Utilização do Eagle

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Utilização prática do programa EagleR-SILRECTIFRELAISRIBCONRIBCON4SIEMENSSMDSMD-ICSMD-SPCSOLPADSPECIALSRAMSUBD-ASUBD-BSUPPLY1SUPPLY2SWITCHTESTPADTRAFO-BTRAFO-ETRAFO-RTRANS-SMTRANS-PWTRIACTRIMPOTULNV-REGVARISTWAGO500WAGO508WIREPADWSIPSDZILOGResistor networks, SILRectifier bridgesRelaysPC board connectors4-row pc board connectorsSiemens componentsSMD packagesSMD packagesSMD packagesSoldering padsSpecial devices, transformer, fuse, lamp, etc.Static RAM’s from MotorolaSub-D connectors, 9 to 37 pinsSub-D connectors, 50 pinsSupply symbolsSupply symbolsRotary switches, toggle switchesTest areas, test pinsBLOCK transformersERA transformersRing core transformersSmall power transformersPower TransformersThyristors, triacsTrimmpotsULN ICsVoltage regulatorsSiemens varistorsWAGO clamp connectors, grid 5.00mmWAGO clamp connectors, grid 5.08mmPads for connecting wiresWSI componentsZilog componentshttps://lucinio.wixsite.com/lucinioprezaaraujo Página 29
Utilização prática do programa EagleANEXO 2 – LayersOs desenhos do Eagle contêm objectos em camadas (layers) diferentes.Predefined EAGLE LayersLayout1 Top Tracks, top side Pistas do lado de cima da placa.2 Route2 Inner layer (signal or supply)3 Route3 Inner layer (signal or supply)4 Route4 Inner layer (signal or supply)5 Route5 Inner layer (signal or supply)6 Route6 Inner layer (signal or supply)7 Route7 Inner layer (signal or supply)8 Route8 Inner layer (signal or supply)9 Route9 Inner layer (signal or supply)10 Route10 Inner layer (signal or supply)11 Route11 Inner layer (signal or supply)12 Route12 Inner layer (signal or supply)13 Route13 Inner layer (signal or supply)14 Route14 Inner layer (signal or supply)15 Route15 Inner layer (signal or supply)16 Bottom Tracks, bottom side Pistas do lado de baixo da placa.17 Pads Pads (through-hole) Ilhas para a soldagem dos componentes.18 Vias Vias (through-hole) Furo para passagem da pista para outracamada.19 Unrouted Airwires (rubberbands) Ligações não “routeadas”.20 Dimension Board outlines (circles for holes) Limites da placa e furos de fixação.21 tPlace Silk screen, top side22 bPlace Silk screen, bottom side23 tOrigins Origins, top side24 bOrigins Origins, bottom side25 tNames Service print, top side26 bNames Service print, bottom side27 tValues Component VALUE, top side28 bValues Component VALUE, bottom side29 tStop Solder stop mask, top side30 bStop Solder stop mask, bottom side31 tCream Solder cream, top side32 bCream Solder cream, bottom side33 tFinish Finish, top side34 bFinish Finish, bottom side35 tGlue Glue mask, top side36 bGlue Glue mask, bottom sideCamadas intermédias existentes em placasde circuito impresso do tipo multicamadas.https://lucinio.wixsite.com/lucinioprezaaraujo Página 30
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Utilização do Eagle

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