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4 years ago

EPP Europe P2.2019

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3D AOI MARKET SURVEY

3D AOI MARKET SURVEY Company Name ALeader Europe Ltd. CyberOptics Corporation GÖPEL electronic GmbH Koh Young Technology Mek Mirtec Quality of image: Judged by pixel size 15 micron 10 μm + 7 μm HR option up to 10.5 μm per pixel 15 μm - 20 μm 15 μ/pixel resolution 4,096 x 3,072 pixel Image capture system Illumination unit: LED/infra-red/etc… LED LED Multispectral, multidirectional (infrared/visible/ultra violet), can be adjusted in intensity and direction 3D Projectors (8), IR_RGB LED, Dome styled Illumination Two stage, omnidirectional RGB LED lighting 2D: RGB color LED 3D: white LED source Projector unit 4 digital projector units N/A Multi fringe projection, 360 projection directions 8 4x multi-frequency Moiré projectors (total 12 projectors) with 80 ° projection angle Digital projector Filet (height/length) Yes, height, volume and area measurement Yes measured Yes Yes Yes, also volume Yes Wetting angle Fillet shape Yes Yes Yes Yes, full profile meniscus shape analysis Yes End/Side connection (width/length) Yes Yes measured Yes Yes Yes, including bridges detection in both 2D and 3D Yes Footprint Inspection Missing solder Foreign material Footprint error Yes, no solder and insufficient solder Yes Yes Yes Yes full FOD capability Yes Yes Yes Yes Yes Yes Yes Yes, also lack of solder Yes, full range foreign material in both 2D and 3D Yes, confirmation of width, length and height Yes Yes Yes Types of defects (Other) Contamination on pads All others for body and lead IPC 610 classes I, II and III tolerance value checks in addition to regular measurements; IC lifted lead measurement, bent leads defects, excess solder defects, hair solder bridges • Cold solder • Insufficient and excessive solder • Void • Wave solder • Selective solder • Laser solder • Robot solder, etc. Component height Yes Yes measured Yes Yes up to 25 mm Yes, up to 25 mm Component body inspection Component missing/ wrong Polarity Reverse front/back Component shift, lift, tilt Missing inspect., OCV, OCR, component color inspection Yes Yes Yes – automatic tolerance definition according to IPC level Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes, including OCR/OCV text inspection Yes, in both 2D and 3D Yes, dedicated front/ back check algorithms Yes, in steps of 1 μ resolution in X,Y, Z. Tilt in length and width directions of the component (4 corners are measured) Yes Yes Yes Yes 28 EPP EUROPE November 2019

Omron Europe Ltd. Parmi Corporation Pemtron Europe GmbH Saki Corporation TRI Test Research, Inc Viscom AG Vi Technology Yamaha Motor Europe N.V. High quality 3D imagery using CMOS camera 50 MPix/s HD XYl Resolution: 7 μm/ 12 μm/ 18 μm Height (Z) resolution: 1 μm 12 MPix top, 6,5 MPix side cameras up to 10 μm 4.75 μm X,Y resolution + laser triangulation with Z constant resolution 1 μm from -5 to + 20 mm 12 micron Omron proprietary color highlight illumination consisting of red, green and blue LEDs Multi-LED, RGB LED and UV available • 2D lighting system: 6 stage lighting ring (Coaxial Toplight: Red LED, Toplight: Red LED, Sidelight: Blue LED, Green LED, Red LED, and Lowlight: Red LED) • 3D lighting system: white high power LED (for profilometry) Multi-phase true color LED, Coaxial lighting LED Axial and peripheral LED with holographic diffuser White LED + infrared DPL phase shift projector units that project stiped lighting for 3D imagery Shadow-free, Dual Laser Triangulation 10 projector Moire technology 4 height projection: multi-frequency digital projectors 4 digital fringe pattern Yes Red laser with 2 angular cameras 4 projectors Yes Yes Yes Yes Yes Yes Yes: height, length & width Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes • End solder in 3D (wetting angle/concavity) • Side solder in 2D Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes • Contamination inspection • Underfill-fillet • SIP-inspection • Die • Underfill • CCOD • Solder paste • Solder ball • Excessive solder • Solder bridge • Soldering volume • Excessive solder • Lifted lead • Bridge • Contamination • Solder balls None or insufficient wetting Yes Yes, up to 25 mm Yes Yes Up to 20 mm Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes EPP EUROPE November 2019 29