Presentation - Accounting for High Frequency Transmission Line Loss
Presentation - Accounting for High Frequency Transmission Line Loss
Presentation - Accounting for High Frequency Transmission Line Loss
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On-chip Microstrip Simulations and<br />
Design dimensions:<br />
w=2.4um, h=3.25um, t=2.07um<br />
tanδ = 0.001 σ = 3.22E7<br />
passivation<br />
removed<br />
SiO 2<br />
ε r =4.1<br />
t<br />
w<br />
h<br />
Measured Data<br />
HFSS v9 view<br />
Measured data taken directly on<br />
a test wafer using the<br />
‘TRL’ calibration procedure<br />
to deembed the RF probe<br />
pads and extract the line<br />
characteristics.
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