TEST + QUALITY ASSURANCE PRODUCT UPDATES IoT and Industry 4.0 at Apex show Viscom announced that it had its best IPC Apex Expo to-date with a record number of visitors inspired by its intelligent cross-linked systems – ready for i4.0 applications. The company presented a complete range of advanced inspection systems, including 3D SPI, 3D AOI, 3D MXI and 3D AXI, and won a 2018 NPI Award for its X7056-II cutting-edge inline X-ray technology. The company also partnered with the IPC Connected Factory Exchange (CFX) initiative, introduced for the first time ever at the show. The CFX showcase included live demonstrations of standardized Internet of Things (IoT) data from the company’s machines through the cloud and on to visitors’ mobile phones. The demo took place during the entire show: On their personal devices, visitors observed real-time analytical reports, such as OEE (overall equipment effectiveness), unit counts, as well as, live data stream showing actual events occurring on the machines in front of them. With no software to install, nothing proprietary, and no middleware required, this illustrated the true nature of IoT, with CFX as the 100 % open standard. “As an AOI and X-ray inspection vendor, our systems are the sensors of any Industry 4.0 environment,” commented Carsten Salewski, President and CEO. “Our equipment provides the data that can be used to improve processes and product quality. We have supported the IPC CFX standardization efforts from day one. It was very exciting to see our industry‘s first standard based IoT network come to life in San Diego.” When implementing concepts within the scope of Industry 4.0, 3D inspection systems for SPI, AOI, AXI and MXI from the same source are an obvious advantage. “So naturally Viscom was involved early on with several platforms like our own Quality Uplink and an open i4.0 interface that allows third parties to connect to our equipment” emphasized Salewski. With the Quality Uplink software feature, the company enables intelligent linking of results from the different inspection gates. The operator has fast access to all the essential data and images. Furthermore, the inspection systems can carry on fully automated communication with, for example, the placement machines and paste printers, and influence their parameters (Closed Loop). Open Interface 4.0, from the company, on the other hand enables customers who have decided on a 3D AOI system to combine their results with those from a solder paste inspection for a networked evaluation, even if the SPI system is not from the company. SMT Hybrid Packaging, Booth 4A-122 www.viscom.com Source: Viscom Inc. 3D AXI demonstration with the X7056-II. Industry 4.0 solutions and the 3D AOI system S3088 ultra gold. Source: Viscom Inc. 68 EPP EUROPE May 2018
Cost-efficient solutions for testing electronic assemblies ECT switch probes are cost effective and reliable solutions for non-destructive testing to verify the presence of components or contact leads within a connector assembly. The company’s experience and design standards, combined with its knowledge of materials and platings, allows for the quick alignment of probe features with project requirements. The switch probes are replaceable by using one of many receptacle termination options. Customers can choose from gold or nickel plated plungers. A switch probe is a spring contact that is used to verify the presence of components or contacts within a connector assembly. The current path for test is from the probe tail to the receptacle which is normally open (“No” or “closers”). As the plunger is compressed to a defined switch travel, the circuit is closed. The most common application is in the cable harness testing industry. They are used to verify the correct location of a terminal contact in a connector while also checking the retention force. They also verify Source: Everett Charles Technologies the physical presence of non-conductive components or devices on a circuit board. Switch probes are used for wire harness contact sensing and component sensing. For applications, such as automotive component test where zero defects are allowed, they must typically function without error for tens of thousands of cycles. The company’s switch probes easily meet this standard for reliability. www.ect-cpg.com A switch probe can verify the correct location of a terminal contact in a connector while also checking the retention force. NEW & UNIQUE: Our Labtester LT101 Unbeatable ratio of cost of ownership Smart program teaching with 7“ touch screen State of the art data export (USB, Bluetooth, Ethernet, WLAN) Industrie 4.0 ready Pulltester LT101 All-in one HD digital microscope with high image quality of solder Source: Inspectis AB Inspectis AB announces the F30 all-in-one full HD digital microscope. New features and all-round performance come together in this durable, industrial grade package. The F30 joins the F30s full HD digital microscope, known for its adaptability and versatility. The F30s has a reputation as the all-around ‘best choice’ for the widest range of visual inspection applications. Now, it combines all features and competitive advantages into an all-in-one system with a plug-and-play format, with LED array and essential built-in controls (e.g., zoom, iris, color balance). All basic parameters such as zoom, brightness and color levels, can be controlled The full HD digital microscope provides excellent image quality of solder joints on PCB assemblies and reflective metallic parts. through on-board buttons, and additional control features and setting memories can be accessed using the HD-020 remote control or via computer software. The F30 also has an auxiliary power socket for use with the new ring light, providing excellent image quality for such structures as solder joints on PCB assemblies and highly reflective metallic parts, all with minimum glare and reflection. F30 options include an ESD-protected housing and a built-in laser pointer. It brings uncommon capabilities and advantages to digital microscopy for SMT electronics assembly inspection including full FHD, 1080p 60 fps HDMI output for lag-free magnified working, superior 30:1 zoom optics with auto-focus, and a generous practical working distance. Objects under inspection are rendered sharp, clear, and large; its 56 x screen magnification on a 24 ” monitor, for example, can be increased up to 200 x with auxiliary lenses. An optional built-in laser pointer aims at the area of interest and assists in quickly locating it on the screen, whilst efficient object handling is aided by the full range of thoughtfullydesigned accessories. SMT Hybrid Packaging, Booth 5–434 www.inspect-is.com For further information please visit us at the Hall 4a Booth 440 or contact us directly! F&S BONDTEC Semiconductor GmbH Industriezeile 49a A-5280 Braunau am Inn, Austria T: +43.7722.67052.8270 F: +43.7722.67052.8272 Mail: info@fsbondtec.at EPP EUROPE May 2018 69 www.fsbondtec.at
