Issue 11 | 2025www.epp-europe.euElectronicsProduction &Testproductronica 2025Shaping the future - Innovationson show in Munich» Page 18PCB & AssemblyRethinking process verification» Page 24Special PackagingNext Gen X-Ray Inspection forAdvanced Packaging» Page 38Test & QualityAssuranceRedefining the sensing ecosystem» Page 46COVER STORYOptical inspectionof 20 µm placementgaps in SiPpackaging» Page 14SMT at its best
