Ansoft Q3D Extractor

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� In a presentation given by Leah Miller of LSI Logic named “Silicon and Flip Chip Package Co-Design from a Packaging Perspective”
~~ ~~ ~~ ~~ ~~~~ ~~~~ ~~ ~~ Joe Engineer was given a package design and told to perform various simulations for it
Page 1 and 2: High-Performance High Performance P
Page 3: The Scenario � A big ASIC design
Page 7 and 8: The Tools Needed to Perform � Joe
Page 9 and 10: The Ansoft Solution: Ansoft Q2D Ext
Page 11 and 12: The Ansoft Solution: Ansoft 2D Extr
Page 13 and 14: The Ansoft Solution � Joe has com
Page 15 and 16: The Ansoft Solution: Return Path
Page 17 and 18: The Ansoft Solution: Ansoft Optimet
Page 19 and 20: The Ansoft Solution: Ansoft Optimet
Page 27 and 28: The Ansoft Solution: Ansoft TPA 4.0
Page 29 and 30: Ansoft Q3D Extractor � After the

Ansoft Q3D Extractor

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