SUPPORTING PROGRAM
SUPPORTING PROGRAM 10.00-10.30 10.30-11.00 11.00-11.30 11.30-12.00 Tuesday (12.11.2019) Round Table: How are manufacturers coping with shifting supply chains? Trevor Galbraith, Global SMT & Packaging Round Table: How important is inline X-ray in factory automation? Trevor Galbraith, Global SMT & Packaging Wednesday (13.11.2019) Round Table:Factory Logistics - How to make your factory more efficient and safe money Global SMT & Packaging Round Table: AI - who is leading the technology and who is influencing it? Global SMT & Packaging Advances in Benchtop Fluid Dispensing: More Process Control at Your Fingertips Vladimir Konopelko, Nordson EFD The next RF probing challenge: IoT and 5G Alexander Thaler, INGUN Prüfmittelbau 12.00-12.30 12.30-13.00 13.00–13.30 13.30-14.00 14.00-14.30 14.30-15.00 N.N. N.N. Automotive Flash Memory Growth and the Production Bottleneck Dilemma: Accelerating the Transition from e.MMC to 3D UFS in Anthony Ambrose, Data I/O N.N. N.N. Roundtable Hüthig Coherent - we cover your laser applications from A (additive manufacturing) to W (welding of dissimilar materials) Dr. Roland Mayerhofer, Coherent Munich Best Practices for X-ray Inspection, Reflow an the Impact of Pre-programmed Managed-NAND devices Anthony Ambrose, Data I/O Manufacturing excellence – material flow from PLM to process engineering Nir Benson, Siemens AG Industry 4.0 for Test: Improve Operational Efficiency with New Technology for Centralized Test Station and Data Management Graham Green, National Instruments 15.00-15.30 15.30-16.00 16.00-16.30 16.30-17.00 N.N. Business Outlook: Global Electronics Industry (with emphasis on Europe) Walter Custer / Global SMT N.N. N.N. N.N. Business Outlook: Global Electronics Industry (with emphasis on Europe) Walter Custer / Global SMT Indian Electronics Market Attractiveness / Focus on E-mobility Vineet Martin, EAC Indian Market Entry Success Factors Vineet Martin, EAC 17:00-17:30 17:30-18:00 18:00--20:00 Set-Up Global SMT Award Global SMT Award MIIM Get Together
HALL A1 Last update 8. October 2019 Thursday (14.11.2019) Friday (15.11.2019) 10.00-10.30 10.30-11.00 11.00-11.30 11.30-12.00 12.00-12.30 12.30-13.00 13.00-13.30 13.30-14.00 14.00-14.30 14.30-15.00 15.00-15.30 15.30-16.00 16.00-16.30 Round Table: What is the future for automotive electronics? Global SMT & Packaging Round Table: Conformal Coatings - best practice techniques and applications Global SMT & Packaging Panel Discussion: The ‚Circular Economy‘ and the electronics manufacturing industry WNIE TV Implementation of a low melting point soldering alloy in electronics production Steven Teliszewski, Interflux Localization in Russia: Key Factors to drive your business Sergei Belyakov, GS Nanotech Balancing your Test Strategy to Deliver the Value your Business Expects… and Keep Your Engineers Happy! Graham Green, National Instruments Round Table: Konradin 3D AOI Arena Human Automation: Hands-Free Industry 4.0 Michael Ford, Aegis Corporation (SMTA) Reducing the Fake Electronic Component Ingress Using Blockchain Radu Diaconuescu, Swissmic SA (SMTA) Good Practices, to be "Best in Class" in SMT Ivan Roman, Contintental Powertrain (SMTA) Business Outlook: Global Electronics Industry (with emphasis on Europe) Walter Custer / Global SMT N.N. Round Table: Building a data-driven workforce Global SMT & Packaging Round Table: Soldering Automation - the challenges and the benefits Global SMT & Packaging Panel Discussion: Closing the Skills Gap: Who will my colleagues be in future? WNIE TV Panel Discussion: The T-word, The B-word, The A-word… The impact of current affairs on our global industry WNIE TV N.N. N.N. Business Outlook: Global Electronics Industry (with emphasis on Europe) Walter Custer / Global SMT N.N. 16.30-17.00 17:00-17:30 17:30-18:00 N.N. IPC - price ceremony More events are also taking place: Innovation Forum, Hall B2 and PCB & EMS Speaker Corner, Hall B3.360 Weitere Veranstaltungen finden hier statt: Innovation Forum, Hall B2, and PCB & EMS Speakers Corner, Halle B3.360 EPP productronica Guide 2019 9
