INTEGRATED AUDIOMETER SYSTEM (IASY) - FUSE
INTEGRATED AUDIOMETER SYSTEM (IASY) - FUSE
INTEGRATED AUDIOMETER SYSTEM (IASY) - FUSE
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
<strong>FUSE</strong> Application Experiment<br />
Dissemination / Demonstrator document<br />
Amplifon SpA<br />
<strong>INTEGRATED</strong> <strong>AUDIOMETER</strong> <strong>SYSTEM</strong> (IASY)<br />
A Full Custom Mixed ASIC allows the doubling of market share<br />
AE number: 22949<br />
New Technology: Mixed Signal ASIC<br />
Industrial Sector: Medical and Surgical Equipment and Orthopaedic Appliances (3310)<br />
Contact TTN:<br />
COREP<br />
Start date: 01/11/96<br />
Ending date: 30/04/98<br />
Duration:<br />
18 months<br />
1
COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
Abstract<br />
The company Amplifon S.p.a. with 411 employees designs implements and produces instruments for ear,<br />
nose and throat (ENT) since 1950. Its Biomedical Division (AMPLAID) with 4.5 MEUR annual turnover<br />
and 42 employees, designs and sells advanced hearing assessment equipment (audiometers) and it is also<br />
responsible of taking high level courses relating to the problems of hearing, ways to detect them and possible<br />
solutions. It. intends to integrate on a single proprietary chip all the circuits required to generate and control<br />
the audio signals in ENT instruments.<br />
The actual electronic product are PCB based, but this technology is far from being competitive on the actual<br />
market. The mixed signal ASIC (46% digital, 54% analogue) solution results in low cost of the product, it is<br />
smaller, more reliable and more difficult to copy. The market share has been increased and the<br />
microelectronics knowledge acquired will allow the company to exploit it for future projects. It will also take<br />
benefit from the training on the job and from the experience acquired in complex management.<br />
The total cost of the Application Experiment. is 150 KEUR and its duration has been 18 months. The<br />
estimated Return on Investment (ROI) is 43 times, over 4 years product life time, and the investment will be<br />
paid back in less than one year.<br />
The lesson learned is the importance of the economical, technological and managerial information in<br />
addition to the strictly technical ones. This allow to define according to the complexity of the project and to<br />
the forecasted production volumes, which are the right technology and the right approach to be used for a<br />
specific problem.<br />
Keywords and signature<br />
Keywords: Audiometer, hearing instruments, hear phones, mixed ASIC, AHDL, audio frequency filters, test<br />
vehicles, second run<br />
Signature: 5-0130 513 0132-3-3310-233-I<br />
1. Company name and address<br />
Company Name: Amplifon S.p.a.<br />
Company Address: Via Ripamonti 133, 20141 Milan, Italy<br />
Web Site:<br />
http://www.amplifon.it<br />
Contact Person: Guido Grassi<br />
Tel ++39 02 5747250<br />
Fax: ++39 02 57472349<br />
e-mail: grassi@amplifon.it<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
2. Company Size<br />
The Company has 411 employees in the whole.<br />
The Amplifon group structure is shown in the following diagram:<br />
AMPLIARE AMPLIFON AMPLAID AMPLIFON<br />
IBERICA<br />
The Research & Development division of AMPLAID (with a turnover in 1997 of 4.5 MEUR),is composed<br />
by 22 employees that take care of the production of all Amplifon’s medical equipment, designing for each of<br />
them the necessary parts such as:<br />
- sound amplifiers;<br />
- acoustic generators;<br />
- signal attenuators;<br />
- electrical stimulus generators;<br />
- CPU boards on different microprocessors.<br />
3. Company business description<br />
Amplifon S.p.A is an Italian Company created on 1950 and it is the biggest company in Europe devoted to<br />
hearing. During the first years the medical instrumentation area was carried on by Amplaid S.p.A. an<br />
affiliated company that since 1991 has become an integrated division of Amplifon S.p.A.<br />
Thanks to its 40-year experience, Amplifon is a leading organisation in research, technology, service to the<br />
medical professions and to the hearing impaired, providing solutions to auditory disorders. Its service<br />
capability is based on its distribution and assistance network of more than 200 branches and 2000 centres in<br />
Spain, through more than 500 high-qualified audiologists. Amplifon offers a complete range of services for<br />
an improved approach to hearing aid fitting. For the ENT specialist the organisation provides continuous<br />
information updating of a high scientific content.<br />
There have been two milestones in this support activity for ENT specialists, scholars and researchers: in<br />
1970 with the start of Amplaid, the line of equipment for diagnosis and investigation in ENT and in 1971<br />
with the start of the Research and Studies Centre «CRS», finalised to research into of hearing and auditory<br />
disorders. With Amplaid Amplifon offers the most advanced equipment to ENT specialists and contributes<br />
to the development of testing and investigation methods. Furthermore, its aim is to provide professionals and<br />
hospitals with essential know-how for both clinical routine and research. In 1970 Amplaid started<br />
development and production of a line of equipment for Audiometry, Impedance Audiometry and Evoked<br />
Potentials Recording. The Amplaid trademark is well-known all over the world and its products, distribuited<br />
in over 50 countries, represent the outcome of the most advanced research and the basis for progress in<br />
audiological technology. Today, the Amplaid Biomedical Line represents a complete range of systems for<br />
otology and audiology. Amplaid is heavily involved in further developments of advanced applications of<br />
Evoked Potentials and of systems for computerised and integrated management of audiological equipment.<br />
Most recent results confirming this trend are the multichannel systems for electrodiagnosis and release of<br />
software programs for audiological data handling. Together with Amplaid equipment, Amplifon offers a full<br />
range of services: form application and technical training to qualified technical assistance. From the start<br />
Amplaid’s policy has always been to develop new testing methods to improve clinical differential diagnosis<br />
of auditory disorders, co-operating intensively with the leading ENT and Audiology Clinical and Research<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
Centres in the world. Amplaid, making available high-tech user-friendly equipment, is thus contributing in<br />
disseminating world-wide innovative testing technologies.<br />
Amplifon operates according to stringent quality control systems and procedures, taking special care to<br />
ensure that all Amplaid equipment complies with international performance and safety standards.<br />
The Research and Studies Centre CRS is an independent, no-profit body, whose activities are entirely<br />
financed by Amplifon. Founded in 1971, CRS is keeping up with scientific developments and findings on<br />
hearing and auditory disorders.<br />
CSR activities have developed in various fields:<br />
• information and updating: congress, symposia, seminars and round-tables on audiology, audiological and<br />
otoneurological diagnostics, phoniatrics, ear surgery, hearing aid fitting, noise pollution;<br />
• educational programs: courses on audiometry, diagnosis of auditory disorders, impedance audiometry,<br />
vestibology, otoneurology, communication disorders, aphasia, auditory evoked potentials;<br />
• bibliographical services: one of the most comprehensive libraries with over 10000 scientific publications,<br />
open to specialist and researchers, on-line connection with international data-banks, bibliographical<br />
research.<br />
4. Company markets and competitive position at the start of the AE<br />
The current product at the beginning of the A.E. had a turnover of 4.500 KEUR.<br />
Amplifon is presently recognised as leader in the Italian market with a share of 90%. In addition it covers<br />
10% of the European market and 4% of the world market. One of the commercial goals is to consolidate its<br />
position in the world market, where the competitors are: Interacoustic, Grason Steadler (GSI), Madsen,<br />
Damplex, Maico, Beltone, Rexton, Finnigam and otherIn the following graph the company market shares are<br />
WORLD MARKET SHARE<br />
Amplaid 4%<br />
Company A 11%<br />
Company B 24%<br />
Company C 12%<br />
Company D 2%<br />
Company E 9%<br />
Company F 5%<br />
Company G 2%<br />
Company H 12%<br />
Other 19%<br />
given (the competitors are identified by symbolic letters)<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
The indicated companies are not yet selling instruments with such technology, then the present A.E. will<br />
allow the FU to have competitive advantage against them. The previous picture shows the world-wide<br />
market share and its competitors.<br />
WORLD-WIDE MARKET SHARE OF AMPLAID AND ITS COMPETITORS<br />
Being IASY a component of some of the product portfolio (Audiometer, Impedancemeter, Evoked<br />
Potential Systems and Otoemission Systems), the FU will acquire market share benefits in all the<br />
segments constituting the overall market and here below reported:<br />
TABLE 1 (Market share in percentage)<br />
Screening Industrial Clinical<br />
Share (%)<br />
TOTAL<br />
2 1 5 4<br />
Amplaid<br />
2<br />
13 11<br />
Company A<br />
Company B 3 42 24<br />
Company C 11 18 12<br />
Company D 2 2<br />
Company E 27 17 3 9<br />
Company F 22 3 3 5<br />
Company G 10 1 2 2<br />
Company H 56 13<br />
Other 18<br />
The following table shows the world-wide market at the end of 1996 (when the A. E. started).<br />
TABLE II (unit used Millions of dollars)<br />
Screening Industrial Clinical TOTAL<br />
8,4M$ 8.6M$ 21,4M$ 38,M$<br />
The following table shows the final statement for current product for 1996<br />
TABLE III (Unit used KEUR)<br />
1994 1995 1996<br />
Turnover current product 4,000 4,250 4,500<br />
Profit current product 1,800 1,900 2,000<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
The following graph shows the turnover and the profit of the current product trend as estimated at the<br />
beginning of the experiment<br />
GRAPH I (Unit used KEUR)<br />
7<br />
6<br />
5<br />
4<br />
3<br />
Turnover current product<br />
Profit current product<br />
2<br />
1<br />
0<br />
1995 1996 1997<br />
It can be stated that the new range of products built around IASY are positioned at the top of present<br />
Amplifon product range for their specifications and performance. Using a mixed IC technology Amplifon<br />
S.p.a. improved their functionality and improved the following features:<br />
• The product is smaller, more reliable, impossible to be copied and available at lower costs<br />
• Its flexibility is greatly increased providing totally innovative performances for audiometric and<br />
audiological testing<br />
• The new audiometer represents a total breakthrough providing the market with a totally digital PC<br />
based audiometer.<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
5. Product to be improved and its industrial sector<br />
The picture below shows the existing product. As can be seen the old product is based on a large PCB with<br />
several discrete components, a lot of trimmers and can include up to 5 FPGAs.<br />
The functions covered are nearly the same of the new one but with a much more cumbersome requested<br />
trimming procedure.<br />
The ASIC developed in this A.E. will be used in four families of instruments: audiometers,<br />
impedancemeters, evoked potentials systems and otoemission systems. This instruments are part of the<br />
necessary biomedical instrumentation that is used in the modern diagnosis of hearing problems and<br />
Amplifon is leader in producing them. In all these instruments, audio signals, narrow band noise, speech<br />
noise and white noise are generated. The above tasks are achieved in the currently available instruments<br />
using printed circuit boards (PCB's) based on off-the-shelf components. This approach is, of course, not<br />
optimum since the design relies on the performance of low-cost discrete components and requires continuous<br />
redesigns of the PCB's in view of the fluctuations of the IC market. Each instrument has the electronics<br />
strictly sufficient to generate the signals that are needed for the specific instrument. In other way this imply<br />
that two different instruments have two different core architecture. Consequently, when changes are needed<br />
it is necessary to modify different board in different ways. This takes to an unjustified multiplication of the<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
effort in designing task. Also different implementation attitude are to be used and different testing procedure<br />
must be used. A unique, reliable, integrated core is the best solution to be adopted since the same multifunction<br />
chip can be controlled by a microprocessor to have the chip generating the required function.<br />
Therefore, the core (the most critical part) of the system has been integrated on a single ASIC.<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
6. Description of the technical product improvements<br />
Figure below shows the final block diagram of the IASY. It implements an integrated audiometer generating<br />
several kinds of signals in the audio band useful for audiometric tests. The circuit under test is able to<br />
provide a variety of audio signals, like pure tones and various kinds of noise, and processing capabilities to<br />
modify the frequency and the amplitude of generated signals and of other external signals even through<br />
suitable modulations. The circuit integrates two independent analog processing channels for left and right<br />
ears. Noise signals are typically used as masking signals on one ear during the test of the other ear. One or<br />
more IASY circuits can be allocated in the same audiometer. The programming of all the IASY circuits can<br />
be easily done with the help of a microprocessor. The circuits mainly consists of:<br />
1. A digital section working at 40 MHz master clock frequency, interfacing with an external<br />
microprocessor through a 4 bit address bus and an 8 bits data bus. The communication with the<br />
microprocessor is regulated using two signals: a chip select (CSIASY) and a Read/write (RD) signal.<br />
This section generates two different kinds of signals:<br />
q Pure tone with variable frequency in the range 100 Hz to 20 KHz;<br />
q White noise over the frequency range 100 HZ to 16 KHz;<br />
2. An analog section which converts the generated signals into the analog domain (10bit) resolution) and<br />
processes them to give a pure tone with variable frequency in the audio band and several kinds of noise:<br />
white, pink, speech and narrow-band noise. Moreover, two identical audio channels are present<br />
performing some kind of analog processing on the generated signals and on some external signals<br />
(MIKE, TAPE and CD). The analog processing mainly consists of a volume control. Other functions are<br />
also present in each channel: attenuation level and amplitude modulation (SISI & DLI modulations) to<br />
program an external electronic attenuator and an 8 bit ADC driving an external VU-meter.<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
The IASY is supplied with a single 5V supply voltage. An external reference voltage nominally 2.5V) is<br />
used as analogue ground reference for continuos-time and switched-capacitor filters. A very high stability of<br />
external power supply is guaranteed. The chip is a mixed analogue/digital circuit. The chip is implemented<br />
in a 0.8 µm CMOS double-poly, double-metal technology and occupies 24.2 mm2 (46% digital and 54%<br />
analogue). The complexity in gate of the digital part can be estimated about 3500 equivalent gates.<br />
Thanks to the mixed analogue/digital technology some functions, now implemented with critical analogue<br />
circuits, is more comfortably achieved with digital techniques. An example is the pure tone generation that<br />
enjoys the benefits of the direct digital synthesis (DDS). Starting from a 40 MHz master clock it is possible<br />
to synthesise any frequency in the range 100 Hz-18 kHz with 1 Hz steps. This feature is at least 10 times<br />
better than commercially available instruments with similar cost.<br />
The key analogue processing functions of the IC include conditioning of the external input signals, filtering<br />
(wide-band and narrow-band) and data conversion. Fulfilling these specification is the main goal of the AE.<br />
The analogue part is necessary since the signals to be generated have to interact with the human ears which<br />
are very sensible and need an high fidelity reproduction of the frequency tones currently used in audiometric<br />
analysis. The filters used in the chip are based on the switched-capacitor technique, which allows the<br />
response of the circuit to be locked (when required) to the frequency of the generated tone.<br />
Technical Details.<br />
The IASY includes two identical analogue channels. Each of them has three analogue inputs (mike, tape,<br />
CD) which can be optionally amplified by a factor of 7. An additional amplifier with adjustable gain<br />
(Controlled Gain Amplifier, CGA) common to the three inputs must regulate the signal level to achieve at<br />
the output a 2 V pp,rms signal level. A fourth input named Talk is directly sent to the output after a suitable<br />
level regulation done by another CGA.<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
On each channel is available an 8 bit A/D converter driving an external V:U: meter. Each channel also<br />
includes two 7 bit D/A converters (Range Attenuator and Range DACs) used to control an external<br />
electronic attenuator.<br />
They generate the following output levels:<br />
• The warble function represents a frequency modulation of the selected sinewave (frequency f o ) up to<br />
f o -10% and back.<br />
The white noise generator provides noise with uniform power spectral density in the frequency range from<br />
100 Hz to 16 kHz. The noise output amplitude must be 2Vpp over 2kΩ resistive load. If the generated noise<br />
presents periodical sequences, their repetition period is assured to be longer than 5 s.<br />
The speech noise low-pass filter is a maximally-flat second-order low-pass filter with a corner frequency of 1<br />
kHz. It is needed to filter the white noise to produce a masking signal used during voice tests.<br />
To filter the pure tone and to generate the narrow-band noise two second-order band-pass filters with a<br />
centre frequency equal to f o and very high quality factor (Q) are used. The narrow-band noise presents a<br />
constant power in each frequency band. This can be achieved by placing a pink-noise filter in cascade to the<br />
white noise generator. This is a half-order (3dB/octave) low-pass filter with a corner frequency of 100 Hz. It<br />
converts the white noise to pink noise, that is with constant power per octave.<br />
Regarding the signal-to-noise ratio when the input signal selected is mike, tape or CD is at least 60 dB, when<br />
the input signal selected is the pure tone it must be at least 80 dB.<br />
When two different signals are selected on the two channels, the crosstalk between the two outputs are better<br />
than 70 dB.<br />
To reduce crosstalk between the two IASY channels, separate power and ground buses were used for each<br />
analogue channel, the common analogue section (which include D/A conversion and filtering) and the digital<br />
section.<br />
The design risk was limited because of two main advantages: the availability of a silicon foundry library<br />
with a good number of basic cells and the technical support offered by the silicon provider for the most<br />
critical design issues (mixed-system noise reduction, packaging, assembly).<br />
A substantial technical and economical improvement was achieved, but, at the same time, the final user<br />
(normally a technician with limited electronic expertise) did not urge further specific training.<br />
The main advantage that we planned to achieve with this new realization was the consistent (at least 40%<br />
size reduction (at least 40%) of the audiometer motherboard in order to fit in a smaller audiometer case.<br />
To this purpose we eliminated more than 100 discrete components and 5 FPGAs<br />
With the use of the new technology we obtained quite useful additional advantages like:<br />
‣ Manufacturing cost and test reduction: there are less components to buy and the same ones are inside<br />
different instruments. The average cost reduction on each instruments is of 90 EUR. The test cost have a<br />
reduction because there are less components to be tested.<br />
The improvement is characterised by the use of a good quantity of discrete components. The reduction<br />
on number of components augments automatically reliability and guarantees a greater flexibility on<br />
configurability of the final product.<br />
‣ Functionality improvement: from the clinical standpoint, features such as 1 Hz frequency increments<br />
and 0.25 dB intensity increments, prove outstanding in detecting cochlea pathology (recruitment) and in<br />
differential diagnosis between cochlea and retro cochlea lesions (the former indicative of VIII nervebrainstem<br />
tumours).<br />
‣ Accuracy and precision improvement : IASY permits frequency scansion till 1Hz (the old attenuators,<br />
such as the A 460 could guarantee steps of 5 Hz) with an accuracy +- 1%; and a range of attenuation<br />
from – 20 to + 125 dBHL (instead the A 460 from – 10 dBHL to + 120 dBHL) with step of 0.25 dBHL<br />
(instead the A460 step of 0.50 – 0.75 dB).<br />
‣ Maintainability enhancement:. the trend in the rather flat market of audiometry aims at products<br />
capable of exploiting the advantages of informatics/computer technologies. Success in the market also<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
implies accuracy and stability over time of all calibrations as well as consistent decrease in the time<br />
needed for repair/service, thus ensuring longer lapses of time between two successive failures (MTBF).<br />
This is achieved only through technological innovation capable of reducing the number of components<br />
used in a single instrument. Thanks to cost reduction maintainability costs are also reduced of the 20%.<br />
‣ Reduction in power consumption and in weight : the less number of components to be included<br />
reduces the size of the mother-board and therefore the space needed for it. This justify smaller and<br />
lighter case. Power consumption is as a consequence reduced, view the smaller number of components<br />
to feed.<br />
‣ Compliance improvement : less components to feed reduce radio emissions. This is due to a smaller<br />
mother-board, included with all components related to it, which reduce the neeeded space. Therefore<br />
they can be inserted in an iron box in order to influence radio emissions and reduce them.<br />
The iron box is covered by a plastic case which follows specific ergonomics request, in order to reduce<br />
the user’s wearying and giving more importance to the instruments. Last but not least is the facility of<br />
customisation of a plastic case.<br />
‣ Reduction in design cycle time: the use of IASY in the R & D of equipment targeted to auditory<br />
diagnosis greatly improves performance (number of tests made available), making also the device more<br />
flexible and easy to use. It thus helps diminish the number of dedicated models, with the advantage of<br />
generating new models by simply stripping down performances by means of software without any<br />
hardware modifications. This could mean up to 50% reduction of the design cycle time.<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
7. Choices and rationale for the selected technologies and methodologies position<br />
Selected technologies.<br />
When we considered the possible options for the technology to adopt we have taken into account the main<br />
requirements for the new product. And particularly:<br />
- Technical Benefits<br />
‣ The motherboard size reduction (at least 40%) in order to fit in a different case with the<br />
elimination of more than 100 discrete components (5 FPGAs)<br />
‣ Enhanced performance and flexibility<br />
‣ The increased reliability of the global equipment (better MTBF)<br />
‣ Modularity (same component used in more audiometers)<br />
‣ Better EMC compliance<br />
− Economic benefits:<br />
‣ Cost reduction of the motherboard<br />
‣ Reduced time to market<br />
‣ The reduced cost of testing and manufacturing phases<br />
We realised immediately that all these goals pushed toward a technology which allowed a much increased<br />
integration than the previously used one and:<br />
• Would allow to reduce the size of the board<br />
• Would allow to realise both analogue and digital functions<br />
• Would be easily interfaced to a CPU<br />
• Would reduce the time to market by decreasing the manufacturing and testing duration<br />
• Would greatly improve the system reliability<br />
We evaluated several possible alternatives:<br />
a) FPGA plus analogue discrete components.<br />
This is the currently used solution and has the already mentioned drawbacks; a possible improvement to<br />
get the requested size reduction. would have been to increase the number of the PCB layers, but this<br />
would have increased (more than 60%) the board manufacturing costs<br />
b) An hybrid solution was also considered (chip on board plus thick film technology), but it was also<br />
discarded for the following reasons<br />
♦ The cost and difficulties in providing the good dies of the FPGA components<br />
♦ The need for a laser trimming procedure of the most critical analogue<br />
components<br />
♦ The stiffness and poor modularity of the implementation<br />
An ASIC solution was present to us since the beginning of the investigation, but we had means neither to<br />
translate the requirements of our product into the features requested to the target semiconductor technology<br />
nor assess the finally obtainable performance. Moreover it appeared to us that the small requested volume<br />
(some thousands per year) would have not been compatible with an ASIC choice.<br />
But we were persuaded from the discussions with our subcontractor and the TTN since:<br />
1. A mixed signal ASIC was certainly the technology able to guarantee size reduction , analogue<br />
and digital functions implementation at the lowest cost<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
2. When dealing with small volumes (as it was the case of Amplifon product) the NRE costs should<br />
be shared on a small number of components and be all the same compatible with the final target<br />
cost.<br />
As a matter of fact it turned out that the final costs of the board with a mixed ASIC component<br />
(even considering the NRE costs) was nearly 60% of the one of the current solution mainly due<br />
to the highly reduced count of components<br />
3. The package cost which is in general the real nightmare of an ASIC component was not critical<br />
in this case because of the not large pin count and the requirements in speed and power<br />
dissipation<br />
4. Manufacturing and testing costs could be reduced of more than 30% with a significant<br />
improvement in reliability (about 10 times improvement that is the square root of the<br />
component reduction rate).<br />
On the other side it should be considered theat mixed ASIC is certainly a risky implementation and one<br />
should be very confident into the expertise of his DAS, befofore deciding to proceed with such a<br />
development.<br />
We selected a plain CMOS technology as the most suitable for a low cost realisation which did not present<br />
special requirements for speed or low voltage. The foundry was selected according to the need of availability<br />
of a rich, high performance analogue cell library including macro blocks like SC filters and data conversion<br />
elements.<br />
The chip was implemented in a 0.8 µm CMOS double-poly, double-metal technology with an area of 24.2<br />
mm2 (46% digital and 54% analogue). Package was a 68 PLCC. Power dissipation was limited to 45 mW<br />
Selected methodologies: design.<br />
The main goals to be pursued with the choice of the design tools were:<br />
♦ High design productivity to ensure time to market<br />
♦ Effective description and simulation facilities<br />
♦ Capability to handle analogue functions<br />
♦ Compatibility with selected foundry design kit<br />
It was decided to use VHDL language to describe and simulate the digital part of the ASIC as it enables to<br />
manage complex digital functions from the usual system designer without a deep knowledge of the<br />
technology features and constraints.<br />
VHDL has the further advantage to ensure the maximum of portability to the design. The logic netlist was<br />
obtained with a digital synthesis tool.<br />
For the analogue part the analogue high level description language was used (AHDL) for the most complex<br />
functions, while conventional schematic and electric simulation tools were exploited for designing the simple<br />
cells.<br />
Both digital and analogue part generated a netlist, which allowed carrying out in a semiautomatic way, the<br />
physical part of the design (i.e. floorplan, placement & routing and design verification). In such a way the<br />
most critical paths of the layout like clock distribution and power supply rings were placed manually,<br />
separating the analogue and digital power & ground so as to obtain a strong reduction of the internal chip<br />
crosstalk and noise.<br />
This should be considered a general best practice when developing complex mixed signal ASICs since the<br />
commercial automatic tools very often provide insufficient solutions for the power supply lines routing<br />
problem.<br />
All these tools are integrated in a complete design framework which assures full consistency of the design<br />
database and the matching of data format between the different tools.<br />
The cost of such framework is generally very high and the FU looked for a subcontractor that owned the<br />
framework and was experienced enough in running the tools.<br />
This is also to suggest to other FUs because the skill in using the proper design tools is a key for success in<br />
ASIC design.<br />
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With this high productivity methodology it was possible to design a first MPW in less than 5 months, with<br />
minor mistakes. A second MPW, planned in the initial work plan, as good risk reduction policy, allowed to<br />
correct the first run errors and to reach the fulfilment of all the specifications in only six months design<br />
(excluding the gaps for fabrication). This is an outstanding result with a complex mixed signal ASIC.<br />
Selected methodologies: testing.<br />
The large number of analogue functions to be implemented makes the test of the circuit of crucial<br />
importance. For the analogue section a very high fault coverage test pattern has been defined that permitted a<br />
full automatic testing of the circuit. The choice for the automatic testing came from the idea that this testing<br />
methodology could be exploited for the future testing of the produced chips. For the digital section a similar<br />
approach has been defined.<br />
8. Expertise and experience in microelectronics of the company and the staff allocated to the project.<br />
In all the products presently on the market PCB, FPGA and discrete acoustic sensor technologies are applied.<br />
From the technical point of view Amplifon lacks many important skills that are necessary to design and<br />
implement a full custom IC.<br />
Before the A.E, Mr. Guido Grassi, Dr. Proserpio and Dr. Nobile directly involved in the project, had the<br />
knowledge to develop project based on µprocessors , µcontroller, and DSPs . There were not relevant<br />
knowledge concerning ASIC, and the expected know-how increase was a further motivation for the new<br />
development.<br />
Thanks to this project the company acquired microelectronics design capabilities in medical instrumentation<br />
through on-the-job training, a step-by-step tools acquisition and continuous interactions with dynamic and<br />
qualified University departments. The main effort has been the acquisition of knowledge about this new<br />
technology and on its management. After the experiment Amplifon, by combining the acquired knowledge<br />
with the previous experience on discrete components design, has the full capability to design and to<br />
manufacture integrated audiometers using advanced technologies.<br />
Personnel Involved in the A.E.<br />
Personnel included in the A.E. is:<br />
• the responsible of the R&D division, is the manager for the entire project;<br />
• a senior engineer ,.with background has been trained different subjects of design analogue integrated<br />
circuits.<br />
• a design engineer , whose background is that of a hardware designer has been involved in several design<br />
tasks for small IC building blocks.<br />
This A.E. has of course improved their know-how of the microelectronic world, understanding its rules and<br />
its limits. At the end Amplifon personnel has reached a point in which autonomously it can carry the<br />
technological assessment for future projects.<br />
9. Workplan and rationale<br />
The following Time table shows the original Workplan, divided into 5 Workpackages.<br />
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Training (WP1)<br />
Specifications (WP2)<br />
Design 1st prototype (WP3)<br />
Integration 1st prototype (WP4)<br />
Test 1st prototype (WP5)<br />
First prototype<br />
Redesigns (WP3)<br />
Design 2nd prototype (WP3)<br />
Integration 2nd prototype (WP4)<br />
Test 2nd prototype (WP5)<br />
Second prototype<br />
Underneath the descrition of each Workplan.<br />
WP1: Training<br />
The work package leader was the Training Subcontractor. In the frame of this work package the Training<br />
Subcontractor has transfered to Amplifon (one or two engineers were devoted by Amplifon to this task) the<br />
information, the know-how and the expertise required for the transition from a discrete component design<br />
culture to an integrated circuit (IC) approach. The Training Subcontractor taught the use of the equipment,<br />
workstations (SUN Sparc Stations and PC) and software (Cadence DFII and Tanner Tools) required for<br />
education and on-job training. At the end of the A. E. Amplifon is able to start its own activity in IC design.<br />
Deliverables: D1 - Training test material.<br />
WP2: Specifications<br />
0 10 20 30 40 50 60 70 80 90<br />
Week<br />
The work package leader was Amplifon. The aim of this task was to determine the actual specifications of<br />
IASY. A detailed report on the system architecture, the functional and electrical requirements of the building<br />
blocks and the definition of the test patterns for device characterisation has been provided. The specifications<br />
take into account the constraints introduced by the monolithic fabrication technology (e. g. 5 V power supply<br />
voltage).<br />
Deliverables: D2 - Specifications.<br />
WP3: Design<br />
The work package leader was the Design Subcontractor. In this work package the IASY was designed and<br />
implemented according to the architecture defined in the WP2. Attention has been given to keep the system<br />
noise low. Careful definition of the chip floor plan is of crucial importance to avoid cross-talk between the<br />
analogue and the digital sections. In addition, test structures were included in the chip to accomplish the<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
defined test strategy. The Training Subcontractor assisted the Design Subcontractor and Amplifon in the<br />
design of the system providing some useful suggestions for the analogue architectures.<br />
Deliverables: D3 - Simulation results and a PG tape containing the layout.<br />
WP4: Production of Prototype<br />
The work package leader was Design Subcontractor. Design Subcontractor has assisted Amplifon in all the<br />
phases required for transferring of the designed chip to the Foundry, which produced 10 engineering samples<br />
of the IASY. In view of the complexity of the system two multi-product wafer runs (30 mm2 each) were<br />
necessary to achieve the final chip.<br />
In the first the inclusion of additional test structures and test points ensured complete testability and<br />
observability of the system. In particular, it was necessary to identify and eliminate inter-channel cross talk<br />
sources (these phenomena were not predictable at the simulation level).<br />
Deliverables: D4 - 10 prototypes for Run.<br />
WP5: Testing<br />
The work package leader was Amplifon. In this work package the functional characterisation of the circuit<br />
was carried out. Amplifon prepared the necessary test resources in its test system set-up. This task also<br />
includes the development of the interface board for the Device Under Test (DUT). The test has been<br />
performed on the devices produced in the WP4 according to the test strategy defined in the WP2.<br />
Deliverables: D5 - Test report.<br />
Workpackage 6 has been added during the A.E.<br />
WP 6: Dissemination<br />
The Workpackage leader was Amplifon. During the all A.E. an internal dissemination has taken<br />
place. Different meetings have been organised together with the Marketing & Commercial<br />
Responsible in order to discuss the modalities of internal dissemination both of the results and the<br />
expertise achieved during the A.E. The preparation of the Dissemination report and the Flyer has<br />
been one of the main topics discussed<br />
- At national at international level Amplifon has worked on the organisation and the planning of<br />
its participation to different meetings and exhibitions (BIAS and IST).<br />
The participation to those events was very important for the project. In this framework Amplifon<br />
intends to disseminate and discuss its experience during the A.E. in order to be an example for other<br />
European industries.<br />
The following Time table shows the all A.E, including Workpackage 6.<br />
WORKPLAN<br />
MONTH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18<br />
TRAINING<br />
SPECIFICATIONS<br />
DESIGN<br />
INTEGRATION<br />
TESTING<br />
DISSEMINATION<br />
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Both from a technical point of view and from a management point of view the division into WP<br />
demonstrated very helpful, even though once in a while the WP shows some rigidity. The company was<br />
already used in working with WP and this helped it very much. In general the amount of activities to be<br />
carried out in each work package had been previously examined and weighted.<br />
Analysis of variances<br />
No major modification has been done to the original workplan.<br />
♦ During the first audit meeting the TTN has asked to make some adjustments in the Work plan to make it<br />
more controllable. The adjustments regarded the introduction of a work package specifically devoted the<br />
management, thus showing the number of labour hours actually devoted to management, and the request<br />
to report also on the second silicon run instead of leaving it unreported. The last adjustment ended up<br />
with the introduction of two addendum at the deliverables (D3 and D5).<br />
♦ In general the amount of activities to be carried out in each workpackage has been previously examined<br />
and weighted. Some adjustments had to be made when the European Commission has asked to develop<br />
the demonstrator and flier. In order to ensure a clear schedule to this new deliverables a new<br />
Workpackage number 6 was created completely devoted to Dissemination.<br />
The F.U. is very satisfied with the accuracy maintained in following the workplan and with the way the<br />
timing of each task has been respected. This is a very difficult goal to reach with an ASIC and is certainly a<br />
consequence of the careful risk assessment made by Amplifon and its design assistance subcontractor at the<br />
start of the project<br />
This risk assessment was based on the identification of the critical pal paths in the design (mainly the<br />
analogue part), and the main strategy to reduce the risk was, beyond allocating more room for the design,<br />
to have two different MPWs, so that the first could be used for checking the most critical architectures and<br />
the second to assemble the complete system.<br />
We do believe this is one of the most important lesson to be taught other companies during the dissemination<br />
activity.<br />
More than 30% of the budget for the development was subcontracted and specifically:<br />
7% for subcontractor training, 15% for the design assistance, 13% for the ASIC fabrication.<br />
Total effort was 2 persons year; about 70% was supported by the company.<br />
The following table resumes the effort percentage spent by FU and its design assistance subcontractor in the<br />
different tasks during the full development<br />
First User<br />
Subcontractor<br />
Effort Cost (kEUR)<br />
(Person/days)<br />
Management 44<br />
Training 110 10<br />
Design 88 15<br />
Prototype 5 19<br />
Evaluation 154 2<br />
Dissemination 22<br />
Total 423 46<br />
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10 . Subcontractor information<br />
The success of the A. E. is also due to the proficient help given by the design and training subcontractor and<br />
by the foundry all along the duration of the project. Help has been given in:<br />
• Choosing the right technology and the right design flow with subsequent risk assessment<br />
• Starting a training course that helped the design of the chip<br />
• Understanding the microelecronics world, its rules and limits<br />
• Reaching a point in which an autonomous future project assessment is possible<br />
Despite the previous acquaintance, Amplifon has guaranteed itself by making internal contracts with all its<br />
sucontractors, therefore all possible risks have been duly weighted. Therefore it was previewed the<br />
possibility to make 1 or 3 run and also the possibility of failure. All parties responsabilities have been also<br />
listed as were all IPR issues.<br />
The following chapter gives information on each subcontractor.<br />
The design subcontractor<br />
For performing the design subcontractor task we selected by a small design house for the following reasons:<br />
♦ No major design house was keen to offer support to an sme like Amplifon at reasonable costs.<br />
This evaluation also included the semiconductor foundries which did not want to involve their<br />
design departments because of the low requested volume<br />
♦ The selected subcontractor is a spin-off of the most reputed Italian University for mixed ASIC<br />
design.<br />
♦ The four designers of the company have all Ph D and have designed successfully more than 20<br />
ASICs in five years (mainly analogue and mixed) for both research and industrial application.<br />
Their experience covers the design of integrated circuits for telecom application, sensor<br />
interfaces, and special data conversion systems on silicon.<br />
♦ They have a proved attitude in working with SMEs and a good acquaintance and interface with<br />
some of the most important European foundries. They have knowledge of the most advanced<br />
CMOS and BiCMOS processes.<br />
It is worth mentioning that the subcontractor demonstrated very co-operative and helpful to the first user<br />
since the time when the feasibility analysis of the project began well before the proposal submission.<br />
This means that the selection of the subcontractor preceded the preparation of the proposal and that the help<br />
of the subcontractor was crucial in obtaining and evaluating the offers from the silicon foundries and in<br />
defining the different cost voices of the project.<br />
The Foundry<br />
The Foundry is specialised on the development and production of full custom and semicustom integrated<br />
circuits. The company provides high performance CMOS and BiCMOS processes and standard cells. The<br />
Foundry's "all under one roof" strategy (research and development, design engineering, mask lithography,<br />
wafer fabrication, assembly and test) has placed the company in a strong position within the market<br />
segments telecommunication, automotive, audio and industrial electronics.<br />
The Training Subcontractor<br />
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Amplifon SpA<br />
The Training Subcontractor is a prestigious Italian University very famous for their experience in training<br />
new designers of analogue and mixed analogue/digital integrated circuits.<br />
In this University an advanced post graduate course is addressing the design of analogue and mixed ASIC<br />
circuits.<br />
The University professors of the Electronic departments are well known for their lectures in international<br />
courses and summer schools for ASIC design. Favourite research areas include telecommunication circuits<br />
(audio and video), A/D and D/A converters and, more recently, circuits for smart sensors.<br />
The knowledge of state of the art technology and design methods is documented by more than 70 papers<br />
(1989-1994) in international conferences and scientific journals. Moreover in the last five years more than 40<br />
analogue and mixed analogue/digital integrated circuits have been developed, fabricated and tested.<br />
In recent years, a new activity branch was started, aiming at the development of CAD tools and behavioural<br />
models for IC design.<br />
11. Barriers perceived by the company in the first use of the AE technology<br />
Prior to the Application Experiment, Amplifon was well aware that the introduction of integrated circuit<br />
technology was mandatory for the future of the company. On one side, it was true that the electronics of the<br />
PCB boards had allowed Amplifon to gain the market share that makes it the leader in the sector, but on the<br />
other side it is also true that shifting to a more competitive technology is the only way to keep the share and<br />
the only one to expand it anticipating the competitors.<br />
That is why Amplifon understood that microelectronics could improve products and competitiveness. The<br />
limited knowledge of microelectronic technologies has manifested itself in technology barriers that have<br />
enhanced the normal difficulties in introducing a new technology.<br />
The awareness of important obstacles in developing a new component using the ASIC technology was<br />
present to the company prior to the beginning of the experiment and, moreover, the use of a new technology<br />
put in evidence the lack of design expertise that might have affected the spec definition phase.<br />
At first it was difficult to understand how to search for information about integrated circuit technology.<br />
Technology experts and European foundries had an own technical slang difficult to understand for the<br />
company and it has been an hard job to localise a landmark for these first steps.<br />
Also to be mentioned are the financial barriers. In fact it was a general feeling for our management that any<br />
investment in research, development and training might affect the production and sales of the current<br />
products and that, combined to the perception of the high risk involved in the prevented the company to start<br />
the development on its own resources.<br />
We would have been in any case sooner or later forced to go through this innovation step, but, without<br />
<strong>FUSE</strong>, time to market would have been greatly longer and the development much more difficult for the<br />
company.<br />
12. Steps taken to overcome the barriers and arrive at an improved product<br />
What helped Amplifon was its problem solving attitude and the total absence of prejudice.<br />
In order to overcome the psychological barriers due to high risk in the new technology, Amplifon chose the<br />
right Design Assistance subcontractor and performed with him a preliminary feasibility study. This helped<br />
the correct choice of foundry, technology and design style. Note that pre-existing acquaintance with the<br />
design assistant can be very useful in the project definition phase, since he knows from its experience the<br />
potential of the technologies and its constraints.<br />
The main barrier to be overcome has been the research of a foundry willing to accept a commitment suitable<br />
to Amplifon production. The research has been carried out by Amplifon at its own cost. Interfacing the<br />
foundries might be a big problem especially concerning obtaining the technological information. That is why<br />
it is useful to have a subcontractor with a long acquaintance with the selected foundry.<br />
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Even if the relationship with the subcontractors had always been of complete collaboration, the particular<br />
application in the biomedical field of the circuit and the particular exigencies have turned out to be difficult<br />
to be explained to the chosen subcontractors. Therefore many meetings have been held in order to clarify<br />
those items both to the Foundry and the Design Subcontractor.<br />
13. Knowledge and experience acquired<br />
Thanks to the training received during the AE, we understood the paramount importance of the economical,<br />
technological and managerial information in addition to the strictly technical one.<br />
The quoted information can allow the company to decide, accordingly to the complexity of the project and to<br />
the forecast of the production volumes which is the right technology to be used and the right approach for the<br />
specific problem.<br />
The complexity of microelectronics problems is sensitively higher than the one generally faced in PCB<br />
design and that is why it is important to be able to figure out all the necessary steps before the beginning of a<br />
project.<br />
For example the work plan should be planned taking into account the schedules of the needed silicon runs<br />
made available by the selected silicon foundry. This should include the assessment of possible in the sample<br />
delivery date from the foundry and possibly in the shifting of testing and redesign work packages leading to<br />
important discrepancies with the scheduled time to market.<br />
The AE has been really formative under this point of view and improved the general knowledge of the<br />
company.<br />
Before starting, the company was sceptical about the training on the job and the need for the training offered<br />
by the Training Subcontractor because of the different language and the different background knowledge.<br />
Amplifon also feared the difficulty in transferring the information on its own needs to the subcontractors.<br />
As a conclusion we can say that the collaboration between the parts was very fruitful because the initial<br />
doubts and fears let the stage to a constant knowledge transfer which enriched both parts. This means that the<br />
Application Experiment was also of great advantage for subcontractor and not only for First User and<br />
possible Replicator. All the partners understood that the knowledge transfer is not only one-way, but it takes<br />
all the possible directions. The training touched theoretical and technical aspects of:<br />
• the technology and its limits and possibilities<br />
• analogue and digital blocks design methodologies and tools<br />
• testing and debug strategies.<br />
As far to the weight given to the different parts:<br />
• on design and testing 60%<br />
• on technology 30%<br />
• on project management 10%<br />
Most training effort was spent on design and testing since it mainly was given with an on the job training<br />
approach. 30% regarded an explanation of the selected technology and the rationale behind it and 10%<br />
concerned the management of an ASIC development (development phases and timing)<br />
We can really say that we realised our main objectives with this AE:<br />
‣ Learn how to specify a new ASIC component (including the technology choice)<br />
‣ Set up a reasonable and controllable development plan<br />
‣ Identify the most suitable development tools<br />
‣ Define the more appropriate ASIC technology<br />
At this point ASIC has become a fully manageable technology for our company<br />
14. Lessons learned<br />
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During the progress of the A.E., the Company has accumulated a wide range of experience covering,<br />
managerial, business and technical issues:<br />
♦ the gained experience demonstrates that there were no significant real barriers in introducing the<br />
new technology. The good co-operation established within FU and subcontractors has increased<br />
the trust in introducing new technologies into The FU product line.<br />
♦ The skill in managing the CAD tools for the design is an important selection criteria for<br />
choosing the right design subcontractor for an ASIC development<br />
♦ The Company has gained a great deal of confidence in dealing with the new technology and now<br />
believes that it is able to easily find the sources of information for any future development.<br />
♦ The Company will certainly have a different attitude in the future in front of innovation of its<br />
products.<br />
♦ The advanced technology chosen was the right one. It has allowed the Company to implement<br />
all the necessary improvements, and to plan for exploiting it in many of its products. The<br />
expertise gained during the A.E. will allow the Company to rely totally on its internal resources<br />
for future development projects assessment.<br />
♦ The Company believes that microelectronics and the usage of suitable design tools might<br />
provide useful solutions to a wide range of companies, especially those without specific<br />
experience in microelectronics or those just starting.<br />
♦<br />
Learning to work following a structured work plan has been of great help. The gained expertise<br />
will help in the future the right prevision of resources allocation in terms of time, man/months<br />
and budget allocation for each phase.<br />
♦ The results of this AE have demonstrated that financial barriers often hide cultural barriers. In<br />
fact the adoption of the ASIC technology is a big achievement for the company that will allow to<br />
become more flexible with respect to its customers requests and be become more and more<br />
competitive through the introduction of microelectronics into most of its products .<br />
15. Resulting product, its industrialisation and internal replication<br />
Amplifon has stipulated a contract with the foundry for the supply of production prototypes scheduled within<br />
4 months from the last MPW run and the component test procedure delivery.<br />
Tests have been repeated after product delivery also on the PC board which had to host the chip, in order to<br />
verify the correct manufacturing and testing made by the foundry. At the end an order has been placed for<br />
the first 100 components that have been already delivered and assembled on the target board at the end of<br />
last August. These ones have been tested and afterwards the final order was made for the delivery of the<br />
final production components.<br />
The first 100 pre series audiometers are distributed to Amplifon marketing forces to be presented in<br />
exhibitions and given to selected customers.<br />
As far as timing is concerned:<br />
About 6 months and a further cost of 50 KEUR were requested to get the first audiometer after the<br />
conclusion of the prototyping phase.<br />
♦ In July 1998 the first prototype board was validated successfully and the order placed for the first 100<br />
components<br />
♦ At the end of August 1998 an order was placed for 100 components to be assembled onto as many new<br />
audiometer boards<br />
♦ Delivery of first audiometers to selected customers began at the end of November 1998<br />
In the second half of 1998 we placed orders for 450 new audiometers.<br />
In the future Amplifon will exploit the acquired competence to evaluate the possibility to remake, in<br />
microelectronics technology those product that demonstrated a particular interest inside the market and<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
already belong to its range of products. During this phase the First User will still use the present<br />
subcontractor competence.<br />
Thanks to the expertise and know-how acquired through the A.E. there is on-going the development of a<br />
second ASIC component self-financed by Amplifon.<br />
From a technical point of view the choice made was the integration on the same die of the analogue circuitry<br />
for the attenuation of audio signals together with the output power amplifier. All these circuits can be<br />
directly interfaced with the IASY control signals. The development of this new chip is now at the test phase<br />
for the first prototype.<br />
The cost of the new equipment and men/hours for the assembly and testing can be evaluated in about 250<br />
kEUR.<br />
Further 100 kEUR were spent for advertising the new product line (marketing, brochures, participation in<br />
sector exhibitions) training to sales forces and distributora<br />
16. Economic impact and improvement in competitive position<br />
The forecast for a gradual descent of the prices in the future years imposed a reduction of costs to guarantee<br />
Company’s budget. Consequently the R & D had to choose innovative technologies. The design cost<br />
reduction allowed to maintain a lower selling average measure and to acquire market share and therefore<br />
better prices compared to traditional components.<br />
The gain of new markets is obtained throughout the implementation of the newly-designed IC, in all<br />
Amplifon's products making them less expensive, more modern and commercially valuable.<br />
The following table shows a cost comparison between the old product without IASY inside and the new<br />
families of products with IASY inside.<br />
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TABLE IV (Unit used KEUR)<br />
IASY INSIDE COST COST WITHOUT IASY<br />
Highly innovative Audiometer A311 0,8 1,6 Audiometer<br />
A308<br />
Clinical Diagnosis Audiometer A315 1,3 2 Clinical Diagnosis Audiometer<br />
A309<br />
Clinical Diagnosis Audiometer A319 1,7 3,1 Clinical Diagnosis Audiometer<br />
A460<br />
Cost reduction is due to the following reasons:<br />
1. A311, A315 and A319 benefits of the same audiometric mother-board, therefore there is an amortisation<br />
on 1.200 units. Instead the A308, A309 and A 460 have a dedicated mother-board and therefore the cost<br />
increases;<br />
2. A315 and A319 use the same case (and also the new impedance meters A724 and A728 which will be on<br />
the market next July), with an amortisation on almost 1.500 units.<br />
One of the main goals of the AE is an increment in internal and external sales. On the whole a bigger market<br />
share increase is foreseen. The first table illustrates the current market situation (real figures as collected at<br />
the end of the AE) while the second shows the expected future economic situation (real sales in 1997 will be<br />
only consolidated at the end of 1999)<br />
TABLE V (Unit used kEUR for the World-Wide Market and percentage for the Market share)<br />
1994<br />
KEUR<br />
1995<br />
KEUR<br />
1996<br />
KEUR<br />
AMPLAID 3.800 3.450 3.900<br />
WORLD-WIDE<br />
MARKET 86.500 88.000 94.500<br />
MARKET SHARE % 4.3 3.9 4.13<br />
TABLE VI (Unit used kEUR)<br />
1997<br />
kEUR<br />
1998<br />
kEUR<br />
1999<br />
kEUR<br />
2000<br />
kEUR<br />
AMPLAID<br />
4.650 4.550 3.650 2.950<br />
WORLD-<br />
WIDE 96.500 100.500 103.000 102.000<br />
MARKET<br />
MARKET<br />
SHARE % 4.82 4.52 3.54 2.89<br />
PROFIT 2.500 2.400 2.000 1500<br />
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The following table shows the projections for the sales figures with the improved product for three years<br />
after the introduction of the ASIC<br />
The following table shows for a reasonable lifetime the production volumes, the costs and the turnover<br />
expected for the improved and for the not improved product.<br />
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COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
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TABLE VIII (Product sold per year are indicated unit per year; and the second group of columns the<br />
unit used is KEUR)<br />
Products sold per year<br />
(unit/year)<br />
Costs<br />
(kEUR<br />
Turnover<br />
(kEUR)<br />
Profit<br />
(kEUR)<br />
NOT IMPR. IMPR. TOT.<br />
1997 1.970 0 2.150 4.650 2.500<br />
1998 1.600 600 2..200 2.950 5.600 2.650<br />
1999 1500 1400 2.900 3.450 7.650 4.200<br />
2000 0 3500 3.500 4.100 10.550 6.450<br />
We can represent it in graphical form:<br />
GRAPH II (Unit used kEUR)<br />
kEUR<br />
12000<br />
10000<br />
8000<br />
6000<br />
Turnover Old Prduct<br />
Turnover New Product<br />
4000<br />
2000<br />
0<br />
1998 1999 2000<br />
26
COREP TTN: <strong>FUSE</strong> Application Experiment No. 22949<br />
Amplifon SpA<br />
Economic surveys have been carefully carried on and the results show that the market responds roughly in<br />
agreement with the estimation made at the time of the preparation of the proposal. The product has been put<br />
on the market as expected and there are no significant difference between the foreseen costs of the product<br />
and the actual one.<br />
The advantages in fact are quite clear to our customers<br />
‣ Increased portability (the most requested model can be driven by a portable PC)<br />
‣ Much increased performance and features (more measurements can be carried out with higher precision)<br />
‣ Very reasonable cost (compared to the old PCB products)<br />
17. Investment and Return on investment (ROI)<br />
The estimated cumulated profit increase, in the 4 years expected life, results 6.400 kEUR. This corresponds<br />
to an estimate of ROI of 43 times the <strong>FUSE</strong> funding. The payback period, with the same amount, is expected<br />
less than 1 year.<br />
Considering that a total investment was sustained for the industrialisation of about 550 kECU<br />
Which reduces the ROI to 12 times and increases the payback period to 15 months.<br />
18. Target audience for dissemination throughout Europe.<br />
The target audience for the present AE is wide and can be identified in the following points:<br />
• all the company competitors that are still working with PCB solutions;<br />
• all the company which are working with PCB technology and are willing to shit to an higher level of<br />
integration but believe that the step might be too difficult;<br />
• all the companies that need an integration solution not to loose market shares and need to be reassured<br />
about the success rate of an ASIC solution;<br />
• all the company that may save money by integrating the devices.<br />
The most interesting industrial sectors are certainly the one of the biomedical instruments(3310), the one of<br />
the precision measurement instruments (3320), the process control system manufacturers (3330). Another<br />
sector to target might be the one of the musical instruments where the Direct Digital Synthesis Technique<br />
(DDS) can prove to be very effective especially when applied with ASIC technology.<br />
Moreover a possible target for replication is constituted by all the European Companies that are facing the<br />
problem of implementing an existing product with a new technology in other to keep the market share. From<br />
this dissemination document it can be seen that with a careful and realistic planning, with the help of a<br />
competent subcontractor, and a good training on the job, a microelectronics project can be took to end with<br />
very good results and with good perspective for the future.<br />
It is also important to underline that there is an on-going communication plan to present all the products that<br />
have the IASY inside.<br />
This product has been selected from the TTN network to represent the <strong>FUSE</strong> project in the IST (Information<br />
Society Technology) exhibition to be held in Vienna on 2-3 December 1998.<br />
An audiometer embedding the IASY component and interfaced to a notebook was exhibited in the <strong>FUSE</strong><br />
both.<br />
The same audiometer was exhibited in the <strong>FUSE</strong> both. In the BIAS fair held in Milan on 24-28 November<br />
1998.<br />
Several communications were submitted on the IASY subject of which the most important is the paper at the<br />
1998 IEEE -ISSCC (International Solid State Circuit Conference) in San Francisco in last February.<br />
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