Freescale PowerPoint Template - Richardson RFPD

Freescale: A History of RF FIRSTS…‣ First in RF power LDMOS‣ First to develop industry standards in packaging – ceramic and plastic‣ First in high voltage IC‣ First to support hundreds of years MTTF‣ First high power discrete with integrated die matching‣ First to offer manufacturing in standard, high-volume CMOS fabs‣ First to install ESD protection on RF devices‣ First with on-Line production test data availability‣ First with complete and accurate ADS MET modeling characterization‣ First with a 500 MHz, 1 KW CW 50V LDMOS device, the MRF6VP41KHR1‣ First with a High VSWR capable device, 65:1 VSWR, the MRFE6VP6300HR1‣ First to brand high power RF – Airfast‣ First with an over-molded package in standard air cavity footprints‣ OM780, OM880, OM1230‣ Many more First’s to come…….TM22Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, ColdFire+, C-Ware, the Energy Efficient Solutions logo, Kinetis, mobileGT, PEG, PowerQUICC,Processor Expert, QorIQ, Qorivva, StarCore, Symphony and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, CoreNet,Flexis, Layerscape, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, Tower, TurboLink, Vybrid andXtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2013 Freescale Semiconductor, Inc.