SMT Packaging.ppt [Read-Only] - Laocsmta.org

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Assembly• Higher lead count packages• Finer pitch increases placementand rotation accuracy• Thermal Pads complicate repairrework (RR)• Spacing is tighter makinginspection and RR harder• Lead-Free hi temperatures
Summary• Evolution is constant change• Package evolution will continue• Lots of new high densitysolutions will appear• Key is whether they are wellthought out to be practical andcost effective in new products
Page 1: SMT PackagingOC SMTA 9/16/04
Page 4 and 5: Package Trends
Page 6 and 7: BGA Packages• Ceramic first devel
Page 8 and 9: MLF Packages
Page 10 and 11: Wafer Level Packaging
Page 12 and 13: Stacked Packages
Page 14 and 15: Other Expanding Lines• QFN• LCN
Page 16 and 17: Chip Components• Standard Fillets
Page 18 and 19: Chip Components• Filletless Lands
Page 20 and 21: SON, PowerSOP• Add heat tabs
Page 22 and 23: SOT, SSOT Packages• Traditional 3
Page 24 and 25: LGA Package
Page 26 and 27: Flip Chip
Page 28 and 29: RF Packages
Page 30 and 31: RF Packages
Page 32 and 33: Land Pattern Trends• Shorter toe
Page 34 and 35: New Design Demands• Placement is

SMT Packaging.ppt [Read-Only] - Laocsmta.org

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