY ASSURANCE » Product Updates BGA rework systems PDR debuts new integrated reball system Manufacturer of BGA rework systems, test and X-ray inspection systems, PDR Rework Systems, has released a new integrated reballing system for all PDR Evolution Series Rework Systems. The company’s latest reball system incorporates both solder paste application and reball sphere attach in one system, incorporating advanced nano-technology for a clean, high precision reball method for rework. The new system also incorporates an integrated excess sphere recovery chamber to capture excess spheres that can easily be accessed on the reball platform for later use, or to accelerate the process when re-balling multiple BGA’s concurrently. Although made specifically to integrate into the company’s own systems, the new reball system can be used as stand-alone device for any reballing application where highly accurate reball applications are required. They are made of high-quality materials and are manufactured with new, state- The reball system incorporates both solder paste application and reball sphere attach in one system of-the-art laser technology to ensure highly accurate stencil fabrication and ultra-smooth edge/bore finishes. Source: PDR Rework Systems 2.5 & 3D DFT automation solution software Siemens introduces multi-die software for 2.5D and 3D IC design-for-test tasks Siemens Digital Industries Software has introduced the Tessent multi-die software solution to help customers dramatically speed up and simplify critical design-fortest (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures. The company says the technology paves the way for mainstream adoption of 3D ICs. As demand for smaller, more power efficient and higher performing ICs continues to challenge the global IC design community, next-generation devices increasingly feature complex 2.5D and 3D architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so that they behave as a single device. However, these approaches can present significant challenges for IC test, since most legacy IC test approaches are based on conventional two-dimensional processes. The company says its multi-die software is the industry’s most comprehensive DFT automation solution for highly complex DFT tasks associated with 2.5D and 3D IC designs. It works seamlessly with Tessent TestKompress Streaming Scan Network software and Tessent IJTAG software, which optimize DFT test resources for each block without concern for impacts to the rest of the design, thereby stream- lining DFT planning and implementation for the 2.5D and 3D IC era. Using the new software, IC design teams can rapidly generate IEEE 1838 compliant hardware featuring 2.5D and 3D IC architectures. “IC design organizations are seeing dramatic spikes in IC test complexity due to the rapid adoption and deployment of designs featuring densely packed dies in 2.5D and 3D devices,” said Ankur Gupta, vice president and general manager of the Tessent business unit for Siemens Digital Industries Software. “With Source: Siemens Digital Industries Software Using the new multi-die software, IC design teams can rapidly generate IEEE 1838 compliant hardware featuring 2.5D and 3D IC architectures, the company explained Siemens’ new [m]ulti-die solution, our customers can be ready for the designs of tomorrow, while slashing test implementation effort and simultaneously optimizing manufacturing test cost today.” In addition to supporting comprehensive test for 2.5D and 3D IC designs, the new software solution can generate die-to-die interconnect patterns and enable package level test using the Boundary Scan Description Language (BSDL). “As the limits of traditional 2D IC design approaches become increasingly clear over time, more design teams are leveraging the power, performance and form factor advantages that 2.5D and 3D IC architectures can deliver. But deploying these advanced schemes in new design starts without first establishing a DFT strategy that acknowledges the inherent challenges these architectures present can raise costs and undermine aggressive timelines,” said Laurie Balch, president and research director for Pedestal Research. “However, by evolving DFT technology to keep pace with the rapid adoption of multi-dimensional designs, EDA vendors can play a key role in further enabling global, mainstream adoption of 2.5D and 3D architectures.” 44 EPP Europe » 11 | 2022

RF performance characterization Test solution unveiled for on-wafer device characterization Providers of test & measurement solutions, technology systems, Rohde & Schwarz now offers a test solution for full RF performance characterization of the DUT on-wafer. The solutions combines its R&S ZNA vector network analyzer with engineering probe systems from FormFactor. As a result, chipmakers can perform reliable and repeatable on-wafer device characterization in the development phase, during product qualification and in production, the company explained. The company supplies the ZNA vector network analyzer, which characterizes all RF qualification parameters at coaxial and waveguide levels, as well as frequency extenders for application ranges above 67 GHz. FormFactor addresses the wafer contact with manual, semi-automated and fully automated probe systems including thermal control, high-frequency probes, probe positioners, and calibration tools. The calibration of the complete test system, including the R&S ZNA, is supported in the FormFactor WinCal XE calibration software. In the test setup, the user has access to all test capabilities of the R&S ZNA thanks to the fully calibrated setup. Generic S-parameter tests allow characterization for filters and active devices, but distortion, gain and intermodulation tests can also be performed to qualify power amplifiers. The fully calibrated setups also allow all results to be directly taken from the VNA without postprocessing as the calibration data are applied directly to the VNA. Frequency extenders open up sub-THz frequencies such as Dband, currently in the focus of 6G research. Source: Rohde & Schwarz The company’s ZNA performing onwafer measurements together with FormFactor SUMMIT200 probe system EPP Europe » 11 | 2022 45