Next generation 3D AOI – PARMI XCEED Reliable 3D AOI with superior High-Speed-Laser- Technology A future-proof 3D AOI system must combine robustness, accuracy, speed and economy. However, ease-of-use and integration capability in a modern manufacturing environment play at least as important a role for the user. First 3D AOI systems, which were brought to market, were based on Phase Measurement Profilometry (PMP) or Moiré technology. In the process, 3D data in a field-of-view (FOV) are determined and evaluated. The large amount of data requires appropriate high performance computers to get to acceptable inspection speeds. The next generation of 3D AOI systems relies on high-speed laser technology (HSLT). These systems are immune to interference, provide the highest accuracy and are ultra-fast. The real 3D measured values are measured by an intelligent 3D sensor head. The 3D head moves continuously over the printed circuit board PARMI XCEED – Next generation 3D AOI system inspection from 0201M to components up to 50 mm high and evaluates the data of the laser line in real time – to 100%. Due to the superior 3D laser technology, significantly lower data volumes are necessary for the evaluation. The demands on the computer performance also decrease significantly. Robust 3D laser technology and highest reading quality In every SMT production, the colors, brightness, reflectivities and surface roughness of printed circuit boards vary considerably. Component sizes from 0201M to large power components can be found on one and the same printed circuit board with increasing packing density. High components such as capacitors and connectors also do not really facilitate the testing tasks. As a carrier, the circuit board also plays an important role: very thin circuit boards or multiple panels with many and large cutouts do not provide a clear „measurement plane“. 3D high-speed laser technology ideally fulfills all of these requirements that every one of us in electronics manufacturing knows only too well. The 3D sensor head is able to measure components up to 50 mm high and also has the ability to detect the warpage of the PCB in real time. This ensures a very decisive factor: the highest quality of the 3D measured values determined. Side cameras additionally support demanding test tasks. As a valuable „waste product“ even foreign particles and contaminants are recorded during the test – in the sense of supplier evaluation and technical cleanliness. Horizontal and vertical integration – interfaces and software An integral part of a forward-looking solution for 3D inspection is the horizontal integration (SMEMA, HERMES, IPC CFX, ...) and the vertical integration (MES) of the systems into the production line or environment. The creation of a test plan and the usability of the system are very simple and comfortable, since this is largely automated. These are two key requirements from the HighMix / LowVolume manufacturing environment and therefore provide significant added value for the user. Communication with upstream and downstream processes (printers, mounters, etc.) is also automated. Bad Marks are inherited and shared when multiple are used to avoid unnecessary checks. The same is true for correlations between 3D SPI and 3D AOI metrics to support the operating personnel purposefully in the continuous process improvement. 38 EPP EUROPE November 2019
Advertorial Author: Dipl.-Phys. Andreas Gerspach Andreas Gerspach is managing partner of GPS Technologies GmbH in Bad Vilbel. After completing his studies in physics, he gained extensive experience in the fields of project planning, sales, marketing and corporate management in the fields of laser and optoelectronics, semiconductor and coating technology as well as in printed circuit board manufacturing. PARMI XCEED – Next generation 3D AOI system with superior High-Speed-Laser-Technology (HSLT) Via xNET all evaluations run in the web browser (PC & mobile). There, the component libraries are also managed centrally. Range of applications In addition to the basic inspection tasks such as, presence, offset, polarity, etc., which must be met reliably and accurately in line timing for each SMD and THT printed circuit board, the 3D laser technology offers a superior range of applications: Underfill, Conformal Coating, System-in- Package (SIP), Die, Bond Line Thickness (BLT), IGBT, solder paste, solder balls, and much more. Many manufacturers use the inspection of the manufactured PCBs in a test island. Here, the PARMI XCEED also offers a variety of options for initial sample inspection. In addition to the 3D AOI test, the system also allows 3D solder paste testing. In terms of resolution, the laser technology is clearly superior to other measuring methods and thus a future-proof investment. PROFIL PARMI Corp. Ltd. is a global leader in 3D inspection systems. These include 3D Solder Paste Inspection (SPI), 3D Automated Optical Inspection (AOI) for SMT and THT, Inspection of Conformal Coated assemblies (CCI), Semiconductor Packaging (SP), Post Wire Bond Inspection (PWBI), and Wafer Bump Inspection (WBI). PARMI‘s customers include world-leading manufacturers in the automotive, industrial, EMS, display, package & memory, medical, aerospace, military and mobile devices sectors. PARMI is headquartered in Daejeon, Korea. With more than 35 offices and representations worldwide, PARMI ensures the qualified service and support of its 3D Inspection system. In Germany and Austria GPS Technologies GmbH from Bad Vilbel near Frankfurt is the partner of PARMI and responsible for sales and service in that territory (www.gps-tec.eu). PARMI XCEED – Next generation 3D AOI system inspection of white LED on white substrate GPS Technologies GmbH Dipl.-Phys. Andreas Gerspach Theodor-Heuss-Str. 31–33 61118 Bad Vilbel, Deutschland Tel.: +49(0)6101/40600–0 Fax: +49(0)6101/40600–99 Email: info@gps-tec.eu www.gps-tec.eu
