Mixed Signal System-on-Chip Market Key Players, Technology and Shares Forecast to 2021.docx
Mixed Signal System-on-Chip (MxSoC) Market Includes in-depth analysis of Market Application, Size, Specification, Trends, Major Manufacturers and Business Strategies by Considering Types, Market Segmentation and Analysis.
Mixed Signal System-on-Chip (MxSoC) Market Includes in-depth analysis of Market Application, Size, Specification, Trends, Major Manufacturers and Business Strategies by Considering Types, Market Segmentation and Analysis.
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• INTEL CORPORATION<br />
• LSI CORPORATION<br />
• MARVELL TECHNOLOGY GROUP<br />
• MICROSEMI CORPORATION<br />
• MIPS TECHNOLOGIES INC<br />
• NEC ELECTRONICS CORPORATION<br />
<strong>Market</strong> Segment by Regi<strong>on</strong>s, this report splits Global in<strong>to</strong> several key Regi<strong>on</strong>s, with sales<br />
(c<strong>on</strong>sumpti<strong>on</strong>), revenue, market share <strong>and</strong> growth rate of <str<strong>on</strong>g>Mixed</str<strong>on</strong>g> <str<strong>on</strong>g>Signal</str<strong>on</strong>g> <str<strong>on</strong>g>System</str<strong>on</strong>g>-<strong>on</strong>-<strong>Chip</strong> (MxSoC)<br />
in these regi<strong>on</strong>s, from 2011 <strong>to</strong> 2021 (forecast), like<br />
• United States<br />
• China<br />
• Europe<br />
• Japan<br />
• Korea<br />
• Taiwan<br />
Split by product Types, with sales, revenue, price <strong>and</strong> gross margin, market share <strong>and</strong> growth rate<br />
of each type, can be divided in<strong>to</strong><br />
• St<strong>and</strong>ard cell-based MxSoCs<br />
• Embedded design-based MxSoCs<br />
Split by applicati<strong>on</strong>s, this report focuses <strong>on</strong> sales, market share <strong>and</strong> growth rate of <str<strong>on</strong>g>Mixed</str<strong>on</strong>g> <str<strong>on</strong>g>Signal</str<strong>on</strong>g><br />
<str<strong>on</strong>g>System</str<strong>on</strong>g>-<strong>on</strong>-<strong>Chip</strong> (MxSoC) in each applicati<strong>on</strong>, can be divided in<strong>to</strong><br />
• Computer sec<strong>to</strong>r (microprocessors, microc<strong>on</strong>trollers, computer peripherals)<br />
• ICT sec<strong>to</strong>r (wireless communicati<strong>on</strong> equipment, smart sensors in "ICT" sec<strong>to</strong>r)<br />
• C<strong>on</strong>sumer electr<strong>on</strong>ics (smartph<strong>on</strong>es, portable media players, set-<strong>to</strong>p boxes, digital TVs, DVD, <strong>and</strong><br />
Blu-ray players, video coders <strong>and</strong> decoders, smart sensors in c<strong>on</strong>sumer electr<strong>on</strong>ics, power<br />
management chips)<br />
• Au<strong>to</strong>motive sec<strong>to</strong>r (smart sensors in au<strong>to</strong>motive sec<strong>to</strong>r, au<strong>to</strong>motive body electr<strong>on</strong>ics,<br />
infotainment applicati<strong>on</strong>s)<br />
• Industrial sec<strong>to</strong>r (SmartFusi<strong>on</strong> cSoC, solid-state & electro-mechanical systems, industrial<br />
au<strong>to</strong>mati<strong>on</strong>)<br />
• Military & Aerospace sec<strong>to</strong>r (field programmable arrays, Rad-Hard mixed signal FPGAs & ASICs)
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