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EMC ESD
MEKANISK
MILJÖ
TERMISK
MILJÖ
MJUKVARA HÅRDVARA
PROVNING UTBILDNING
KEMISK
MILJÖ
Thermomechanical property
Figure 4 Interface cracks initiated at (a) top and (b) inner ends of the adhesive/component
interface, (c) bulk microcracks occurred around the knee of
the joint and (d) final merging of these cracks resulted in a complete failure
of the entire joint.
[5] M.J. Yim, Y. Li, K.S. Moon,
K.W. Paik, and C.P. Wong, J. Adhesion
Sci. Technol. 22, 1593 (2008).
[6] Ohashi, M., et al., Spherical
aluminum nitride fillers for heat-
conducting plastic packages. Journal
of the American Ceramic Society,
2005. 88(9): p. 2615-2618.
[7] Huaxiang Lai, Xiuzhen Lu,
Si Chen, Chune Fu and Johan Liu,
Labotest_1/4 ligg:Layout 1 08-12-03 13.19 Sida 1
A Novel Isotropic Conductive Adhesive
with Ag Flakes, BN and SiC
Nanoparticles 2010 International
Symposium on Anvanced Packaging
Materials, p. 49-53.
[8] Biercuk, M.J., et al., Carbon
nanotube composites for thermal
management. Applied Physics Letters,
2002. 80(15): p. 2767.
[9] Gojny, F.H., et al., Evaluation
and identification of electrical and
thermal conduction mechanisms in
carbon nanotube/epoxy composites.
Polymer, 2006. 47(6): p. 2036.
[10] Teh, L.K., Teo, M., Anto, E.,
Wong, C.C., Mhaisalkar, S.G., Teo,
P.S. and Wong, E.H. , “Moistureinduced
failures of adhesive flip
chip interconnects”, IEEETransactions
of Components and Packaging
Technologies, 2005, Vol. 28 No. 3,
pp. 506-16.
[11] Turunen, M.P.K., Marjama¨ki,
P., Paajanen, M., Lahtinen, J. and
Kivilahti, J.K., “Pull-off test in the
assessment of adhesion at printed wiring
board metallisation/epoxy
interface”, Microelectronics Reliability,
2004, Vol. 44, pp. 993-
1007.
[12] Cynthia Khoo, Johan Liu,
Maria Ågren and Thomas Hjertberg,
Proc. 1996 IEPS Conference,
Austin, Texas, 1996, pp 483-501.
LaboTest AB marknadsför och underhåller
utrustningar till lab och produktionsavdelningar
inom miljötålighet, test och värmebehandling.
LaboTest AB www.labotest.se info@labotest.se 031-748 33 20 08-35 43 60
[13] Johan Liu, Katrin Gustafsson,
Zonghe Lai and Changhai
Li, IEEE Trans. Compon. Packag.
Manuf. Technol. -A, Vol.20, No1,
pp21-30, March 1997.
[14] D. Lu, C.Wong, and Q. K.
Tong, “Mechanisms underlying
the unstable contact resistance
of conductive adhesives,” IEEE
Trans. Compon., Packag., Manufact.
Technol. C, vol. 22, no. 3, pp.
228–232, Jul. 1999.
[15] D. A. Jones, Principles and
Prevention of Corrosion, 2nd ed.
Englewood
Cliffs, NJ: Prentice-Hall, 1996.
[16] O. Rusanen, Proc. 4th International
Conference on Adhesive
Joining & Coating Technology
in Electronics Manufacturing
(Adhesives in Electronics) 2000,
Espoo, Finland, pp. 194 - 198.
Li-Lei Ye and Johan Liu
sHt-smart High tech aB,
Fysikgränd 3, 412 96,
Göteborg, sweden,
department of Microtechnology
and nanoscience (MC2)
Chalmers University of technology,
se-412 96, kemivägen 9,
Göteborg, sweden
FULLSERVICEFÖRETAG EMC
Stor halvdämpadmäthall
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www.janlinders.com 031-7443880 info@janlinders.com
10 Hitta din leverantör inom elmiljö på www.ee-guiden.se Electronic Environment #4.2010
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