opnext - Terena
opnext - Terena
opnext - Terena
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• Incorporates >20 years of laser • SONET/SDH Systems for<br />
design expertise<br />
very short-reach, intermediate reach<br />
• Monolithically Integreated Laser and long reach<br />
Modulator (ILM)<br />
• Metropolitan and access systems<br />
• Operate at 1.55 um wavelength • DWDM transmission<br />
MSA compliant<br />
• Wavelength monitor as an option<br />
Selected C-band or L-band<br />
wavelengths of ITU grid available<br />
• 14-pin butterfly (2.5Gb/s) and 7-pin<br />
butterfly (10Gb/s)<br />
<strong>opnext</strong><br />
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HITACHI<br />
Opnext is pioneering the design and manufacture of<br />
optical engines, which light the world’s fiber optic systems<br />
and address a diverse range of markets including<br />
the telecommunications, data communications,<br />
storage, industrial and consumer communication markets.<br />
Opnext was formed in September 2000, and<br />
derives its component technology, manufacturing<br />
capability and expertise from Hitachi’s thirty year history<br />
of pioneering fiber optic communications. From<br />
Hitachi, Opnext maintains a long history of industry<br />
firsts such as, having been the first to develop a<br />
semiconductor laser for undersea fiber cable transmission<br />
and the first to demonstrate a fully functional<br />
40Gbit/s transmitter and receiver.<br />
Technology<br />
Opnext’s optical engines are the core of an extensive<br />
portfolio of active optical components, lasers, transceivers,<br />
transponders, and subsystems for applications<br />
throughout the network. Opnext leverages its<br />
active optical devices to provide higher levels of integration<br />
in modules and subsystems, creating valueadded<br />
solutions for its customers. With over 350<br />
patents in the area of device design, laser manufacturing,<br />
packaging, and module design, Opnext continues<br />
to make technology strides. Opnext is active in<br />
driving and contributing to leading standards and<br />
MSA efforts such as 300-Pin transceivers, XENPAK,<br />
X2, and XFP.<br />
Services<br />
A key trend in the industry is to drive significant cost<br />
and power reduction in systems while achieving the<br />
performance and reliability needed for today’s highcapacity<br />
networks. Opnext develops core laser and<br />
photo detector device technologies, as well as, the<br />
optical packaging platforms needed to meet industry<br />
MSA standards. By combining leadership in core optical<br />
technologies and integrated optical chip composition<br />
with comprehensive engineering resources in<br />
packaging, manufacturing and subsystem design,<br />
Opnext is able to offer significant cost reductions to<br />
customers.<br />
Application engineers at Opnext work hand-in-hand<br />
with customers, tailoring products to desired specifications.<br />
Opnext prides itself on unparalleled service<br />
to all of it customers, industry giants and newcomers<br />
alike. In 2001, Opnext was recognized by Cisco<br />
Systems with its "Technology Supplier of the Year"<br />
award. In 2002 and 2003, Opnext was honored with<br />
the "Premier Optical Component Supplier" award<br />
from CIENA Corporation.<br />
Research and Development<br />
Opnext continues to expand its existing product line<br />
with the development of next generation products.<br />
The company maintains a world-class research team<br />
in Totsuka, Japan and continues to work with the<br />
famed engineers of Hitachi's Central Research<br />
Laboratory (CRL). Opnext also has access to<br />
Hitachi's Mechanical Engineering Research<br />
Laboratory (MERL) and Production Engineering<br />
Research Laboratory (PERL). Access to Hitachi's<br />
intellectual property provides Opnext with a unique<br />
advantage in developing high-end products without<br />
the associated costs.<br />
10 Gb/s & 2.5 Gb/s Laser Diode Modules<br />
• SONET/SDH Systems for<br />
• Incorporates >20 years of laser<br />
very short-reach,<br />
design expertise<br />
intermediate reach and long<br />
• Monolithically Integreated Laser<br />
reach<br />
Modulator (ILM)<br />
• Metropolitan and access<br />
• Operate at 1.55 um wavelength<br />
systems<br />
MSA compliant<br />
• DWDM transmission<br />
• Wavelength monitor as an option<br />
Selected C-band or L-band<br />
wavelengths of ITU grid available<br />
• 14-pin butterfly (2.5Gb/s) and 7-pin<br />
butterfly (10Gb/s)<br />
10 Gb/s & 2.5 Gb/s Transmitter, Receiver,<br />
& Transceiver Modules<br />
LONG HAUL NETWORK<br />
METRO WDM REGIONAL NETWORK<br />
For a guide to<br />
colors used<br />
throughout this<br />
catalog, please<br />
see the color<br />
key on page<br />
14<br />
2.5Gb/s & Low-Speed Small Form Factor Transceivers<br />
• Compliant with Small Form Factor • SONET / SDH from 155Mbit/s<br />
Pluggable MSA Spec. (Sept. 2000) to 2.5Gbit/s (OC-48, OC-12,<br />
• Compact Size (13.3 x 49.8 x 9.8 mm OC-3 and STM-16, STM-4,STM-1)<br />
/ 0.52 x 1.95 x 0.39") with Industry • GbE (GbE-SX, GbE-LX, GbE-EX<br />
Standard Duplex LC Connector and GbE-ZX)<br />
• Compliant with Industry Standard • FC (1GFC and 2GFC)<br />
RFT Electrical Connector and Cage • Transmission distances from<br />
• Single + 3.3V Power Supply and 500m to 80km<br />
TTL Logic Interface<br />
• Metropolitan and access<br />
• Low Power Consumption<br />
systems<br />
• Enhanced Monitoring Functionality • IP routers and ATM core<br />
(Digital Diagnostics) per SFF-8472 switches<br />
available<br />
• Wide Operating Temperature<br />
Ranges(-40 C to +85 C) available<br />
XENPAK Modules<br />
Features:<br />
• 1.3 DM DFB<br />
• XENPAX MSA compliant<br />
• IEEE 802.3ae compliant<br />
• MDIO management<br />
• 4-wide electrical interface<br />
• Hot Z-pluggable<br />
Applications:<br />
• Metropolitan Area Network<br />
• Premise<br />
- campus<br />
- vertical riser<br />
• Transport client side<br />
• Equipment interconnects