Presentation - High-Speed Channel Simulation Methodology
Presentation - High-Speed Channel Simulation Methodology
Presentation - High-Speed Channel Simulation Methodology
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Slide 7<br />
With Solder Ball<br />
• Lowest Layer is Dielectric<br />
• Signal Via R=150 μ, H=70 μ<br />
• GND Pad R=100 μ, H=10 μ<br />
M&T / SI&P