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Neuromorphic Computing From Materials to Systems Architecture

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APPENDICES <br />

Acronyms <br />

3D: Three-­‐‐dimensional <br />

AER: Address Event Representation <br />

ALU: Arithmetic/Logic Unit <br />

BEOL: Back-­‐‐end-­‐‐of-­‐‐line (BEOL) <br />

CMOS: Complementary Metal Oxide Semiconduc<strong>to</strong>r <br />

CNN: Convolutional Neural Network <br />

CPU: Central Processing Unit <br />

ColdRAM: Memory organized for infrequent access patterns <br />

DNN: Deep Neural Network <br />

DMA: Logic for supporting Direct Memory Access <br />

HotRAM: Memory organized for frequent access patterns <br />

InstRAM: Instruction Memory <br />

LIF: Leaky Integrate and Fire (neuron) <br />

LTPS: Long-­‐‐Term Plasticity Synapses <br />

MLU: Machine Learning Unit, functional units optimized for ML operations <br />

MU: Memory Unit <br />

OutputRAM: Memory for holding output of operations <br />

STDP: Spike Time-­‐‐Dependent Plasticity <br />

STPS: Short-­‐‐Term Plasticity Synapses <br />

VLSI: Very Large-­‐‐Scale Integration <br />

<strong>Neuromorphic</strong> <strong>Computing</strong>: <strong>From</strong> <strong>Materials</strong> <strong>to</strong> <strong>Systems</strong> <strong>Architecture</strong> <br />

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