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Analysis of a New Interface<br />
Adhesion Measurement Method<br />
Zhiliang Zhang<br />
www.ntnu.no\~zhiliang
Overview<br />
• Review on the testing methods<br />
• A New method?<br />
– What we have done<br />
– What we are going to do<br />
• Summary
Bulk Properties<br />
COHESIVE<br />
ELEMENTS<br />
J [N/mm]<br />
10<br />
9<br />
8<br />
7<br />
6<br />
5<br />
4<br />
3<br />
2<br />
1<br />
0<br />
Betamate 1493<br />
Betamate XD-4600<br />
0 0.5 1 1.5 2 2.5 3 3.5<br />
Crack extension [mm]<br />
J<br />
d<br />
<br />
dA<br />
<br />
<br />
<br />
wdy T<br />
i<br />
ui<br />
ds<br />
x<br />
<br />
Energy<br />
Area<br />
G
Interface Properties?<br />
<br />
initial crack<br />
undamaged zone<br />
a<br />
<br />
c<br />
<br />
cohesive zone
The T-Peel Test<br />
Adhesive fillet<br />
2.0<br />
R=2.0<br />
25<br />
0.25<br />
85
The T-Peel Test<br />
140<br />
Load (N/mm)<br />
Peel- XD 4600 adhesive<br />
120<br />
100<br />
80<br />
numerical<br />
experimental<br />
60<br />
40<br />
20<br />
displacement (mm)<br />
0<br />
0 0.5 1 1.5 2 2.5 3
Blister Test<br />
p<br />
a<br />
h<br />
G <br />
ph<br />
2
4-Point Bending Test<br />
G<br />
<br />
21<br />
4<br />
( PL)<br />
2<br />
h<br />
2<br />
(1 <br />
E<br />
2<br />
)
4-Point Bending Test<br />
Micro motor + Micrometer<br />
Load cell
A New Test Method?<br />
• Macroscopic methods available<br />
– zigzagging crack path<br />
– difficult to measure the crack length<br />
– destructive<br />
• Microscopic defect based adhesion<br />
measurement<br />
– low adhesion due to the interfacial defects<br />
– deformation pattern to adhesion characteristics
A New Method?<br />
Kay Gastinger<br />
glass<br />
measurement beam<br />
mechanical load<br />
adhesive<br />
(300-500µm)<br />
aluminium<br />
delamination<br />
Depth-resolved measurement of Low<br />
Coherence Interferometry,<br />
high-accuracy deformation measurement<br />
of Electronic Speckle Pattern<br />
Interferometry
Deformation Pattern
The Model<br />
2D Axi-symmetric model: 13600 elements, more than 50 analyses<br />
0.01 mm<br />
6 mm<br />
40 mm<br />
2A<br />
2a<br />
t<br />
20.15 mm<br />
20 mm
Materials and Cases<br />
• Glass<br />
– E=73000 MPa, v=0.23<br />
• Adhesive<br />
– E=4850 MPa, v=0.4<br />
• Aluminium<br />
– E=68000 MPa, v=0.3<br />
6 mm<br />
0.01 mm<br />
40 mm<br />
2A<br />
2a<br />
t<br />
• a varied from 0.0058 to 3 mm – 15<br />
different cases<br />
20.15 mm<br />
• A: 10, 6.853, 3 mm – 3 cases<br />
• t: 0.3, 0.5 mm – 2 cases<br />
20 mm
Deformation Pattern
Deformation Pattern<br />
0.01 mm<br />
2A<br />
2a<br />
t
Deformation Pattern<br />
Effect of adhesive thickness<br />
0.01 mm<br />
2A<br />
2a<br />
t
Adhesion Toughness?<br />
P<br />
Load / displacement P<br />
Adhesion toughness<br />
Critical<br />
value<br />
Defect size extension<br />
Defect size extension
Summary<br />
• Deformation pattern has been studied. A relation<br />
between defect opening and defect size has been<br />
established for further development of the<br />
measurement system<br />
• The Method presented has great potentials, but<br />
depends on the hardware.<br />
• Other method is also under development
Nano-mechanical Lab at NTNU<br />
• Continuous load-displacement curve<br />
• No optical interferometry needed<br />
• Non-destructive technique<br />
• AFM surface imaging<br />
• Depth sensing<br />
• ……….<br />
Nanoindenter
Nanoindentation<br />
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Nanoindentation<br />
Measuring Elastic Modulus<br />
Applied Load<br />
S = dP/dh<br />
• Elastic modulus, E, is calculated<br />
from the contact stiffness, S (the<br />
tangent to the unloading curve)<br />
• Contact area, A, is determined<br />
from the recovered displacement<br />
Depth<br />
1<br />
E<br />
r<br />
<br />
2<br />
2<br />
(1 ) (1 <br />
i<br />
)<br />
<br />
E E<br />
i<br />
<br />
E r<br />
<br />
2<br />
S<br />
A
Nanoindentation<br />
• Young’s modulus<br />
• Hardness<br />
• Stress-strain curve<br />
• Fracture toughness<br />
• Adhesion toughness<br />
• Wear/friction coefficients<br />
• Fatigue / Residual stress<br />
• Time dependent creep relaxation<br />
• Acoustic emission test<br />
• Hydrogen embrittlement<br />
Substrate
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