Gesamtkatalog 2016-2

A P Products 

Product Overview 

2016

A P Products 

About A P Products... 

Since A P Products has first joined the market in 1967 with the IC-Testclip it has developed into a preferred manufacturer 

of proprietary, high performance electronic interconnect products, products that provide cost-effective solutions to the 

electronic and mechanical challenges posed by ever-increasing signal frequencies and decreasing component sizes. 

A P Products has earned a reputation for its responsiveness and creativity in solving unusual interconnect problems 

concerning e.g. packaging specifications. 

Initially known as A P Incorporated, and steadily growing for nearly 20 years, Associated Enterprises has taken products 

to market through its subsidiary companies known as A P Products Inc., APTronics, Chabin, Symbex, 4C and A P 

Products GmbH. The task of A P Products GmbH as an international sales organization was to handle the assembly and 

sales functions, while research and development was centralized and provided by Associated Enterprises. Component 

level manufacturing was performed by a Division of Associated Enterprises, known as Omnitec. 

In 1986 A P Products GmbH became a separate company, but the relationship to Associated Enterprises is still close. 

Cooperation on projects and resource-sharing is most common; nevertheless manufacturing now is also part of A P 

Products GmbH functions. 

At over 650 m² stock and a team of about 20 co-workers, our dedication to excellence, flexibility and responsiveness 

ensures a short lead time and products made to customer specification. A P Products GmbH is always trying to provide 

the customers with on-time delivery of competitive standard products as well as innovative, high-quality and cost-effective 

solutions to unique interconnection problems. 

Group Brand names 

A P Products GmbH, Bäumlesweg 21, D-71093 Weil im Schönbuch, Germany 

Tel.: +49-7157-5348-0, Fax: +49-7157-5348-39, Web: www.ap-products.de, E-mail: info@ap-products.de

LINECARD 

A P Products 

Male Header with Square Pins 

A P Products offers a wide range of either custom made or standard male headers. 

The wide assortment of standard male headers include single, double and triple 

row, straight and right angle, gold and solder plating in various pin lengths with 

up to 36 pins per row . 

 

 

2,54 mm / 2,00 mm / 1,27 mm / 1,00 mm pitch 

Straight / Right Angle / SMD / Board Stack versions 

Female Header for Square Pins 

The wide standard assortment of female headers include single, double and triple 

row female headers with up to 36 pins per row which can easily be cut down to 

any desired length. 

 

 

A variety of gold and tin platings available 

Mate with industry standard connectors or headers with contacts spaced on 2,54mm 

Male Header with Machined Pins 

In addition to male headers A P Products has a line of high quality headers 

with machined pins. Standard and custom pin headers can be delivered. 

 

 

 

2,54 mm / 2,00 mm / 1,27 mm pitch 

Straight / Right Angle / SMD versions 

Custom configurations welcome 

Female Headers and IC Sockets with Machined Pins 

A P Products offers a variaty of female contacts, female headers and DIP, SIP, 

PGA and BGA sockets. Through hole as well as SMD versions are available. 

 

 

 

2,54 mm / 2,00 mm / 1,27 mm pitch 

Straight / Right Angle / SMD versions 

Custom configurations welcome 

Contact Pins 

0,635 mm (0,25") square pins 

8 mm to 80 mm length 

Loose pins / "endless" / bandoliered 

Choice of platings available 

Custom versions available 



LINECARD 

A P Products 

Meritec High Performance Interconnect 

High performance connectors and cables for board to board or System to System 

interconnects. 

 

 

 

Different cable and connector styles are available 

Custom configurations are welcome 

100% factory tested 

VPX Interconnect 

The VPX cabling system is the industry’s first direct cabling system for the VPX 

architecture. Compliant to the latest VITA 46 specifications, the cabling system 

can be used for IO to bulkhead connectors, slot-to-slot connections, and out-ofband 

communication. The cabling solution can also be used for system 

development. The direct cabling system also has front-plug versions, which allow 

testing across the backplane or full interconnect path. 

Meritec's Hercules Interconnect System, the product of choice for the VITA 76.0 

Standard, has been voted out of the Working Group committee with a 

new connector standard. 

Packaged within a rugged military quality shell-work, Hercules has been industry 

proven over the past five years in countless commercial and military applications 

as a rugged high bandwidth copper interconnect. 

 

 

 

Molded-On Cable 

Molded-On cable assemblies are suited for board to board interconnects. As a 

result of the "Molded-On" technology cable and contacts are one piece and 

therefore inseparable. There are no individual components to become apart. 

Different cable and connector styles available 

Custom configurations are welcome 

100% factory tested 



A P Products 

Datasheets 

Table of Contents 

Section 1 

2,54 mm pitch connectors 

Section 2 


Section 3 


Section 4 

1,27 mm pitch connectors with machined pins 

Section 5 

Meritec High Performance Cables and Connectors 

Section 6 

Joy Signal High Performance Cables and Connectors 

Section 7 

Elastomeric Interconnect 

A P Products GmbH, Bäumlesweg 21 – 23, 71093 Weil im Schönbuch, Germany 

Tel: +49-7157-5348-0, Fax: +49-7157-5348-39, Web: www.ap-products.de, E-mail: info@ap-products.de

A P Products 

2,54 mm Male Headers 

Physical 

Insulation 

Standard Temperature 

Material: Glass filled Polyester (PBT) 

Flammability: UL 94 V-0 

Color: Black 

High Temperature 

Material: High performance Polyester (PCT) 


Color: Black 

Contact 

Material: 

Straight Pin Strip Headers 

• 1 – 36 contacts on one row, 

2 – 72 contacts on two rows 

3 – 108 Contacts on three rows 

• Straight or right angle 

• Gold, tin/lead or tin plating 

• Standard or high temperature body 

• Solder standoffs facilitate production wave soldering 

• Optional board retention feature 

• Custom versions available 

Copper Alloy 

Series 093P 

, 

Plating Options 

0,25µm Gold (all over) 

Underplating: 

Interface Area: 

Solder Tails: 

0,76µm Gold (Selective) 

Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 

Current Rating: 

Insulation Resistance: 

Withstanding Voltage: 

1,27µm (50µ") Ni 

0,25µm (10µ") AuCo 0,2 minimum 


1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 

1500 V DC at sea level 

Environmental 

Temperature Rating: -40°C to +105°C (Standard Temp erature) 

-40°C to +230°C (High Temperature) 



A P Products 


Series 093P 

3,30 mm 

3,30 mm 

2,54 mm 

2,54 mm 

2,40 mm 

(Typ,) 

2,40 mm 

(Typ,) 

2,54 mm 

7,70 mm 

2,54 mm 

7,70 mm 

B 

B 

Ordering Information 

9x9xxx-xx-xx-xx 

Product Option: 1 Row Plating Options: Contact Quantity per Row Plating Suffix 

2 = Standard Product 800 = Solder Plating 1 to 36 none = Standard Product 

without Kinked Tail 805 = Selective Gold / Solder plating 10 = 0,25 µm sel. Au Plating 

805 = all over Gold plating SnPb30 Solder Tails 

R = Standard Product 15 = 0,25 µm sel. Au Plating 

with Kinked Tail as 2 Row Plating Options: Pin Length Identifier with Sn100 Solder Tails 

Board Retention Feature 810 = Solder Plating Please see table below 20 = 0,50 µm sel. Au Plating 

815 = Selective Gold / Solder plating SnPb30 Solder Tails 

3 = High Temperature Product 815 = all over Gold plating 25 = 0,76 µm sel. Au Plating 

without Kinked Tail 

with Sn100 Solder Tails 

3 Row Plating Options: 30 = 0,76 µm sel. Au Plating 

K = High Temperature Product = Solder Plating SnPb30 Solder Tails 

with Kinked Tail as = Selective Gold / Solder plating 35 = 0,76 µm sel. Au Plating 

Board Retention Feature = all over Gold plating Sn100 Solder Tails 

50 = Sn100 Solder Plating 

Pin Length Identifier Table: 

Indicator Dimension 

A (Ref.) 

Dimension 

B (Solder Tail) 

Dimension 

Interface 

01 7,70 mm 2,76 mm 2,40 mm 

02 8,10 mm 3,16 mm 2,40 mm 

Engineering Note: 

The information presented in this 

datasheet is accurate to the best of 

our knowledge. 

Due to ongoing efforts to advance 

design and material performance, 

this information is subject to change 

without notice. 


Tel: +49-7157-5348-0, Fax: +49-7157-5348-39, Web: www.ap-products.de, E-mail: info@ap-products.de 

28/09/2012 15.10.00

A P Products 

2,54 mm Female Headers 

Physical 

Straight Boardmount Sockets 

• 1 – 36 contacts in one row 

• Tuning fork contact design 

• Gold, tin/lead or pure tin plating 





Insulation 




Color: Black 


Material: High Temperature Nylon 


Color: Black 

Contact 

Material: 

Copper Alloy 

Series 093P 


0,25µm- Gold (Selective) 

Underplating: 

Wiping Area: 

Solder Tails: 


Underplating: 

Wiping Area: 

Solder Tails: 

Electrical 

Tin Lead 

Underplating: 

Wiping Area: 

Solder Tails: 

Tin (Lead free) 

Underplating: 

Wiping Area: 

Solder Tails: 




1,27µm (50µ") Ni 

0,25µm (10µ") Au 

0,25 Sn100 (matt finish) (alternat. SnPb) 

1,27µm (50µ") Ni 

0,76µm (30µ") Au 

2,54µm (100µ") Sn100 matt finish (alternat. SnPb) 

1,27µm (50µ") Ni 

2,54µm (100µ") SnPb 

2,54µm (100µ") SnPb 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 (matt finish) 

2,54µm (100µ") Sn100 (matt finish) 

1 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 





A P Products 


Series 093P 


9x9xxx-01-xx-xx 

Product Option: 1 Row Plating options: Contact Quantity perRow Plating Suffix 

2 = Standard Product 870 = Selective Gold / Solder plating 1 to 36 none = full SnPb solder plating 

without Kinked Tail 984 = Solder plating all over 10 = min 0,25 µm Au Plating 

with SnPb Solder Tails 


with Kinked Tail as 


Board Retention Feature 30 = min 0,76 µm Au Plating 

with SnPb Solder Tails 

3 = High Temperature Product 35 = 0,76 µm Sel. Au Plating 

K = 


High Temperature Product 


Board Retention Feature 













28/09/2012 15.04.00

A P Products 


Series 093L 






• High temperature body 




Physical 

Insulation 


Material: Liquid Crystal Polymer (LCP) 


Color: Black 

Contact 

Material: 

Copper Alloy 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




Environmental 

Temperature Rating: 

1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


-40°C to +230°C 



A P Products GmbH 


Series 093L 

5,0 mm 

2,5 mm 

2,40 mm 

2,5 mm 2,5 mm 

A 

B 




3 = High Temperature Product 800 = Solder Plating 1 to 36 none = Standard Product 



K = High Temperature Product 15 = 0,25 µm sel. Au Plating 




815 = all over Gold plating 25 = 0,76 µm sel. Au Plating 


30 = 0,76 µm sel. Au Plating 

SnPb30 Solder Tails 


Sn100 Solder Tails 




A (Ref.) 

Dimension 


Dimension 

Interface 

01 7,70 mm 2,80 mm 2,40 mm 

02 8,10 mm 3,20 mm 2,40 mm 











28/09/2012 15.09.00

A P Products 


Physical 

Insulation 




Color: Black 




Color: Black 

Contact 

Material: 











Copper Alloy 

Series 235P 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 





A P Products 


Series 235P 

3,30mm 

5,84mm 

2,54mm 

2,54mm 

6 mm 

(Typ.) 

6 mm 

[Typ.] 

2,54mm 

A 

2,54mm 

A 

B 

B 




2 = Standard Product 647 = all over Gold plating 1 to 36 none = Standard Product 


834 = Solder Plating SnPb30 Solder Tails 



Board Retention Feature 665 = all over Gold plating Please see table below 20 = 0,50 µm sel. Au Plating 


3 = High Temperature Product 836 = Solder Plating 25 = 0,76 µm sel. Au Plating 




K = High Temperature Product = all over Gold plating SnPb30 Solder Tails 


Board Retention Feature = Solder Plating Sn100 Solder Tails 




A (Ref.) 

Dimension 


Dimension 

Interface 

01 11,30 mm 2,76 mm 6,00 mm 

09 12,20 mm 3,66 mm 6,00 mm 

10 12,95 mm 4,41 mm 6,00 mm 

02 13,84 mm 5,30 mm 6,00 mm 

08 16,38 mm 7,84 mm 6,00 mm 

03 18,92 mm 10,38 mm 6,00 mm 

04 21,50 mm 12,96 mm 6,00 mm 

05 24,00 mm 15,46 mm 6,00 mm 

12 24,50 mm 15,96 mm 6,00 mm 

06 26,54 mm 18,00 mm 6,00 mm 

07 31,62 mm 23,08 mm 6,00 mm 

11 34,30 mm 25,76 mm 6,00 mm 











28/09/2012 15.10.00

A P Products 


Series 235LC 




• Straight 

• Gold or tin plating 

• high temperature body 


Physical 

Insulation 


Material: High Temperature Plastic 


Color: Black 

Contact 

Material: 


Flash Gold (all over) 

Copper Alloy 

Underplating: 1,27µm (50µ") Ni 

Interface Area: Flash AuCo 0,2 

Solder Tails: Flash AuCo 0,2 


Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

1,27µm (50µ") Ni 



1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

Electrical 




Environmental 


2,5 A 

> 5 x 10 9 Ω at 500V DC 


-40°C to +150°C 



A P Products 


Series 235LC 

5,08 mm 

2,54 mm 

2,54 mm 

6 mm 

(Typ.) 

A 

B 

5,08 mm 2,54 mm 


937xxx-xx-xx-xx 


3 = High Temperature Product 834 = all over Tin plating 1 to 40 05 = Flash Gold Plating 

without Kinked Tail 647 = all over Gold plating 10 = 0,25µm Gold Plating 


2 Row Plating Options: Pin Length Identifier 

836 = all over Tin plating Please see table below 

665 = all over Gold plating 



A (Ref.) 

Dimension 


Dimension 

Interface 

01 11,30 mm 2,79 mm 6,00 mm 

09 12,19 mm 3,68 mm 6,00 mm 











02/12/2014 14.04.00

A P Products 


Series 235L 










Physical 

Insulation 




Color: Black 

Contact 

Material: 

Copper Alloy 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




Environmental 


1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


-40°C to +230°C 



A P Products 


Series 235L 

5,00 mm 

2,50 mm 

6 mm 

(Typ.) 

2,50 mm 

2,50 mm 

A 

B 




3 = High Temperature Product 647 = all over Gold plating 1 to 36 none = Standard Product 


834 = Solder Plating SnPb30 Solder Tails 



Board Retention Feature 665 = all over Gold plating Please see table below 20 = 0,50 µm sel. Au Plating 


836 = Solder Plating 25 = 0,76 µm sel. Au Plating 









A (Ref.) 

Dimension 


Dimension 

Interface 

01 11,30 mm 2,80 mm 6,00 mm 

09 12,20 mm 3,70 mm 6,00 mm 

10 12,95 mm 4,45 mm 6,00 mm 

02 13,84 mm 5,34 mm 6,00 mm 

08 16,38 mm 7,88 mm 6,00 mm 

03 18,92 mm 10,42 mm 6,00 mm 

04 21,50 mm 13,00 mm 6,00 mm 

05 24,00 mm 15,50 mm 6,00 mm 

12 24,50 mm 16,00 mm 6,00 mm 

06 26,54 mm 18,04 mm 6,00 mm 

07 31,62 mm 23,12 mm 6,00 mm 

11 34,30 mm 25,80 mm 6,00 mm 











28/09/2012 15.10.00

A P Products 


Physical 

Insulation 




Color: Black 




Color: Black 

Contact 

Material: 

Right Angle Pin Strip Headers 










Copper Alloy 

Series 235P 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 





A P Products 

6 mm 

(Typ.) 


Series 235P 

6 mm 

[Typ.] 

D 

3,30 mm 

D 

5,84 

B 

B 

0,25 mm 

C 

0,25 mm 

C 



















Pin Length Identifier Table (1 Row): 


B 

(Solder Tail) 

Dimension 

C 

(Bend) 

Dimension 

D 

(Distance to Board) 

Dimension 

Interface 

01 2,82 mm 1,8 mm 1,94 mm 6,00 mm 

10 3,72 mm 1,8 mm 1,94 mm 6,00 mm 

11 4,60 mm 1,8 mm 1,94 mm 6,00 mm 

02 10,22 mm 1,8 mm 1,94 mm 6,00 mm 

03 15,32 mm 1,8 mm 1,94 mm 6,00 mm 

04 5,78 mm 4,34 mm 1,94 mm 6,00 mm 

12 6,58 mm 4,34 mm 1,94 mm 6,00 mm 

13 7,38 mm 4,34 mm 1,94 mm 6,00 mm 

07 8,08 mm 4,34 mm 1,94 mm 6,00 mm 

05 13,18 mm 4,34 mm 1,94 mm 6,00 mm 

08 15,78 mm 4,34 mm 1,94 mm 6,00 mm 

06 18,28 mm 4,34 mm 1,94 mm 6,00 mm 

09 20,88 mm 4,34 mm 1,94 mm 6,00 mm 



B 

(Solder Tail) 

Dimension 

C 

(Bend) 

Dimension 

D 


Dimension 

Interface 

01 2,82 mm 1,8 mm 1,94 mm 6,00 mm 

04 3,72 mm 1,8 mm 1,94 mm 6,00 mm 

05 4,60 mm 1,8 mm 1,94 mm 6,00 mm 

02 10,22 mm 1,8 mm 1,94 mm 6,00 mm 

03 15,32 mm 1,8 mm 1,94 mm 6,00 mm 











28/09/2012 15.12.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Contact 

Material: 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 










Copper Alloy 

1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

Current Rating: 2,5A 

Insulation Resistance: > 5 x 10 9 Ω at 500V DC 

Withstanding Voltage: 1500V DC at sea level 

Series 235L 

Environmental 


-40°C to +230°C 



A P Products 


Series 235L 

6 mm 

(Typ.) 

6 mm 

(Typ.) 

D 

2,50 mm 

D 

5,00 mm 

B 

B 

C 

C 




















B 

(Solder Tail) 

Dimension 

C 

(Bend) 

Dimension 

D 


Dimension 

Interface 

01 2,84 mm 1,80 mm 1,20 mm 6,00 mm 

10 3,60 mm 1,80 mm 1,20 mm 6,00 mm 

11 4,50 mm 1,80 mm 1,20 mm 6,00 mm 

02 10,50 mm 1,80 mm 1,20 mm 6,00 mm 

03 15,54 mm 1,80 mm 1,20 mm 6,00 mm 

04 5,76 mm 4,34 mm 1,20 mm 6,00 mm 

12 6,56 mm 4,34 mm 1,20 mm 6,00 mm 

13 7,36 mm 4,34 mm 1,20 mm 6,00 mm 

07 8,13 mm 4,34 mm 1,20 mm 6,00 mm 

05 13,21 mm 4,34 mm 1,20 mm 6,00 mm 

08 15,76 mm 4,34 mm 1,20 mm 6,00 mm 

06 18,26 mm 4,34 mm 1,20 mm 6,00 mm 

09 20,76 mm 4,34 mm 1,20 mm 6,00 mm 



B 

(Solder Tail) 

Dimension 

C 

(Bend) 

Dimension 

D 


Dimension 

Interface 

01 2,84 mm 1,80 mm 1,20 mm 6,00 mm 

04 3,60 mm 1,80 mm 1,20 mm 6,00 mm 

05 4,50 mm 1,80 mm 1,20 mm 6,00 mm 

02 10,50 mm 1,80 mm 1,20 mm 6,00 mm 

03 15,54 mm 1,80 mm 1,20 mm 6,00 mm 











28/09/2012 15.12.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Straight Boardmount Sockets 

• 1 – 36 contacts in one row, 

2 – 72 contacts in two rows 

3 – 108 Contacts in three rows 










Color: Black 

Contact 

Material: 



Copper Alloy 


Wiping Area: 0,25µm (10µ") AuCo 0,2 minimum 

Solder Tails: flash AuCo 0,2 


Underplating: 

Wiping Area: 

Solder Tails: 

Electrical 

Lead Free (Pure Tin) 

Underplating: 

Wiping Area: 

Solder Tails: 




Environmental 

1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

1 A 

> 5 x 10 9 Ω at 500V DC 


Series 235P 





A P Products 


Series 235P 

Recommended Mounting Hole Patterns 

2,54mm 

2,54mm 

Ø1,02mm 

2,54mm 

2,54mm 

7,62mm 

2,54mm 

2,54mm 

2,54mm 

2,54mm 

Ø1,02mm 

2,54mm 

5,08mm 

2,54mm 

2,54mm 

2,54mm 

Ø1,02mm 

2,54mm 

2,29mm 

0,38mm 

8,26mm 

3,18mm 





without Kinked Tail 851 = Selective Gold / Solder plating 10 = min 0,25 µm Au Plating 

974 = Solder Plating 15 = 0,25 µm sel. Au Plating 

R = Standard Product with Sn100 Solder Tails 

with Kinked Tail as 2 Row Plating options: 20 = min 0,50 µm Au Plating 

Board Retention Feature 852 = all over Gold plating 25 = 0,50 µm Sel. Au Plating 

853 = Selective Gold / Solder plating with Sn100 Solder Tails 

3 = High Temperature Product 975 = Solder Plating 30 = min 0,76 µm Au Plating 

without Kinked Tail 35 = 0,76 µm sel. Au Plating 

3 Row Plating options: with Sn100 Solder Tails 

K = High Temperature Product 854 = all over Gold plating 50 = Sn100 Solder Plating 


855 = Selective Gold / Solder plating 

Board Retention Feature 976 = Solder Plating 











28/09/2012 15.08.00

A P Products 


Series 235P 

Surface Mount Sockets 




• Gold, pure tin or selective plating 


• Vertical or horizontal mounting 


Physical 

Insulation 




Color: Black 




Color: Black 

Contact 

Material: 


Copper Alloy 



Wiping Area: 0,25µm (10µ") AuCo 0,2 minimum 

Solder Tails: flash AuCo 0,2 


Underplating: 

Wiping Area: 

Solder Tails: 


Underplating: 

Wiping Area: 

Solder Tails: 

1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

Electrical 




Environmental 

Operating Temperature Rating: 

1 A 

> 5 x 10 9 Ω at 500V DC 


-40°C to +105°C (Sta ndard Temperature) 




A P Products 


Series 235P 

Recommended Mounting Pad Patterns 

2,54 mm 

2,54 mm 

1,00 mm 

2,50 mm 

2,54 mm 

5,08 mm 

8,50 mm 

2,54 mm 

2,54 mm 

2,50 mm 

5,80 mm 

2,54 mm 

1,00 mm 

0,38 mm 

10,10 mm 

1,8 mm 

4,60 mm 7,14 mm 


9x9xxx-SM-xx-xx 

Product Option: 1 Row Plating options: Contact Quantity per Row Plating Suffix 


851 = Selective Gold / Solder plating 10 = min 0,25 µm Au Plating 

3 = High Temperature Product 974 = Solder Plating 15 = 0,25 µm sel. Au Plating 


2 Row Plating options: 20 = min 0,50 µm Au Plating 

852 = all over Gold plating 25 = 0,76 µm Sel. Au Plating 


975 = Solder Plating 30 = min 0,76 µm Au Plating 






datasheet is accurate to the best of our 

knowledge. 

Due to ongoing efforts to advance design 

and material performance, this information 

is subject to change without notice. 



28/09/2012 15:09:00

A P Products 


Physical 

Insulation 




Color: Black 

Rt. Angle Boardmount Sockets 













Color: Black 

Contact 

Material: 

Copper Alloy 

Series 235P 

, 


Flash Gold (Selective) 

Underplating: 

Wiping Area: 

Solder Tails: 


Underplating: 

Wiping Area: 

Solder Tails: 


Underplating: 

Wiping Area: 

Solder Tails: 

Electrical 


Underplating: 

Wiping Area: 

Solder Tails: 




1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

1 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 





A P Products 


Series 235P 





without Kinked Tail 884 = Selective Gold / Solder plating 10 = min 0,25 µm Au Plating 


R = Standard Product with Sn100 Solder Tails 

with Kinked Tail as 2 Row Plating options: 20 = min 0,50 µm Au Plating 

Board Retention Feature 885 = all over Gold plating 25 = 0,50 µm Sel. Au Plating 


3 = High Temperature Product 30 = min 0,76 µm Au Plating 


3 Row Plating options: with Sn100 Solder Tails 

K = High Temperature Product 886 = all over Gold plating 50 = Sn100 Solder Plating 


886 = Selective Gold / Solder plating 












28/09/2012 15.14.00

A P Products 


Physical 

Insulation 




Color: Black 

Rt. Angle Boardmount Sockets 













Color: Black 

Contact 

Material: 

Copper Alloy 

Series 235P 

, 


Flash Gold (Selective) 

Underplating: 

Wiping Area: 

Solder Tails: 


Underplating: 

Wiping Area: 

Solder Tails: 


Underplating: 

Wiping Area: 

Solder Tails: 

Electrical 


Underplating: 

Wiping Area: 

Solder Tails: 




1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

1 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 





A P Products 


Series 235P 






981 = Solder Plating with Sn100 Solder Tails 

R = Standard Product 25 = 0,50 µm Sel. Au Plating 

with Kinked Tail as 2 Row Plating options: with Sn100 Solder Tails 

Board Retention Feature 962 = all over Gold plating 35 = 0,76 µm sel. Au Plating 


3 = High Temperature Product 982 = Solder Plating 50 = Sn100 Solder Plating 


K = 














28/09/2012 15.14.00

A P Products 


Series 235P 

Straight Box Headers 

• 6 – 64 contacts on two rows 

• Straight, Right Angle or Surface Mount 




Physical 

, 

Insulation 




Color: Black, Blue, White 

Electrical 


Material: High temperature Nylon 



Contact 

Material: 


Gold flash 

Underplating: 


Solder Tails: 

0,25µm Gold 

Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

Copper Alloy 

1,27µm (50µ") Ni 

flash Au 

flash Au 

1,27µm (50µ") Ni 

0,25µm (10µ") Au 

0,25µm (10µ") Au 

1,27µm (50µ") Ni 

3,00µm (120µ") Sn100 

3,00µm (120µ") Sn100 




Environmental 

Temperature Rating: -25°C to +85°C (Standard Temperature) 




A P Products 


Series 235P 


9x9xxx-01-xx-xx-xx 

Product Option: 2 Row Plating Options: Contact Quantity per Row Insulator Body Color Code 

2 = High Temperature Product 310 = Solder Plating 6 to 64 CA = Black High Temp. 

320 = Selective Gold / Solder plating CG = Blue High Temp. 

CJ = White High Temp. 

Plating Suffix 

00 = Full Sn Plating 

05 = flash Au Plating 

10 = 0,25 µm Au Plating 

Pin Quantity and Dimension Table: 

No. of 

Contacts 

Dimension 

A 

Dimension 

B 

Dimension 

C 

06 5,08 mm 12,94 mm 15,24 mm 

08 7,62 mm 15,48 mm 17,78 mm 

10 10,16 mm 18,02 mm 20,32 mm 

12 12,70 mm 20,56 mm 22,86 mm 

14 15,24 mm 23,10 mm 25,40 mm 

16 17,78 mm 25,64 mm 27,94 mm 

20 22,86 mm 30,72 mm 33,02 mm 

24 27,94 mm 35,80 mm 38,10 mm 

26 30,48 mm 38,34 mm 40,64 mm 

30 35,56 mm 43,42 mm 45,72 mm 

34 40,64 mm 48,50 mm 50,80 mm 

40 48,26 mm 56,12 mm 58,42 mm 

50 60,96 mm 68,82 mm 71,12 mm 

60 73,66 mm 81,52 mm 83,82 mm 

64 78,74 mm 86,60 mm 88,90 mm 











26/01/2016 14.40.00

A P Products 


Series 235P 

Right Angle Box Headers 






Physical 

, 

Insulation 





Electrical 





Contact 

Material: 


Gold flash 

Underplating: 


Solder Tails: 

0,25 µm Gold 

Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

Copper Alloy 

1,27µm (50µ") Ni 

flash Au 

flash Au 

1,27µm (50µ") Ni 

0,25µm (10µ") Au 

0,25µm (10µ") Au 

1,27µm (50µ") Ni 

5,00µm (120µ") Sn100 

5,00µm (120µ") Sn100 




Environmental 





A P Products 


Series 235P 



Product Option: 2 Row Plating Options: Contact Quantity (Total) Insulator Body Color Code 









No. of 

Contacts 

Dimension 

A 

Dimension 

B 

Dimension 

C 

06 5,08 mm 12,94 mm 15,24 mm 

08 7,62 mm 15,48 mm 17,78 mm 

10 10,16 mm 18,02 mm 20,32 mm 

12 12,70 mm 20,56 mm 22,86 mm 

14 15,24 mm 23,10 mm 25,40 mm 

16 17,78 mm 25,64 mm 27,94 mm 

20 22,86 mm 30,72 mm 33,02 mm 

24 27,94 mm 35,80 mm 38,10 mm 

26 30,48 mm 38,34 mm 40,64 mm 

30 35,56 mm 43,42 mm 45,72 mm 

34 40,64 mm 48,50 mm 50,80 mm 

40 48,26 mm 56,12 mm 58,42 mm 

50 60,96 mm 68,82 mm 71,12 mm 

60 73,66 mm 81,52 mm 83,82 mm 

64 78,74 mm 86,60 mm 88,90 mm Engineering Note: 










26/01/2016 14.41.00

A P Products 


Series 235P 

Surface Mount Box Headers 






Physical 

, 

Insulation 





Electrical 





Contact 

Material: 


Gold flash 

Underplating: 


Solder Tails: 

0,25µm Gold 

Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

Copper Alloy 

1,27µm (50µ") Ni 

flash Au 

flash Au 

1,27µm (50µ") Ni 

0,25µm (10µ") Au 

0,25µm (10µ") Au 

1,27µm (50µ") Ni 

5,00µm (120µ") Sn100 

5,00µm (120µ") Sn100 




Environmental 





A P Products 


Series 235P 



Product Option: 2 Row Plating Options: Contact Quantity (Total) Insulator Body Color Code 









No. of 

Contacts 

Dimension 

A 

Dimension 

B 

Dimension 

C 

06 5,08 mm 12,94 mm 15,24 mm 

08 7,62 mm 15,48 mm 17,78 mm 

10 10,16 mm 18,02 mm 20,32 mm 

12 12,70 mm 20,56 mm 22,86 mm 

14 15,24 mm 23,10 mm 25,40 mm 

16 17,78 mm 25,64 mm 27,94 mm 

20 22,86 mm 30,72 mm 33,02 mm 

24 27,94 mm 35,80 mm 38,10 mm 

26 30,48 mm 38,34 mm 40,64 mm 

30 35,56 mm 43,42 mm 45,72 mm 

34 40,64 mm 48,50 mm 50,80 mm 

40 48,26 mm 56,12 mm 58,42 mm 

50 60,96 mm 68,82 mm 71,12 mm 

60 73,66 mm 81,52 mm 83,82 mm 

64 78,74 mm 86,60 mm 88,90 mm 











26/01/2016 14.40.00

A P Products 


Physical 

Insulation 




Color: Black 




Color: Black 

Contact 

Material: 











Copper Alloy 

Series 295P 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 





A P Products 


Series 295P 

3,30mm 

5,84mm 

2,54mm 

2,54mm 

7,5 mm 

(Typ.) 

7,5 mm 

(Typ.) 

2,54mm 

A 

2,54mm 

A 

B 

B 




















Indicator Dimension Dimension Dimension 

A (Ref.) B (Solder Tail) Interface 

01 13,40 mm 3,36 mm 7,5 mm 











28/09/2012 15.11.00

A P Products 


Series 295L 










Physical 

Insulation 




Color: Black 

Contact 

Material: 

Copper Alloy 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




Environmental 


1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


-40°C to +230°C 



A P Products 

2,54 mm Male Heades 

Series 295L 

5,0 mm 

2,5 mm 

7,5 mm 

(Typ.) 

2,5 mm 

2,5 mm 

A 

B 



















Indicator Dimension Dimension Dimension 

A (Ref.) B (Solder Tail) Interface 

01 13,40 mm 3,40 mm 7,5 mm 











28/09/2012 15.11.00

A P Products 


Physical 

Insulation 




Color: Black 




Color: Black 

Contact 

Material: 











Copper Alloy 

Series 295P 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 





A P Products 


Series 295P 

7,5mm 

(Typ,) 

7,5mm 

(Typ,) 

2,54 mm 

6,00 mm 

2,54 mm 

6,00 mm 

B 

B 

1,94 mm 1,94 mm 

3,30 mm 

5,84 mm 





















B 

Dimension 

Interface 

(Solder Tail) 

01 3,26 mm 7,50 mm 











28/09/2012 15.13.00

A P Products 


Physical 

Insulation 




Color: Black 

Contact 

Material: 










Copper Alloy 

Series 295L 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




Environmental 


1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


-40°C to +230°C 



A P Products 


Series 295L 

7,5 mm 

(Typ,) 

7,5 mm 

(Typ,) 

2,5 mm 

6,00 mm 

2,5 mm 

6,00 mm 

B 

B 

1,20 mm 1,20 mm 

2,50 mm 

5,00 mm 




















A 

Dimension 

Interface 

(Solder Tail) 

01 3,30 mm 7,50 mm 











28/09/2012 15.12.00

A P Products 


Physical 

Insulation 




Color: Black 




Color: Black 

Contact 

Material: 











Copper Alloy 

Series 318P 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 





A P Products 


Series 318P 

3,30mm 

5,84mm 

2,54mm 

2,54mm 

8 mm 

(Typ.) 

8 mm 

[Typ.] 

2,54mm 

A 

2,54mm 

A 

B 

B 





















A (Ref.) 

Dimension 


Dimension 

Interface 

01 13,41 mm 2,87 mm 8,00 mm 

11 13,84 mm 3,30 mm 8,00 mm 

09 14,20 mm 3,66 mm 8,00 mm 

10 15,00 mm 4,46 mm 8,00 mm 

02 15,82 mm 5,28 mm 8,00 mm 

08 18,40 mm 7,86 mm 8,00 mm 

03 20,90 mm 10,36 mm 8,00 mm 

04 23,50 mm 12,96 mm 8,00 mm 

05 26,00 mm 15,46 mm 8,00 mm 

06 28,60 mm 18,06 mm 8,00 mm 











28/09/2012 15.11.00

A P Products 


Series 318L 










Physical 

Insulation 


Material: Liquid Chrystal Polymer (LCP) 


Color: Black 

Contact 

Material: 

Copper Alloy 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




Environmental 


1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


-40°C to +230°C 



A P Products 


Series 318L 

5mm 

2,5mm 

8 mm 

(Typ.) 

2,5mm 

2,5mm 

A 

1,5mm 

B 




















A (Ref.) 

Dimension 


Dimension 

Interface 

01 13,41 mm 2,91 mm 8,00 mm 

11 13,84 mm 3,34 mm 8,00 mm 

09 14,20 mm 3,70 mm 8,00 mm 

10 15,00 mm 4,50 mm 8,00 mm 

02 15,82 mm 5,32 mm 8,00 mm 

08 18,40 mm 7,90 mm 8,00 mm 

03 20,90 mm 10,40 mm 8,00 mm 

04 23,50 mm 13,00 mm 8,00 mm 

05 26,00 mm 15,50 mm 8,00 mm 

06 28,60 mm 18,10 mm 8,00 mm 











28/09/2012 15.11.00

A P Products 


Physical 

Insulation 




Color: Black 




Color: Black 

Contact 

Material: 











Copper Alloy 

Series 318P 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 





A P Products 

8 mm 

(Typ.) 


Series 318P 

8 mm 

[Typ.] 

D 

3,30 

D 

5,84 

B 

B 

0,25 mm 

0,25 mm 

C 

C 





















B 

Dimension 

C 

Dimension 

D 

Dimension 

Interface 

(Solder Tail) 

(Bend) 


01 2,82 mm 1,80 mm 1,94 mm 8,00 mm 

10 3,72 mm 1,80 mm 1,94 mm 8,00 mm 

11 4,62 mm 1,80 mm 1,94 mm 8,00 mm 

02 10,22 mm 1,80 mm 1,94 mm 8,00 mm 

03 15,32 mm 1,80 mm 1,94 mm 8,00 mm 

04 5,68 mm 4,34 mm 1,94 mm 8,00 mm 

12 6,58 mm 4,34 mm 1,94 mm 8,00 mm 

13 7,38 mm 4,34 mm 1,94 mm 8,00 mm 

07 8,18 mm 4,34 mm 1,94 mm 8,00 mm 

05 13,18 mm 4,34 mm 1,94 mm 8,00 mm 

08 15,78 mm 4,34 mm 1,94 mm 8,00 mm 



B 

(Solder Tail) 

Dimension 

C 

(Bend) 

Dimension 

D 


Dimension 

Interface 

01 2,82 mm 1,80 mm 1,94 mm 8,00 mm 

04 3,72 mm 1,80 mm 1,94 mm 8,00 mm 

05 4,62 mm 1,80 mm 1,94 mm 8,00 mm 

02 10,22 mm 1,80 mm 1,94 mm 8,00 mm 

03 15,32 mm 1,80 mm 1,94 mm 8,00 mm 











28/09/2012 15.13.00

A P Products 


Physical 

Insulation 




Color: Black 

Contact 

Material: 










Copper Alloy 

Series 318L 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




Environmental 


1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


-40°C to +230°C 



A P Products 


Series 318L 

8mm 

(Typ,) 

8mm 

(Typ,) 

D 

2,50 mm 

D 

5,00 mm 

B 

B 

C 

C 




















B 

Dimension 

C 

Dimension 

D 

Dimension 

Interface 

(Solder Tail) 

(Bend) 


01 2,82 mm 1,80 mm 1,20 mm 8,00 mm 

10 3,60 mm 1,80 mm 1,20 mm 8,00 mm 

11 4,50 mm 1,80 mm 1,20 mm 8,00 mm 

02 10,50 mm 1,80 mm 1,20 mm 8,00 mm 

03 15,60 mm 1,80 mm 1,20 mm 8,00 mm 

04 5,96 mm 4,34 mm 1,20 mm 8,00 mm 

12 6,66 mm 4,34 mm 1,20 mm 8,00 mm 

13 7,36 mm 4,34 mm 1,20 mm 8,00 mm 

07 8,16 mm 4,34 mm 1,20 mm 8,00 mm 

05 13,26 mm 4,34 mm 1,20 mm 8,00 mm 

08 15,76 mm 4,34 mm 1,20 mm 8,00 mm 



B 

(Solder Tail) 

Dimension 

C 

(Bend) 

Dimension 

D 


Dimension 

Interface 

01 2,82 mm 1,80 mm 1,20 mm 8,00 mm 

04 3,60 mm 1,80 mm 1,20 mm 8,00 mm 

05 4,50 mm 1,80 mm 1,20 mm 8,00 mm 

02 10,50 mm 1,80 mm 1,20 mm 8,00 mm 

03 15,60 mm 1,80 mm 1,20 mm 8,00 mm 











28/09/2012 15.13.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 




Color: Black 

Contact 

Material: 



Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

Copper Alloy 


For Board Stacking 




• Dual Insulator 





1,27µm (50µ") Ni 



1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 




Environmental 


Board Stack 

-40°C to +105°C (Standard Temp erature) 


Process Rating: 260°C (per J-STD-020C) PCT version insulators only 

(PBT insulatator version), maximum insulator temperature 

191°C (Wave solder process only) 

Moisture Sensitivity Level: 1 (per J-STD-020C) PCT version insulators only 



A P Products 


Board Stack 


9x xxxx-xx-xx-xx 









Product Option: Pin Length Identifier Contact Quantity per Row Plating Suffix 

2 = Standard Product Please see table below 1 to 36 none = Standard Product 




with Kinked Tail as Pin Length Identifier with Sn100 Solder Tails 

Board Retention Feature Please see table below 20 = 0,50 µm sel. Au Plating 


3 = High Temperature Product 25 = 0,76 µm sel. Au Plating 




K = High Temperature Product SnPb30 Solder Tails 

with Kinked Tail as 35 = 0,76 µm sel. Au Plating 




Pin Length Identifier Table (Tin Plating): 

Pin Length Identifier Table (Gold Plating): 

Number 

of Rows 

Mating 

Length 

Code 

Pin 

Length 

Identifier 

Dimension 

A 

(Interface) 

Dimension 

B 

(Solder Tail) 

Dimension 

D 

(Spacing) 

Number 

of Rows 

Mating 

Length 

Code 

Pin 

Length 

Identifier 

Dimension 

A 

(Interface) 

Dimension 

B 

(Solder Tail) 

Dimension 

D 

(Spacing) 

1 Row 4216 24 6,05 mm 2,80 mm 9,65 mm 1 Row 4217 24 6,05 mm 2,80 mm 9,65 mm 



1 Row 01 2,54 mm 9,00 mm 9,90 mm 1 Row 6121 01 2,54 mm 9,00 mm 9,90 mm 













28/09/2012 15.12.00

A P Products 


Board Stack 









Physical 

Insulation 




Color: Black 




Color: Black 

Contact 

Material: 

Copper Alloy 

, 



Underplating: 


Solder Tails: 


Underplating: 


Solder Tails: 

Electrical 

Lead Free 

Underplating: 


Solder Tails: 




1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A 

> 5 x 10 9 Ω at 500V DC 


Environmental 


-40°C to +105°C (Standard Temp erature) 


Process Rating: 260°C (per J-STD-020C) PCT version insulators only 

(PBT insulatator version), maximum insulator temperature 

191°C (Wave solder process only) 

Moisture Sensitivity Level: 1 (per J-STD-020C) PCT version insulators only 



A P Products 


Board Stack 


9x xxxx-xx-xx-xx 









Product Option: Pin Length Identifier Contact Quantity per Row Plating Suffix 

2 = Standard Product Please see table below 1 to 36 none = Standard Product 




with Kinked Tail as Pin Length Identifier with Sn100 Solder Tails 

Board Retention Feature Please see table below 20 = 0,50 µm sel. Au Plating 


3 = High Temperature Product 25 = 0,76 µm sel. Au Plating 




K = High Temperature Product SnPb30 Solder Tails 

with Kinked Tail as 35 = 0,76 µm sel. Au Plating 




Pin Length Identifier Table (Tin Plating): 

Number 

of Rows 

Mating 

Length 

Code 

Pin 

Length 

Identifier 

Dimension 

A 

(Interface) 

Dimension 

B 

(Solder Tail) 

Dimension 

E 

(Total Length) 

Pin Length Identifier Table (Gold Plating): 

Number 

of Rows 

Mating 

Length 

Code 

Pin 

Length 

Identifier 

Dimension 

A 

(Interface) 

Dimension 

B 

(Solder Tail) 

Dimension 

E 

(Total Length) 











28/09/2012 15.12.00

A P Products 


Physical 

Insulation 


Material: High Temperature Nylon 


Color: Black 

Contact 

Material: 

Copper Alloy 

Board Stack 


For Board Stacking 




• Single, Dual or Tripple Insulator 





• Up to 160 mm long 



Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

1,27µm (50µ") Ni 



1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

Electrical 




Environmental 


-40°C to +105°C (Standard Temperature) 




A P Products 


Board Stack 

Single Body Version 

Dual Body Version 

Tripple Body Version 


Board Stack Headers with 1 Body 

Interface / Solder Side Dual Solder Sides Dual Interface sides 

Style 1A 

Style 1B 



08/01/2016 11.02.00

A P Products 


Board Stack 

Ordering Information (Continued) 

Board Stack Headers with 2 Bodies 


Style 2A Style 2B Style 2C Style 2D Style 2E Style 2F 

Board Stack Headers with 3 Bodies 


Style 3A Style 3B Style 3C Style 3D Style 3E Style 3F 

Custom Board Stacking Headers are custom made to order. For a quote please provide a sketch and required 

quantities. 

Header Style: 

Interface/Solder Side Dual Solder Side Dual Interface Side 

Style 1A (1 row, 1 body) 

Style 1B (2 row, 1 body) 

Style 2A (1 row, 2 bodies) Style 2C (1 row, 2 bodies) Style 2E (1 row, 2 bodies) 

Style 2B (2 row, 2 bodies) Style 2D (2 row, 2 bodies) Style 2F (2 row, 2 bodies) 

Style 3A (1 row, 3 bodies) Style 3C (1 row, 3 bodies) Style 3E (1 row, 3 bodies) 

Style 3B (2 row, 3 bodies) Style 3D (2 row, 3 bodies) Style 3F (2 row, 3 bodies) 

Number of contacts per row: ____________ (max. 40 per row) 

Special pin grid (pins missing, not fully populated). Please provide more detailed Information 

Plating: Sn100 plated (all over) 

flash gold plating (all over) 

0,25µm gold plating (all over) 

other plating requirement: ____________________ 

Dimensions: Full pin length (A): ______________ mm (min 8 mm, max. 80 mm) 

Interface side (B): ______________ mm 

Solder side (C): ______________ mm 

Middle body (D): ______________ mm 











A P Products 

Notes 




Custom Header Design Aid 

Single Row Male Headers 

2,54 mm Pitch Headers 

Datasheets 

Tolerances: ± 0,20 mm (unless otherwise specified) 

Special tolerance needed: ± ________ / + ________ / -________ 

Dimensions: 

A: _____________ 

B: _____________ 

C: _____________ 

Dimensions: 

A: _____________ 

B: _____________ 

C: _____________ 

Dimensions: 

A: _____________ 

B: _____________ 

Plating: 

 

 

 

 

3,00 µm Sn100 all over 

0,25 µm Au all over 

0,76 µm selective Au (on interface Area), 3,00 µm Sn100 on Solder side 

Other (please specify):_____________________________________________________ 

Temperature Requirements 

 

 

Standard Range (230°C solder temp, 10 sec.; Operati ng Temp: -40°C to +105°C) 

High Temperature Range (260°C solder temp, 10 sec.; Operating Temp: -40°C to +230°C) 




Custom Header Design Aid 

Dual Row Male Headers 

2,54 mm Pitch Headers 

Datasheets 

Tolerances: ± 0,20 mm (unless otherwise specified) 

Special tolerance needed: ± ________ / + ________ / -________ 

Dimensions: 

A: _____________ 

B: _____________ 

C: _____________ 

Dimensions: 

A: _____________ 

B: _____________ 

C: _____________ 

Dimensions: 

A: _____________ 

B: _____________ 

Plating: 

 

 

 

 

3,00 µm Sn100 all over 

0,25 µm Au all over 

0,76 µm selective Au (on interface Area), 3,00 µm Sn100 on Solder side 

Other (please specify):_____________________________________________________ 

Temperature Requirements 

 

 

Standard Range (230°C solder temp, 10 sec.; Operati ng Temp: -40°C to +105°C) 

High Temperature Range (260°C solder temp, 10 sec.; Operating Temp: -40°C to +230°C) 



A P Products 

Contact Pins 

Series 0,635 

Straight Contact Pins 

• 0,635 mm (0,25") square pins 

• 8 mm to 80 mm length 

• Loose pins or "endless" or bandoliered 

• Choice of platings available 

• Choice of base materials available 

• Optional Retention Feature 


Physical 

Contact Metal 

Standard Material: 

Strap / Bandoleer Metal 

Standard Material: 

Standard Plating Options 


Underplating: 


Solder Tails: 


(Bandoliered pins only) 

Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

Other plating options available 

Electrical 



Environmental 


CuNi18Zn20 to DIN 17663 (FB18) (Nickel Silver) 

Other base materials options available 

Brass (CuZn30) 

1,27µm (50µ") Ni 



1,27µm (50µ") Ni 


2,54µm (100µ") Sn100 

1,27µm (50µ") Ni 

2,54µm (100µ") Sn100 

2,54µm (100µ") Sn100 

2,5 A max. 


-40°C to +120°C 



A P Products 

Contact Pins 

Series 0,635 

Dim "B" 

3,0 

Dim "A" 

2,54 


5 xxxx x xxx-xx x x xxx xx x 

Pin Length (Dim "A") 

Wave- or U-Band or Loose Pins 

Pin Pitch 

Plating Information 

Plating Dimension 

Retention Feature 

Position of Retention Feature 

Type of Wire 

Customer Specific 











28/09/2012 14.57.00

A P Products 

High Temperature Headers 

Reflow Soldering Information 

Solder Profile 

All Components should be soldered according to 

IPC/JEDEC J-STD-020C temperature-profile 

for leadfree reflow-soldering (maximum values): 

Profile Feature 

Pb-Free assembly 

Average Ramp-Up Rate (Ts max to Tp) 3 °C / second max. 

Preheat 

- Temperature Min (Ts min ) 

150°C 

- Temperature Max (Ts max ) 

200°C 

- Time (ts min to ts max ) 

60-180 seconds 

Time maintained above: 

- Temperature (T L ) 

217°C 

- Time (t L ) 

60-150 seconds 

Peak/Classification Temperature (Tp) 260°C +/- 5°C 

Time within 5°C of actual Peak 

10-15 seconds 

Temperature (tp) 

Ramp-Down Rate 

6°C / second max. 

Time 25°C to Peak Temperature 8 minutes max. 











28/09/2012 15:09:00

A P Products 

Datasheets 


Section 1 


Section 2 


Section 3 


Section 4 


Section 5 


Section 6 


Section 7 




A P Products 


Box Headers 

Straight Box Headers 






Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 


Gold flash (Standard) 

Underplating: 


Solder Tails: 

0,25µm Gold 

Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

Copper Alloy 

1,27µm (50µ") Ni 

flash Au 

flash Au 

1,27µm (50µ") Ni 

0,25µm (10µ") Au 

0,25µm (10µ") Au 

1,27µm (50µ") Ni 

3,00µm (120µ") Sn100 

3,00µm (120µ") Sn100 



Contact Resistance: 20mΩ max. 

Withstanding Voltage: 500V AC at sea level 

Environmental 


Process Temperature Rating: 

-40°C to +105°C (Hig h Temperature) 

250°C for 3 to 5 sec. 



A P Products 


Box Headers 






320 = Gold plating 















21/09/2011 15.13.00

A P Products 


Box Headers 

Right Angle Box Headers 






Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 



Underplating: 


Solder Tails: 

0,25µm Gold 

Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

Copper Alloy 

1,27µm (50µ") Ni 

flash Au 

flash Au 

1,27µm (50µ") Ni 

0,25µm (10µ") Au 

0,25µm (10µ") Au 

1,27µm (50µ") Ni 

3,00µm (120µ") Sn100 

3,00µm (120µ") Sn100 





Environmental 







A P Products 


Box Headers 




2 = Standard Product 330 = Solder Plating 6 to 64 CA = Black High Temp. 



R = 

Standard Product 






3 = High Temperature Product 10 = 0,25 µm Au Plating 


K = 














21/09/2011 15.22.00

A P Products 


Box Headers 

Surface Mount Box Headers 






Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 



Underplating: 


Solder Tails: 

0,25µm Gold 

Underplating: 


Solder Tails: 

Lead Free 

Underplating: 


Solder Tails: 

Copper Alloy 

1,27µm (50µ") Ni 

flash Au 

flash Au 

1,27µm (50µ") Ni 

0,25µm (10µ") Au 

0,25µm (10µ") Au 

1,27µm (50µ") Ni 

3,00µm (120µ") Sn100 

3,00µm (120µ") Sn100 





Environmental 







A P Products 


Box Headers 




2 = Standard Product 350 = Solder Plating 6 to 64 CA = Black High Temp. 



R = 

Standard Product 






3 = High Temperature Product 10 = 0,25 µm Au Plating 


K = 














05/10/2012 16.02.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 

Vertical Surface Mount Headers 

• 2 – 40 contacts per row 

• Single or dual row versions available 

• Straight, Right Angle or Surface Mount versions available 

• Gold plating 



Copper Alloy 

flash Au 

flash Au 





SMD Headers 

Environmental 




230°C for 10 sec. 



A P Products 

Standard Layout: 


SMD Headers 

Mirror Image Layout: 



Product Option: Plating Options: Contact Quantity per Row Insulator Body Color Code 

3 = High Temperature Product 520 = Gold plating (Standard) 2 to 40 DA = Black High Temp. 

521 = Gold plating (Mirror Image) 













05/10/2012 16.02.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





SMD Headers 

Environmental 




230°C for 10 sec. 



A P Products 


SMD Headers 




3 = High Temperature Product 620 = Gold plating 2 to 40 DA = Black High Temp. 













05/10/2012 16.02.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 

Straight Female Headers 







Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 




230°C for 10 sec. 



A P Products 


THT Headers 

















05/10/2012 16.01.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 



• Dual row 

• Straight 




Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 




230°C for 10 sec. 



A P Products 


THT Headers 

















05/10/2012 16.01.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 




230°C for 10 sec. 



A P Products 


THT Headers 

















05/10/2012 16.00.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 

Straight Male Headers 


• Single or dual row 

• Straight 




Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 







A P Products 

Single Row: 


THT Headers 

Dual Row: 




3 = High Temperature Product 105 = Gold plating 1 to 40 CA = Black High Temp. 

2 Row Plating Options: 














05/10/2012 15.59.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 

Right Angle Male Headers 







Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 







A P Products 


THT Headers 

















21/09/2011 15.10.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 







A P Products 


THT Headers 

















21/09/2011 15.09.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





SMD Headers 

Environmental 




230°C for 10 sec. 



A P Products 

Standard Layout: 


SMD Headers 

Mirror Image Layout: 




3 = High Temperature Product 120 = Gold plating (Standard) 2 to 40 CA = Black High Temp. 

121 = Gold plating (Mirror Image) 













21/09/2011 15.09.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





SMD Headers 

Environmental 




230°C for 10 sec. 



A P Products 


SMD Headers 

















21/09/2011 15.09.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 







A P Products 

Short Interface Side: 


THT Headers 

Long Interface Side: 




3 = High Temperature Product 100 = Gold plating (Short Interface) 1 to 40 CA = Black High Temp. 

101 = Gold plating (Long Interface) 













21/09/2011 14.38.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 







A P Products 

Short Interface Side: 


THT Headers 

Long Interface Side: 




3 = High Temperature Product 200 = Gold plating (Short Interface) 1 to 40 CA = Black High Temp. 

201 = Gold plating (Long Interface) 













21/09/2011 15.14.00

A P Products 

Notes 



A P Products 

Datasheets 


Section 1 


Section 2 


Section 3 


Section 4 


Section 5 


Section 6 


Section 7 




A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 




• Straight 




Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 




230°C for 10 sec. 



A P Products 


THT Headers 

















24/04/2009 14.18.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 




230°C for 10 sec. 



A P Products 


THT Headers 



















24/04/2009 14.17.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 




• Straight 




Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 




230°C for 10 sec. 



A P Products 

Single Row: 


THT Headers 

Dual Row: 



















24/04/2009 14.18.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 




• Straight 




Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 




230°C for 10 sec. 



A P Products 

Single Row: 


THT Headers 

Dual Row: 



















24/04/2009 14.19.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 




230°C for 10 sec. 



A P Products 

High Profile Body: 


THT Headers 

Low Profile Body: 



Product Option: 1 Row Options: Contact Quantity per Row Insulator Body Color Code 

3 = High Temperature Product 500 = Low Profile Body 1 to 40 CA = Black High Temp. 

501 = High Profile Body 













24/04/2009 14.16.00

A P Products 


Physical 

, 

Insulation 




Color: Black 

Electrical 

Contact 

Material: 




Solder Tails: 








Copper Alloy 

flash Au 

flash Au 





THT Headers 

Environmental 







A P Products 


THT Headers 



Product Option: 2 Row Options: Contact Quantity per Row Insulator Body Color Code 

3 = High Temperature Product 600 = Low Profile Body 1 to 40 CA = Black High Temp. 

601 = High Profile Body 













24/04/2009 14.17.00

A P Products 

Notes 



A P Products 

Datasheets 


Section 1 


Section 2 


Section 3 


Section 4 


Section 5 


Section 6 


Section 7 





1,27 mm Straight Male Headers 

Physical 

Straight Male Header 


• Up to 3 rows 

• Machined contact 

• Gold or pure tin plating 

• High temperature body available 


Insulation 


Material: Glass filled thermoplastic Polyester (PBT) 


Color: Black 


Material: Glass filled thermoplastic Polyester (PCT) 


Color: Black 

Contact 

Material: 

screw machined Brass 

Series 4000 

Electrical 


Gold plating: 

Gold plating: 

Tin plating: 


Max. working Voltage: 


Contact Resistance: 

Environmental 


0,25 µm (10µ") Au 

Flash Au 

5,00 µm (200µ") Sn 

1 A 

100 V RMS / 150 V DC 


20 mΩ max. 

-40°C to +120°C (Standard Tem perature) 





1,27 mm Straight Male Headers 

Series 4000 


9xMxxxx-xx-xx-xx-S 

Product Option: Configuration: Pin Length: Number of Pins: Plating Options: 

2 = Standard Temperature Product 4002 = Single row see Table 1 to 50 pins per row 1. Digit: Solder Pin 

3 = High Temperature Product 4022 = Dual row C = 0,25 µm Au plating 

4042 = Dual row double width O = Gold flash plating 

4222 = Triple row F = 5,00 µm Sn plating 

Indicator 

Solder Tail 

Dimension 

Interface 

Dimension 

"X" 

08 3,00 mm 3,10 mm 

09 3,00 mm 3,60 mm 

12 3,00 mm 6,60 mm 

13 3,00 mm 7,90 mm 

15 3,00 mm 10,00 mm 











17/06/2014 11.59.00


1,27 mm Right Angle Male Headers 

Physical 

Right Angle Male Header 





• High temperature body available 


Insulation 


Material: Glass filled thermoplastic Polyester (PBT) 


Color: Black 




Color: Black 

Contact 

Material: 


Series 4000 

Electrical 


Gold plating: 

Gold plating: 

Tin plating: 





Environmental 


0,25 µm (10µ") Au 

Flash Au 

5,00 µm (200µ") Sn 

1 A 

100 V RMS / 150 V DC 


20 mΩ max. 

-40°C to +120°C (Standard Tem perature) 





1,27 mm Right Angle Male Headers 

Series 4000 


9xMxxxx-xx-xx-xx-R 

Product Option: Configuration: Pin Length: Number of Pins: Plating Options: 

2 = Standard Temperature Product 4002 = Single row see Table 1 to 50 pins per row 1. Digit: Solder Pin 

3 = High Temperature Product 4022 = Dual row C = 0,25 µm Au plating 


4222 = Triple row F = 5,00 µm Sn plating 

Indicator 

Interface 

Dimension 

01 3,00 mm 

08 3,20 mm 

09 3,60 mm 

12 6,60 mm 

13 7,90 mm 

15 10,00 mm 











17/06/2014 12.03.00


1,27 mm Surface Mount Male Headers 

Physical 

Horizontal Surface Mount Sockets 


• Machined contacts 




Insulation 




Color: Black 

Contact 

Material: 


Series 4000 

Electrical 


Gold plating: 

Gold plating: 

Tin plating: 





Environmental 


0,25 µm (10µ") Au 

Flash Au 

5,00 µm (200µ") Sn 

1 A 

100 V RMS / 150 V DC 


20 mΩ max. 

-40°C to +230°C 





Series 4000 

Version LP Version DB Version SP 


9xMxxxx-xx - xx-xx-SH 

Product Option: Configuration: Number of Pins: Plating Options: 

3 = High Temperature Product 4002 = Single row surface mount 1 to 50 pins per row 1. Digit: Solder Pin 

C = 0,25 µm Au plating 

O = Gold flash plating 

F = Tin plating 

Pin Style: 

01 = Standard 

"-" = "LP" - Long Solder Pin (Standard) 

"D" = "DB" - Long Body 

"S" = "SP" - Short Solder Pin 











17/06/2014 12.03.00



Physical 



• Single Row and Dual Row configurations 





Insulation 




Color: Black 

Contact 

Material: 


Series 4000 

Electrical 


Gold plating: 

Gold plating: 

Tin plating: 





Environmental 


0,25 µm (10µ") Au 

Flash Au 

5,00 µm (200µ") Sn 

1 A 

100 V RMS / 150 V DC 


20 mΩ max. 

-40°C to +230°C 





Series 4000 


9xMxxxx-xx-xx-xx-SVx 

Product Option: Number of Pins: Plating Options: 

3 = High Temperature Product 3 to 50 pins per row 1. Digit: Solder Pin 



Pin Length: 

F = 5,00 µm Sn plating 

01 = Standard 

Configuration: 

Reverse Layout: 

4002 = Single row surface mount R = Reverse Layout 

4022 = Dual row surface mount for single row 

4042 = Dual row surface mount double width version only 











17/06/2014 12.00.00


1,27 mm Straight Female Headers 

Physical 

Straight Sockets 




• Multi-Wipe female contact 




Insulation 




Color: Black 

Contact 

Material: 

Spring Contact : 

Series 4000 


Stamped and formed Beryllium Copper 

(accepts ø0,35 mm to 0,50 mm pin) 


Solder side: 

Gold plating: 

Gold plating: 

Tin plating: 

Flash Au 

0,25 µm (10µ") Au 

5 µm (200 µ") Sn100 

Interface Area 

Gold plating: 

Gold plating: 

Gold plating: 

Gold plating: 

Gold plating: 

Tin plating: 

flash Au 

0,25 µm (10µ") average Au 



0,25 µm (30µ") minimum 24c Au (MIL STD) 

5 µm (200 µ") Sn100 

Electrical 

Mechanical 





Insertion Force: 

Extraction Force: 

1 A 

100 V RMS / 150 V DC 


20 mΩ max. 

150 g max. 

30 g min. 

Insertion and Extraction forces are measured per contact using a ø0,43 test pin. Other forces available upon request. 

Environmental 


-40°C to +230°C 




1,27 mm Straight Female Headers 

Series 4000 


9xFxxxx-xx-xx-xx-S 


3 = High Temperature Product 4002 = Single row 1 to 00 pins per row 1. Digit: Solder Pin 

4022 = Dual row C = 0,25 µm Au plating 


4222 = Triple row F = Tin plating 

D = SnPb plating (Non RoHS) 

Pin Length Identifier 

2. Digit: Contact Sleeves 

01 = Standard 1 = 0,25 µm Au plating (avg.) 

2 = 0,50 µm Au plating (avg.) 


4 = 0,75 µm Au plating (min.) 

(24c Au, MIL STD) 

6 = 5,0 µm Sn100 

0 = flash AU 24c 











17/06/2014 12.04.00


1,27 mm Right Angle Female Headers 

Physical 

Right Angle Sockets 








Insulation 




Color: Black 

Contact 

Material: 


Series 4000 





Solder side: 

Gold plating: 

Gold plating: 

Tin plating: 

Flash Au 

0,25 µm (10µ") Au 

5 µm (200 µ") Sn100 


Gold plating: 

Gold plating: 

Gold plating: 

Gold plating: 

Gold plating: 

Tin plating: 

flash Au 





5 µm (200 µ") Sn100 

Electrical 

Mechanical 







1 A 

100 V RMS / 150 V DC 


20 mΩ max. 

150 g max. 

30 g min. 

Insertion and Extraction forces are measured per contact using a ø0,43 test pin. Other forces available upon request. 

Environmental 


-40°C to +230°C 




1,27 mm Right Angle Female Headers 

Series 4000 


9xFxxxx-xx-xx-xx-R 


3 = High Temperature Product 4002 = Single row 1 to 50 pins per row 1. Digit: Solder Pin 

4022 = Dual row C = 0,25 µm Au plating 


4222 = Triple row F = Tin plating 


Pin Length Identifier 







6 = 5,0 µm Sn100 

0 = flash AU 24c 











17/06/2014 12.08.00


1,27 mm Surface Mount Female Headers 

Physical 

Horizontal Surface Mount Sockets 






Insulation 




Color: Black 

Contact 

Material: 


Series 4000 





Solder side: 

Gold plating: 

Gold plating: 

Tin plating: 

Flash Au 

0,25 µm (10µ") Au 

5 µm (200 µ") Sn100 


Gold plating: 

Gold plating: 

Gold plating: 

Gold plating: 

Gold plating: 

Tin plating: 

flash Au 





5 µm (200 µ") Sn100 

Electrical 

Mechanical 







1 A 

100 V RMS / 150 V DC 


20 mΩ max. 

150 g max. 

30 g min. 

Insertion and Extraction forces are measured per contact using a ø0,43 test pin. 

Other forces available upon request. 

Environmental 


-40°C to +230°C 




Version LP 


Series 4000 

Version SP 


9xFxxxx-xx-xx-xx-SH 


3 = High Temperature Product 4002 = Single row surface mount 1 to 50 pins per row 1. Digit: Solder Pin 



F = Tin plating 


Pin Length: 







6 = 5,0 µm Sn100 

0 = flash Au 24c 











17/06/2014 12.06.00



Physical 

Vertical Surface Mount Sockets 


• Single Row and Dual Row configurations 




• Optional Positioning Guide available 


Insulation 




Color: Black 

Contact 

Material: 


Series 4000 





Solder side: 

Gold plating: 

Gold plating: 

Tin plating: 

Flash Au 

0,25 µm (10µ") Au 

5 µm (200 µ") Sn100 


Gold plating: 

Gold plating: 

Gold plating: 

Gold plating: 

Gold plating: 

Tin plating: 

flash Au 





5 µm (200 µ") Sn100 

Electrical 

Mechanical 







1 A 

100 V RMS / 150 V DC 


20 mΩ max. 

150 g max. 

30 g min. 

Insertion and Extraction forces are measured per contact using a ø0,43 test pin. 

Other forces available upon request. 

Environmental 


-40°C to +230°C 





Series 4000 


9xFxxxx-xx-xx-xx-SVx 

Product Option: Number of Pins: Plating Options: 

3 = High Temperature Product 1 to 50 pins per row 1. Digit: Solder Pin 


Pin Length: 


01 = Standard F = Tin plating 


Reverse Layout: 

R = Reverse Layout 

for single row 

version only 






Configuration: 

4002 = Single row surface mount (24c Au, MIL STD) 

4022 = Dual row surface mount 6 = 5,0 µm Sn100 

4042 = Dual row surface mount double width 0 = flash Au 24c 











17/06/2014 12.06.00

A P Products 

Notes 



A P Products 

Datasheets 


Section 1 


Section 2 


Section 3 


Section 4 


Section 5 


Section 6 


Section 7 




Surface Mount Sockets 

FEATURES | BENEFITS 

• For OEM, prototyping, programming 

and test applications 

• Surface mount 

• Zero insertion force 

• Land pad footprint common for package 

and socket 

• Positive locking lid design 

• Effortless loading and unloading 

• High normal force contacts 

• Available without alignment pins for 

pick and place 

• Available with alignment pins to 

facilitate hand placement 

• Standard packaging is in trays or tape 

and reel configurations 

• RoHS compliant 

SPECIFICATIONS 

ELECTRICAL: 

• Contact resistance: 30 milliohms 

(maximum) 

• Current rating: 0.5 amp 

• Dielectric withstanding voltage: 250V AC 

• Insulation resistance: 500 Mega Ohms 

MECHANICAL: 

• Contact material: Copper Alloy 

• Minimum insertion/withdrawal cycles: 50 

ENVIRONMENTAL: 

• Body, lid, and locking material: LCP 

• Flammability 94V-0 

• Operating Temperature: -55ºC to 105ºC 



SURFACE MOUNT SOCKET 

0.50 mm TSOP 

A 

OPTIONAL REMOVABLE 

ALIGNMENT PINS 

23.52 .926 

0.50 .0197 PITCH 

5.33 .210 

SOCKET LAND-PAD FOOTPRINT 

1.27 .050 THRU FOR 

OPTIONAL ALIGNMENT PINS 

2 PLACES 

0.50 .0197 

2.00 .079 1.55 .061 

B 

C 

0.30 .012 

3.72 .146 

1.74 .069 

10.16 .400 

17.60 .693 

MINIMUM AREA CLEAR OF 

OTHER COMPONENTS 

31.75 1.250 

MILLIMETERS(INCHES) 

DIMENSION CHART 

DIM A DIM B DIM C MERITEC PART NUMBER 

PACKAGE #LEADS mm inches mm inches mm inches 

0.50 MM 

TSOP 

40 11.85 .467 9.50 .374 13.61 .536 

48 13.85 .545 11.50 .453 15.62 .615 

56 15.85 .624 13.50 .531 17.63 .694 

WITHOUT WITH 

ALIGNMENT ALIGNMENT 

PINS PINS 

980020-40- 980020-40- 

P1 

980020-48- 980020-48- 

P1 

980020-56- 

P1 

STANDARD PACKAGE 

QTY 

PER TRAY 

TAPE & 

REEL 

P2 70 250* 

P2 63 250* 

980020-56- 

P2 56 250* 

* Note: when ordering tape and reel packaging, the part number should be followed by the letter "K" 




0.80 mm TSOP 

A 

OPTIONAL, REMOVABLE 


19.52 .769 

0.80 .0315 PITCH 

6.28 .247 


1.98 .078 

0.40 .016 

1.27 .050 THRU FOR 

OPTIONAL ALIGNMENT 

PINS 2 PLACES 

MINIMUM AREA CLEAR OF 

OTHER COMPONENTS 

27.94 1.100 

13.10 .516 

3.48 .137 

15.20 .598 

3.20 .126 

B 

C 

0.80 .0315 

2.39 .094 

millimeter(inches) 




0.80mm 

SSOP 

WITHOUT 


WITH 


STANDARD PACKAGE 

QTY 

PER TRAY 

TAPE & 

REEL 

56 25.60 1.008 21.60 .850 27.38 1.078 980022-56-P1 980022-56-P2 32 250* 





1.27 mm PSOP 

A 

OPTIONAL REMOVABLE 


19.52 .769 1.27 .050 PITCH 

7.33 .289 


1.98 .078 

0.50 .020 

13.10 .516 

27.94 1.100 

3.48 .137 

16.51 .650 

5.08 .200 

B 

C 

1.27 .050 

2.11 .083 

millimeter(inches) 




1.27mm 

PSOP 

WITHOUT 

WITH 

ALIGNMENT PINS ALIGNMENT PINS 

STANDARD 

PACKAGE QTY 

PER TRAY 

TAPE 

& 

REEL 

44 30.10 1.185 26.67 1.050 31.90 1.256 980021-44-P1 980021-44-P2 32 250* 




Meritec 2mm HM (Hard Metric) Cable Assemblies 

Applications 

Meritec cable assemblies are a modular solution for high-performance backplane 

interconnect requirements. They are designed to mate and work reliably with standard 2mm 

connector shrouds. The interlocking stackable wafers match the popular IEC-61076-4-101 

types A, B, and C housings, as well as the popular B22 shroud utilized for rP2/rP5 Compact 

PCI I/O applications. The shroud system is well suited for rugged applications due to its 

unique retention system. B y affixing a latch arm to the shroud and seating the unit, the 

cable assembly will lock tightly in place. This finished system securely retains the cable 

connector against the strain of a cable bundle. The self-latching action of the design is 

particularly convenient for hard-to-reach locations. 

Cable Choices 

Meritec will supply the finished cable assembly to your exact specifications. We offer a wide 

choice of in-stock, affordable cables to meet Customer requirements. These include high 

performance twinax, shielded parallel conductors, and conventional coax in a variety of conductor 

gauges and wire construction. Color coded 24 and 26 AWG hookup cable is also available in 

mulitple colors for ease of traceability of second end termination. 

Stacking Features 

2mm HPM Series 

Stackable housings, featuring molded alignment pins, can be joined together to form all standard 

stack configurations up to 25 wafers. Custom stacking beyond 25 wafers and optional “Keying 

spacers” are available. Assemblies are locked together using Meritec’s unique double row 

Polymer Locking Rails. Optional metal rails are available for multiple-shield connections. 

GOLD 

PLATED 

E C A 

COPPER 

ALLOY 

D B 

EXAMPLE TWO ( OF SEVERAL) 

CONTACT TO SHIELD CONNECTIONS 

UNEQUALIZED 

EQUALIZED 

Shield Options 

Meritec’s Inter-modular Shield Design offers a vast choice of connection configurations. Shields 

may be connected to any or all of the contact positions (A,B,C,D,E) A drain wire(s) may be 

connected to the shield through a contact(s) by way of lanced tabs in the shield or soldered 

directly to the shield. Choose copper alloy shields with or without selective gold plating in 

contact area. 

Meritec’s Optional Passive 

Equalization Circuits (PEC) 

Meritec is proud to introduce its optional Passive Equalization Circuits (PEC), currently available 

on the HPM- 5 and soon to be available on the HPM-8 and the Right Angle HPM-5. PEC 

enhances the performance of 2mm cables, allowing high data rates over longer distances. 

Additionally, it can compensate for losses in the printed circuit board to provide complete signal 

path equalization. 

Eye pattern charts (left) show the effectiveness of chip-to-chip equalization at 3.250 Gb/s 

including 3 meters of cable, 4 connectors, and 32 inches of Fr4 traces. 

(Green trace is the stimulus) 




Three Unique 2mm Designs 

Meritec’s interlocking stackable wafers are compatible with industry standard 2mm shrouds 

including IEC-61076-4-101 A,B,&C, Compact PCI I/O and VME 64, and will mate with all popular 

latch systems. The welded terminations provide a molecular bond between wire and contact. 

Our inter-modular shields feature programmable ground positions. 

Now available with Passive Equalization Circuits (PEC) as an option. 

HPM 1x5+2 

Meritec’s 1X5 Stackable Axial Wafers feature the 

flexibility to terminate with a variety of cable types 

including Parallel Pairs, Hook-Up Wire, Coax, and 

Twisted Pair ranging from 22 through 36 AWG. 

Programmable Shield Lancing allows a connection 

between the shield and any or all of the contact 

positions. The housing retention point is compatible 

with ERNI’s spring-loaded latch arm and other 

popular 2mm latching shrouds. Choose between 

copper alloy shields with or without selective gold plating. 

HPM 1x5+2 

Right Angle 

Meritec’s Right Angle 1X5+2 offers the same 

high quality as the Axial HPM 1X5+2 with the 

advantage of an overall height of 1”(25mm) for 

applications with restricted spacing. Assembly 

will insert and latch into all popular 2mm 

shrouds. Right Angle wafer accepts cables 

from 24 AWG to 36 AWG. 

Dimensions in mm 


HPM 1x8+2 

Meritec’s HPM-8 Eight Row System increases 

signal density per linear inch and mates with all 

IEC61076-4-101 compatible shrouds. The 

HPM-8 features a variety of cables for singleended 

or balanced-line circuitry ranging from 24 

AWGto36AWG. 




2mm HPM Series age 

Standard Offerings 

POPULAR LENGTHS AND PINOUTS IN 3 CABLE STYLES 

HPM 1x5+2 Hook Up Cable 980290-048, 980290-072 

1x5 DOUBLE END ASSEMBLY 

5 LINES OF 24 AWG TFE HOOK-UP (700290-xx) 

LINES COLOR CODED FOR EASY IDENTIFICATION 

48”, 72” LENGTHS 

STACKABLE 

PINOUT “SSSSS” 

HPM 1x5+2 Parallel Pair 980319-012, 980319-024, 980319-048 


2 LINES (700319-01) 

100 OHM SHIELDED 28/30 AWG PARALLEL PAIR 

12”, 24”, 48” LENGTHS 

STACKABLE 

PINOUT “+SSGSS+” 

HPM 1x5+2 Coax 980129-024, 980129-048 


4 LINES (700129) 

50 OHM SHIELDED 26 AWG COAX 

24”, 48” LENGTHS 

STACKABLE 

PINOUT “+SSGSS+” 

HPM 1x5+2 Blank Wafer 980937-4 

1x5 BLANK WAFER ASSEMBLY 

STACKABLE 

PACKAGED IN SETS OF 4 

25 Position Locking Rails 980303-25-10 

2-25 POSITION LOCKING RAILS 

PACKAGED/SOLD IN SETS OF 10 

CUSTOMER CUT TO SIZE 

Package of 1 




Pin Assignment 

Mating Face 

Quote Request Form 

1 

2 

3 

4 

Z 

Style 

00 

01 

02 

03 

99 

ABCDE 

Wafer Number 

F 

Description 

No Connector 

1x 5+2 Axial Connector 

1x 5+2 Right Angle Connector 

1x 8+2 Axial Connector 

Custom Connector 

Connector Styles 

(contact Meritec) 

(per Customer specifications;contact Meritec) 

ABCDE 

Latch Point 

( Note relationship to “E” position ) 

Connector 1 

Connector 2 

Style 

Wafers 

(25 Max) 

Pinout 

Code 

00 

01 

02 

03 

04 

05 

06 

07 

08 

09 

10 

11 

12 

13 

99 

Style 

00 

01 

02 

03 

04 

05 

06 

99 

Contact position 

ZABCDEF 

n/c n/c n/c n/c n/c 

+ S SGS S + 

+ SSG n/c n/c + 

+ n/c n/c GSS+ 

Description 

No Cable 

100 Parallel Pair 26/28 

AWG 

100 Parallel Pair 28/30 

75 Coax 

50 Coax 

Hook-up Wire 

Hook-up Wire 

S = Signal 

G =Ground 

n/c = No Connection 

AWG 

30 

AWG 

26 

AWG 

24 

AWG 

26 

AWG 

Custom Cable (per customer specifications;contact Meritec) 

SEE PAGE 10 for additional cable specifications 

Wafer Configurations 

Connector 1 (Enter Pinout Code for Each Wafer) 

+ S G n/c S G+ 

Wafer# 

+ G S n/c G S+ 

Drain to 

Shield 

+ S G n/c n/c n/c + A,B,C,D,E 

n/c n/c n/c SS 

+ G S n/c n/c n/c + 

+ G S n/c S S+ 

Pinout 

Code 

+ n/c n/c n/c G S+ 

Wafer# 

S S n/c S S 

Drain to 

+ S S n/c SG+ 

Shield 

A,B,C,D,E 

SSSS S 

Custom Pinout (per customer specifications;use page 8 or contact Meritec) 

Standard Length Tolerance 

Under 915 mm: ± 13mm 

915 - 3050 mm :±25mm 

3050 - 6100 mm : 51 mm 

Over 6100mm : Call Meritec 

millimeters 

Pinout 

Code 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 

Connector 

1 

Connector 2 (for Double ended assemblies) 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 

Cable Styles 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 

Enter Cable Style for Each Wafer of connector 1 into Boxes above wafer number. 

Assembly Length 

Enter Tip-to-Tip 

or 

Connector 

2 



Standard Length Tolerance 

Under 36”: ± 0.5” 

36” - 120”: ± 1.0” 

120” - 240” : ± 2.0” 

Over 240” : Call Meritec 

. 

Inches


Example of Custom Point-to-Point Pinouts 


Cable Style 

0 5 

0 3 

0 2 

0 1 

0 0 

0 6 

Drain-to-Shield 

A B C D E 

x 

x x 

x 

1 

2 

3 

4 

5 

6 

x 

ZABCDEF 

1A 1B 1C 1D 1E 

2A 2B 2C 2D 2E 

3A 3B 3C 3D 3E 

4A 4B 4C 4D 4E 

5A 5B 5C 5D 5E 

6A 6B 6C 6D 6E 

1 

2 

3 

4 

5 

6 

ZABCDEF 

1A 1B 1C 1D 1E 

2A 2B 

3A 3B 3C n/c n/c 

4A 4B 4C 4D 4E 

Connector 1 mating face 

Standard Pin 

Assignment Convention 

Chart to left shows the Standard Pin Assignment Convention 

(only six wafers shown). When completing chart in lower 

section, follow this Standard Pin Assignment Convention for 

Connector #1 and rearrange as needed for Connector # 2 

(see example directly below) 


A B C D E 

1 

ZABCDEF 

3C 3B 3A 

n/c n/c 

2A 2B 

4D 4E 4C 4A 4B 

n/c n/c n/c 2 n/c n/c n/c 

x 3 

4 

5 



1A 1B 1C 1D 1E 

6A n/c 6C n/c 6E 6 6A n/c 6C n/c 6E 

x 

x 

x 

A wafer, such as #5intheexample above with no pin assignment, will be quoted as 

a blank wafer consisting of a housing, five-contact header, spacer and shield. 

x 

Connector 2 mating face 

The + symbol represents 

the presence of the optional 

inter-module shield connection. 

The Z and F columns can be 

committed to ground by the 

designation of one or more 

contact positions to be made 

common with the shield. 

Cable 

Style 


A B C D E 

Complete Matrix for Custom Signal/Ground Configurations 

x 

x 

1 

2 

3 

4 

5 

6 

7 

8 

9 

10 

11 

12 

13 

14 

15 

16 

17 

18 

19 

20 

21 

22 

23 

24 

25 

Custom Point to Point Pinout Worksheet 

Connector 1 Mating Face 

ZABCDEF 


A B C D E 

1 

2 

3 

4 

5 

6 

7 

8 

9 

10 

11 

12 

13 

14 

15 

16 

17 

18 

19 

20 

21 

22 

23 

24 

25 

ZABCDEF 

Connector 2 Mating Face 




1 

2 

3 

4 

Z 

Pin Assignment 

Mating Face 

Stacking Posts 

ABCDE 

Wafer Number 

F 


Place mark in appropriate box 

Label Requirements 

List specific information in space provided. 

YES 

Are stacking posts removed on wafer #1? 

NO 

Gold Copper 

Shield Options 

Plated Alloy 

ECA D B 

Meritec’s design of shielded wafers, standard on all 2mm connectors, 

offers the choice of connection configurations between contacts and/or 

drain wires. Shields may be connected to any or all of the contact positions 

(A,B,C,D,E). A drain wire(s) may be connected to the shield through a 

contact(s) by way of a lanced tab in the shield (as shown in picture) or 

soldered directly to the shield. Selective Gold plated shields are optional. 

Example: two ( of several) 

Contact>Shield connections 

Select One 

Copper Alloy 

Selective Gold plated 

Additional Features Available 

Halar is a registered trademark 

Metal sleeving, FR, FRDM, polyester, and Halar ® ECTFE ( 

of Solvay Solexis 

) 

Standard and custom backshells 

Drawings (there is a Non- Recurring Engineering, NRE, charge per drawing) 

First Article Information and Waiver 

In a continuing effort to ensure Customer satisfaction, Meritec has a policy of a 1st article build. 

This permits the Customer to inspect and approve one cable assembly before proceeding with 

the balance of the order. The option of declining the 1st article process is available if this waiver 

is authorized by signing below and faxing to a Meritec Customer Service Representative at 

+49 7157 5348-39 . By signing this waiver, the Customer accepts full responsibility for the product design 

and agrees to accept and pay for the complete order as built. 

Authorized Signature ______________________Title___________________ Date________ 

Company____________________________________________________________________ 




Standard Cable Specifications 

700369-01 

STYLE 

01 

700319-01 

STYLE 

02 

700152 

STYLE 

03 

700129 

STYLE 

04 

700290-Color 

STYLE 

05 

700575-Color 

STYLE 

06 

100 ohm Shielded Parallel Pair 

26/28 AWG Stranded Copper 

a) White b) Blue Foam Fluoropolymer Insulation 

FEP Jacket 

Aluminum/Polyester Tape Shield 

Time Delay ns/ft 1.2 

100 ohm Shielded Parallel Pair 

28/30 AWG Stranded Copper 

a) White b) Blue Foam Poly Insulation 

PVC Jacket 

Aluminum/Polyester Tape Shield 


75 ohm Coax with Braided Shield 

30 AWG Stranded Copper 

Foam Fluoropolymer Insulation 

FEP Jacket 

TPC Braid 95% Shield 


50 ohm Coax with Braided Shield 

26 AWG Stranded Copper 

Foam Fluoropolymer Insulation 

FEP Jacket 

TPC Braid 95% Shield 

Time Delay ns/ft. 1.2 

24 AWG HOOK UP / TFE JACKET 

700290-00 Green 700290-05 White 

700290-01 Gray 700290-06 Brown 

700290-02 Black 700290-07 Red 

700290-03 Orange 700290-08 Yellow 

700290-04 Violet 700290-09 Blue 

26 AWG HOOK UP / FEP JACKET 

700575-00 Green 700575-05 White 

700575-01 Gray 700575-06 Brown 

700575-02 Black 700575-07 Red 

700575-03 Orange 700575-08 Yellow 

700575-04 Violet 700575-09 Blue 



Custom Applications and Designs 


Meritec’s technologically advanced Tooling/Machining Division not only boasts the most 

skilled and experienced machinists, but features state-of-the-art equipment as well. Our 

extensive engineering capabilities coupled with the vast resources of our Molding and 

Stamping Divisions make Meritec a leading force in custom cable manufacturing. Let 

Meritec design a custom configuration to suit your specific application. 

Custom Terminations 

BNCs 

Circular Connectors 

Crimp-on Connectors 

Customer Requests 

D-Subs 

Custom Shielding 

Metal Expando 

Halar ® ECTFE Sleeving 

Multi-Conductor Jacketed Cable 

EMI/RFI Protection 

EMI Gasket Seals 

Custom Designed Backshells 

Custom Configurations 

HSSDC2s 

RJ45s 

SMAs 

SMBs 

IDC Connectors 

( ) 

Halar is a registered trademark 

of Solvay Solexis 

In-house Machining 

Die Casts 

Custom Retention Designs/ Keying Features 

Multiple Exit 

High Volume Molded Thermoplastic 

Right Angle Exit 

Right Angle Wafers 

Custom Stacking (OVER 25 Wafers) 

Metal Locking Rails 

1X8+2 Wafers 

888-637-4832 

Custom Connectors 

2.25mm Connector 

D.T.C. (.032 Spacing) 

Keying Plugs 

Custom Design 



Cable Assembly Specifications and Performance 

General Connector Specifications 


Contact Pitch 

Temperature Range 

Performance Level 2 per IEC 61076-4-101 

Performance Level 1 per IEC 61076-4-101 

2.0mm 

-55 Degrees C to +125 Degrees C 

> _250 mating cycles 

> _500 mating cycles 

Forces associated with .025 Inch Pin-to-Any Contact 

Normal force 

Mating Force, per IEC 512-7 Test 13a 

Withdrawal Force, per IEC 512-7 Test 13a 

0.86N 88gm 

0.36N 37gm 

0.28N 29gm 

Housing and Overmold Plastic Material Glass Filled Liquid Crystal Polymer (LCP) 

Flammability 

UL-94V-0 

Locking Combs (Rails) 

Plastic Material 

Flammability 

Glass Filled Liquid Crystal Polymer (LCP) 

UL-94V-0 

Shields 

Base Metal Material 

Optional Selective Gold Plating 

Copper Alloy 

30 micro inch Gold / 50 micro inch Nickel 

Contact 

Base Metal Material 

Standard Selective Gold Plating 

Copper Alloy 

30 micro inch Gold / 75 micro inch Nickel 

Electrical Specifications and Performance 

Insulation Resistance, per IEC 512-2 test 3a Contact-to-Contact >_ 10 Giga Ohms@ 100VDC 

Contact-to-Shield >_ 10 Giga Ohms@ 100VDC 

Dielectric Withstanding Voltage, per IEC 512-2 test 4a 

750 VAC 

Voltage Rating 

250 VAC 

Current Rating per Contact @ 70 Degrees C Ambient 

and 10 Degrees C Rise Maximum 

1AMP 



Application Notes 

2mm HPM PSeries 

age 13 

Contact Pinout and Numbering Schemes for VME64x and CompactPCI Applications. 

The backplane layouts, shown on this and the following page, Figure 1 and Figure 2 depict the nomenclature and numbering conventions 

used in the CompactPCI specification and the IEEE 1101.10 Standard (VME64x applications). The drawings also illustrate the 2mm HM 

shroud orientation viewed from the rear of the backplane/midplane. Note the alignment, shroud side, and latch referenced. This application 

notation clearly identifies pinout differences existing between the standards noted above and should serve to clarify such differences 

before cable requests are assembled and shipped for installations. VITA 30-199x, 2mm Connector Practices for Euroboard Systems, identifies 

these differences in applications involving CompactPCI, VME and VITA. 

Meritec will wire the assemblies per the numbering scheme established in accordance with IEEE 1101.1, IEEE 1101.10, IEC 61076-4-101, 

and VITA 30-199x style V. The VME64x application notation above conforms to these specifications. 

Reference documents: 

IEEE 1101.11 Standard for Mechanical Rear Plug-in Units for Microcomputers using the IEEE 1101.1 and the IEEE 1101.10 

IEEE 1101.10 Standard for Mechanical Core Specification for Microcomputers using IEC 603-2 Connectors 

Equipment Practices 

IEC 61076-4-101 

PICMG 2.0 Release 3.0 CompactPCI Core Specifications 

VITA 1.1-1997 VME 64 Extensions 

VITA 30-1997 2mm Connector Practices for Euroboard System 

CompactPCI Applications. 

As is typical in some telecommunications, the CompactPCI specification numbers the signals starting from the bottom up. These 

differences can complicate the I/O portion of the system if not identified as “application specific” in the beginning.( Note bothviews 

shown below in Figure 1). These views, front and rear, show the A1 position located at the bottom-slot 1 edge of the pinfield. 

The shroud and latch orientations are shown to depict proper alignment when the cable interface is attached. 

Figure 1 

Figure 1-6UCompact PCI Backplane Layout 

Male Male Male 

15 

11 

1 

19 

1 

22 

2.675 

2.675 

15 

11 

1 

19 

1 

22 

Male Male Male 

2mm HM 

header w/ 

feed through 

pins 

P3 

Front 

Compact PCI 

backplane 

ERNI Shroud 

ERNI 

latch arm 

064219 

Rear 

Front View 

1 

ZABCDEF 

1 

FEDCBAZ 

Rear View 

Latch View 

(Side) 

Facing Row F 

position 1 thru 19 

top to bottom 

PICMG 2.1 R3.0 specifies an 

AB19 shroud for rear plug in 

applications (rP3/rJ3). 

However, cable assemblies 

used for I/O routing 

currently require a B19 shroud. 





Shroud Orientation 

When shrouds are used on the rear of the backplane, care must be taken to align the shrouds properly. The correct orientation 

will depend upon the configuration of the rear plug-in cards. For most applications following the “inline” configuration, the rear 

shrouds will have the convex and detail facing down as depicted in the circle in Figure 3. The “a” row of the shroud will match the 

“a” row of the male connector. This preferred orientation of the shroud will enable the cable system to be securely latched on the 

left side when viewing from the rear of the backplane, as shown in Figures 1 and 2. 

Figure 3 

These Application Notes are intended to explain differences in numbering schemes commonly used with the extended 2mm HM series for 

I/O applications. The importance of these differences is to qualify the wiring issues surrounding single-ended and double-ended assemblies, 

as well as singleended applications requiring labels on the unterminated end. The figures 1 and 2 on pages 13 and 14 clearly present the 

differences existing between the two standards that currently employ the 2mm HM connector system. 

VME64x Applications 

The IEEE 1101.10 Standard employs the same 19-position 2mm family of connectors as is used in VME64x applications. This center connector, 

located in slot JO/PO for VME64x backplane layouts shown below in figure 2 reveals pinout assignments with Row/Position A1 located 

at the top slot 1 edge of the pinfield. The depictions below describe the front and rear views respectively, and the corresponding A1 Location. This 

clarification is needed to properly identify where A1 is located with respect to the cable assembly and application being employed. Note that the 

latches, which ruggedize the interface, are depicted on the left side of the shroud when viewing the slots from the rear. 

Figure 2 

Figure 2 - VME64x Backplane Layout 

18 

18 

20 

20 

22 

22 

24 

24 

26 

26 

28 

28 

30 

30 

32 

32 

2mm HM 

header w/ 

feed through 

pins 

VME 64X 

backplane 

ERNI Shroud 

1 

1 

1 

1 

1 

1 

19 

ZABCDEF 

ZABCDEF 

19 

ZABCDEF 

19 

ZABCDEF 

1.85 

a1 

2 

4 

19 

FEDCBAZ 

a1 

2 

4 

19 

FEDCBAZ 

FEDCBAZ 

19 

FEDCBAZ 

Front 

ERNI 

latch arm 

064219 

Rear 

Front View 

6 

8 

10 

12 

14 

6 

8 

10 

12 

14 

Rear View 

Latch View 

(side) 

Facing Row F 

position 1 through 19 

top to bottom 

PICMG 2.1 R3.0 specifies an 

AB19 shroud for rear plug in 

applications (rP3/rJ3). 

However, cable assemblies 

used for I/O routing 

currently require a B19 shroud. 




2mm Shrouds and Latch 

End View and Latch 

Shroud 

with Latch 

Meritec cable assemblies will mate to all popular 2mm shrouds. This 

page provides limited information on 2mm shrouds manufactured by 

ERNI. For further information, contact your ERNI representative. Each 

shroud is available in four different base heights (3.9mm, 4.5mm, 

5.3mm & 6.1mm). 

27.5 mm 

10 .45 mm 

H 

Type A Shroud 

Type A shrouds have a multifunction 

area for coding keys (as shown at left). 

Available in 50mm and 

38mm lengths. 

2.0 8.0 

2.0 

Z A B CDE F 

A 

2.0 

12.0 

14.8 

Type B Shroud 

Type B shrouds have an unbroken 

contact field and no multifunction 

area. Available in 50mm, 

44mm and 38mm lengths. 

2.0 2.0 

Z A B CDE F 

A 

2.0 

12.0 

14.8 

Type C Shroud 

Type C shrouds are for end positions 

only. Shrouds are 25mm long. 





VPX plus



VPX plus



VPX plus

Flat Flex Cable 

FEATURES and BENEFITS 

• Meets FPDI-1 standards 

• .5 mm laminated cable (FFC) 

• 31, 41 or 51 position male and female 

Hirose DF-9 or equivalent connectors 

• Molded strain relief 

• Reliable termination 

• Low profile 

• Suitable in notebook hinge areas 

• Extraction tools available 

• Options Include: 

• Ferrites 

• Shielding 

• Length and fold options available 

• ZIF (.5 mm) end 

• Transition boards for various pitch 

applications 

• ChassisLoc for panel mounting 

• SnapLoc for positive retention to the 

PCB 

• Solder prep for direct attachment to 

the PCB 

• FPDI-1 assemblies are UL listed under 

file #E-147226 

• RoHS Compliant 


ELECTRICAL 

• Contact resistance - 30 milliohm (maximum) 

• Dielectric withstanding voltage - 300V RMS 

(minimum) @ 60 Hz 

• Current - 0.50 AMPS 

• Insulation resistance - > 10 9 ohms @ 500 DC 

CONTACTS 

• Material - Copper Alloy 

• Finish – Tin 

• Insertion Force - 197 grams, 6.94 oz/.4343 lbs 

(nominal) 

• Withdrawal Force - 30 grams, 1.058 oz/.06614 lbs 

(nominal) 

CABLE 

• Insulator - Polyester (FFC) 

• Conductor - Flat solid 33 AWG equivalent (FFC) 

• Plating - Tin Bismuth 

• Minimum bend radius 0.020 inches (FFC) 

• Length tolerances - under 12”± .10” 

over 12” ± 0.25” 

• Length is measured from end to end in inches 

including connectors “L” 

ENVIRONMENTAL 

• Material - U.L. Flame rating 94V-1 (FFC) 

• Temperature Rating - -40ºC to +105ºC (FFC) 



Flat Flex Cable (FFC) Assemblies 

B 

.185 

.094 

.35 

A B # OF POSITIONS 

.88 

1.07 

.66 

.86 

31 

41 

1.28 1.06 51 

Meritec’s FPDI-1 Connector 

assemblies are UL listed 

under File #E147226 and 

RoHS Compliant 

A 

DATE CODE 

FPDI-1 Compatible Hardware 

C 

D 

.130 

.187 

A 

B 

C 

.125 DIA. 

(2) PLCS. 

CHASSIS MOUNTING HOLE 

.031 MAX PANEL THK. 

A B C D 

1.255 .649 1.050 .812 31 

1.451 .845 1.250 1.020 41 

1.647 1.041 1.446 1.216 51 

# OF POSITIONS 

CHASSISLOC 

P/N: 989910-31, 41 AND 51 

A 

.422 

A B # OF POSITIONS 

B 

.125 DIA. 

(2) PLCS. 

1.256 1.050 31 

1.458 1.250 41 

SNAPLOC 

P/N: 989911-31, 41 AND 51 

1.656 1.450 51 

.260 

.25 

.17 TAB 

STANDARD 

SOLDER PREP 

Consult factory for custom 

solder prep requirements. 

.08 TRACE 



FFC Product Line Options 

EMI Suppression Options 

High performance Flat Panel Displays (FPD) with operating frequencies at 400MHz are common place. 

To minimize the bandwidth EMI noise sources at this higher frequency, Meritec offers both ferrite 

solutions and shielding solutions for cost effective EMI suppression. 

1. Ferrite Part Number Impedance at 25 MHz/100MHz Can be used on X” wide cable 

07 35/85 Ohms 0.70” 

03 50/103 Ohms 0.79” 

04 20/40 Ohms 0.79” 

05 133 Ohms (@ 100MHz) 0.90” 

06 208 Ohms (@ 100MHz) 0.93” 

08 14/42 Ohms 1.040” 

2. Shielding Options: 

a. Aluminum Foil Shielding laminated to Mylar insulation of the flat flex cable. The foil is .001 

inches thick with .0005 inches of clear Mylar insulation. Select conductors with within the FFC 

can be grounded directly to the foil shield. Drain wires are also an option. 

b. Conductive Silver Ink Shielding applied to the Mylar surface of the FFC can provide effective 

EMI suppression while allowing for maximum flexibility of the cable for more dynamic 

applications. Select conductors within the FFC can be grounded directly to the conductive ink 

shield. 

c. Patterned Conductive Silver Ink Shielding applied to the Mylar surface of the FFC in a 

cross-hatch pattern can provide effective EMI suppression while maintaining higher impedance 

values more favorable to LVDS applications. The patterned ink also allows for maximum 

flexibility of the cable for more dynamic applications. Select conductors within the FFC can be 

grounded directly to the patterned conductive ink shield. 

3. Other Options. Meritec can provide you with an application specific quotation for an FFC assembly 

that incorporates folds, labels, various tape products, mechanical clips, etc. Transition printed 

circuits can also be provided to accommodate various connectors and pitch changes within an 

assembly. 

4. Stocked product. Meritec offers the following stocked FPDI-1 cable assemblies that are likely to be 

in stock at Meritec or your local Meritec Distributor. 

Part Number 

9803FFA1T3-3.00 

9803FFA1T3-6.00 

9803FFA1T3-12.0 

9803FFA1T4-3.00 

9803FFA1T4-6.00 

9803FFA1T4-12.0 

9803FFA1T5-6.00 

9803FFA1T5-12.0 

Product Description 

Female to Female, 31 position, A1 orientation, 3” in length 










FFC Product Line Description System 

Number of Traces 

1 to XX 

Cable Style 

Unshielded Mylar = T 

Foil Shielded Mylar = S 

Silver Conductive Ink Shielded = K 

Patterned Ink Shielded = W 

Custom = X 

Teflon FRC = R 

Patterned Silver Ink = L 

Cable Pitch 

0.3mm = A 

0.4mm = K 

0.5mm = B 

0.6mm = C 

0.8mm = E 

1.0mm = G 

1.25mm = H 

1.27mm = J 

2.54mm = V 

Custom = X 

“L” 

. 

Length in Inches 

0 – 999” 

Folds 

No = N 

Yes = Y 

Orientation 

See pinout chart for 

connector to connector, 

connector to ZIF and ZIF 

to ZIF orientation. 

Labels 

No = N 

Yes = Y 

2 nd End Conn. 

Socket= F (FPDI-1 31,41,51) 

Plug= M (FPDI-1 31,41,51) 

LVDS/DF19= A (14,20,30) 

LVDS/FI-X= B (14,20,30) 

Tape ZIF=Z 

ZIFLOC Overmold= R 

No Connector= N 

Solder Prep= H 

Custom= X 

FC Flying Lead= L 

1 st End Conn. 

Socket= F (FPDI-1 31,41,51) 

Plug= M (FPDI-1 31,41,51) 

LVDS/DF19= A (14,20,30) 

LVDS/FI-X= B (14,20,30) 

Tape ZIF= Z 

ZIFLOC Overmold= R 

No Connector= N 

Solder Prep= H 

Custom= X 

FC Flying Lead= L 

Ferrite 

None = 00 

600016-03 = 03 

600016-04 = 04 

600016-05 = 05 

600016-06 = 06 

600016-07 = 07 

600016-08 = 08 

Custom = XX 

Drain 

None = N 

One End = D 

Both Ends = B 

Drain w/ 

Connector(s) = 

DC or BC 

FFC 

FFC Designator 

FFC=FFC 

FFC FF A-1 T 31 B 9.50 N N 03 NN 

These are descriptions for quoting purposes only. A 6 digit customer specific part number will be assigned to you upon 

ordering. If folds, ferrites or labels are specified, a Meritec drawn, customer approved drawing (MD) or a customer 

supplied (CS) Meritec approved drawing will be required prior to production. 



FFC Product Line Pinouts and Orientations 

FPDI-1 

PINOUT “A” 

CONNECTOR PIN 1 TO PIN 1 

FPDI-1 

PINOUT “B” 

CONNECTOR PIN 1 TO PIN 31, 41 

OR 51 

FPDI-1 

PINOUT “Z” 

31, 41 OR 51 PIN CONNECTOR 

TO ZIF CONNECTORS 

1 

FEMALE TO FEMALE 

OR 

MALE TO MALE 


1 TO 

1 

MALE TO MALE 

ZIF 

PREP 

2 


OR 

MALE TO MALE 

2 

FEMALE TO MALE 

2 

ZIF 

PREP 

3 


3 

MALE TO FEMALE 

3 

ZIF 

PREP 

4 


4 


4 

PINOUT “Z” ZIF TO ZIF CONNECTORS 

ZIF 

PREP 

5 


5 


5 

ZIF 

PREP 

ZIF 

PREP 

6 


6 


OR 

MALE TO MALE 

6 

ZIF 

PREP 

PINOUT “Z” LVDS TO LVDS CONNECTORS 

ZIF 

PREP 

7 


OR 

MALE TO MALE 

7 


OR 

MALE TO MALE 

7 

LVDS PIN 1 TO PIN 1 

8 

LVDS PIN 1 TO 14, 20 

OR 30 



Micro Coax Cable Assembly w/ 

ERNI MicroSpeed® Connectors 


• Mates with ERNI MicroSpeed® 

Mezzanine Connector 

• Dual row 50 position 1.0mm pitch 

• Twelve 100 ohm differential signals 

pairs 

• High data transfer rates up to 10 Gb/s 

per pair 

• Miniature cable for ease of routing in 

confined spaces 

• Configured for board to board jumper 

applications 

• Male and Female Configurations 

• High density configuration minimizes 

board space requirement 

• Reliable termination with over-molded 

strain relief and backshell 

• Wide array of connector orientations 


• Signal integrity data available upon 

request 

• Ideal for applications such as: 

InfiniBand, 10G Ethernet, SAS, SATA-2 

and Rapid IO. 


CONNECTOR: 

• www.erni.com/microspeedfront.htd 

ASSEMBLY: 

• Dielectric Strength: 150 VDC (Signal to 

Signal & Signal to Ground) 

• Insulation resistance: >100 Megohms 

CABLE: 

• 50 Ohm ribbonized coaxial construction 

• Rated at 30V, 80ºC 

• Current carrying capacity: 400mA 

• 38 AWG standard conductor with shield 

• Minimum bend radius: .250inch 

HOUSING: 

• Material: LCP UL 94V-0 

• Operating Temperature: -55ºC to 105º 



Micro Cable to Board Assemblies 

With ERNI MicroSpeed® Connectors 

MALE 

16.1 .64 

A1 

FEMALE 

16.1 

.64 

28.2 1.11 

15.4 .60 

28.2 1.11 

15.4 .60 

A1 

7.3 .29 

6.3 .25 

4.8 .19 

Layout of Signal and Ground Contact 

3.8 

.15 

-SIGNAL CONTACT 

-GROUND CONTACT 

A1 B1 A1 B1 

AA 

Connector Orientation 

AD 

A1 

B1 

AG 

A1 

B1 


MALE TO MALE 


A1 

B1 

A1 

B1 

A1 B1 B1 A1 

AB 

AE 

AH 


MALE TO MALE 


A1 

B1 

B1 

A1 

A1 

B1 

A1 

B1 

AC 

B1 

A1 

AF 

A1 

B1 

A1 

B1 

AJ 

B1 

A1 


MALE TO MALE 


B1 A1 

A1 B1 

" L " 

B1 

A1 A1 B1 

AK 


PART NUMBER ORDERING SPECIFICATION: 9840 050 . 2U 

CONNECTOR 

ORIENTATION 

LENGTH IN INCHES 

DIMENSIONS TO BE USED AS REFERENCE ONLY - PLEASE REFER TO SALES DRAWINGS FOR DETAILED DIMENSIONS - SPECIFICATIONS SUBJECT TO CHANGE 



MULTI SIGNAL 

INTERCONNECT 

(MSI) 


• Mates with standard .025” square or round pins & 

standard latch & eject headers on .100” x .100” grid 

spacing 

• Available positions 10, 20, 26, 34, 40, 50, 60 & 64 

• Laser prepped cable 

• Mass introduction solder termination 

• Precision high strength overmold 

• End bypass pin configuration 

• Buss grounds to customer designated pins when 

applicable 

• Pull tabs available on high profile, Kevlar pull tabs 

available on low profile 

• Daisy chain terminations available 

• FEP point to point or controlled impedance ribbon 

cables available with/without shielding 


Electrical 

• Current rating: 1.0 amp/contact (continuous) 

• Contact resistance: 5 milliohm/contact (maximum) 

9 

• Insulation resistance: >1 x 10 ohms @ 500 V DC 

Mechanical 

• Contact material: Beryllium copper 

• Contact finish: 30 micro” gold (min) inlay, w/ over 

50 micro” nickel (min) 

• Pin insertion depth: .180” (min) to .270” (max) 

• Insertion force: 120 grams/contact (nominal) 

• Withdrawal force: 75 grams/contact (nominal) 

• Normal force: 120 grams/contact (nominal) 

• Dielectric material: Liquid crystal polymer resin 

Environmental: 

• Material: U.L. rated 94 V-0 

• Temperature rating: -55°C to +105°C 



Controlled Impedance Multi Signal Interconnect (MSI) 



Controlled Impedance Multi Signal Interconnect (MSI) 



DS3 Mutli-Position w/ 740 Style Coax 

This DS3 Assembly product is designed to concentrate coax lines in areas where BNCs are not desirable or 

where there is not sufficient room for transition modules or boards. 


• Mates with industry standard latch and 

eject headers or thumbscrews for rear 

panel retention 

• High density/low profile for use in areas 

where space is critical 

• Modular construction with internal ground 

plane 

• Sensitive loading of contact/cable 

positions 

• Available with the double ended carrier or 

carrier to BNC/Connector 

• Carriers are available in 8 and 25 coax 

module versions 

• Applications specific proposals available 

upon request 


ELECTRICAL: 

• 75 Ohm 740 Style Cable 

• Return Loss >20db @ 100 MHz 

• Rated 500 VDC @ 100 meg ohms IR 

MECHANICAL: 

• Contacts: Copper Alloy 

• Contact Finish: 30 micro inches gold 

over 50 micro inches nickel 

• Housing: Glass filled LCP 


• Material: UL 94V-0 




DS3 Multi-Position Assembly with 740 Style Coax 

PROVISIONS FOR MATING 

WITH A STANDARD HIGH 

PROFILE LATCH AND EJECTOR 

HEADER 

2X25 POSITION 

CABLE TYPICAL 

.67 .565 

2.540 

2.680 

SECTION A-A 

CABLE EXIT ALTERNATES AS SHOWN 

TO ASSURE THE CABLE JACKET WILL 

NOT INTERFERE AT .100 INCH CENTERS 

.240 

.100 

.100 TYP. 

SIGNALS THIS ROW 

GROUNDS THIS ROW 

A 

A 

3.19 

"L" 

.50 

.82 CONN. 

HT. ABOVE 

THE BOARD 

PREFERRED MATING HEADER: LOW PROFILE 

SAMTEC EJH SERIES OR EQUIVALENT 

CONNECTOR SHOWN 

MATED WITH HEADER 

2X8 POSITION 

.67 

.565 

.50 

.82 

.840 

.980 

1.49 

CONNECTOR SHOWN WITH MATING 

LOW PROFILE SAMTEC HEADER EJH 

SERIES OR EQUIVALENT 



DS3 Multi-Position w/ 735 Style Coax 

This DS3 Assembly product is designed to concentrate coax lines in areas where BNCs are not desirable or 

where there is not sufficient room for transition modules or boards. 


• Mates with latch and eject header or pin 

field 

• High density/low profile for use in areas 

where space is critical 

• Modular construction with internal 

ground plane 

• Selective loading of contact/cable 

positions 

• Available with double ended carrier or 

carrier to BNC 

• Carrier holds up to 14 coax modules 

• Angled egress 

• Application specific proposals available 

upon request 


ELECTRICAL: 

• 75 Ohm 735 Style Cable 

• Return Loss >30db @ 100 MHz 

• Rated 500 VDC @ 100 meg ohms IR 

MECHANICAL: 

• Contacts: Copper Alloy 

• Contact Finish: 30 micro inches gold 

over 50 micro inches nickel 

• Housing: Glass filled LCP 






DS3 Multi-Position Assembly with 735 Style Coax 

.60 REF. 

PULL TAB OPTIONAL 

COVER 

.40 

75 OHM BNC PLUG OR 

RECEPTACLE AS REQUIRED 

IN SPECIFIC APPLICATION 

2.03 

2.17 

2.25 

HOUSING 

"L" ±4° 

POSITION #16 

1.875 

.125 TYP. 

POSITION #1 

SIGNALS THIS ROW 

.125 

GROUNDS THIS ROW 

ASSEMBLY SHOWN MATED WITH MERITEC .125" 

PITCH LATCH AND EJECTOR HEADER 



Introducing 

Meritec’s Hercules ® Interconnect System embedded in the rugged circular MIL-DTL-38999L 

Series III shell provides both a durable and high-bandwidth interconnect scheme suitable 

for Military, Aerospace and ruggedized commercial high-bandwidth applications not 

previously accommodated by Industry standard interconnects. The rapid 

emergence of high-speed switched serial fabric backplanes in the rugged 

embedded computer market has created a need for a connector system 

capable of supporting serial I/O at full bandwidth between platforms. New 

backplane architectures are supporting link speeds in excess of 5 Gb/s. The 

desire of system designers to implement these speeds and to operate independent boxes or 

platforms at full system bandwidth requires a new generation of high bandwidth (10 Gb/s) 

ruggedized I/O connectors. The VITA 76.0 standard addresses the HERCULES Interconnect 

System, that will support this bandwidth (>10 Gb/s) while also meeting the necessary signal 

density emerging in the ruggedized embedded systems. 

Open Standards, Open Markets 

The VITA 76.0 Standard defines a ruggedized high-bandwidth copper I/O connector system 

that consists of bulkhead receptacles and cable end plugs. The bulkhead receptacle can be 

different styles: PCB pressfit tail, PCB solder tail and cable pigtail. The mounting mechanism of 

the bulkhead receptacle can be flange or jam-nut style. The cable end plugs can also embrace 

alternative technologies: copper, hybrid copper, active copper and active optical (AO). 

The cable end plug attaches external cables to chassis bulkhead walls via the bulkhead 

receptacles. The cable end plug is secured to the bulkhead receptacles via a turn-style collar 

ring MIL-DTL-38999. Various styles of cable egress are available for different applications. 

Examples include: 

1. Single chassis to single chassis interconnect (e.g. computer to computer via 4-lane PCIe) 

2. Single chassis to multiple chassis interconnect (e.g. computer to multiple peripherals 

such as SATA drive, video monitor and USB 

Cable egress from the cable end plug is beyond the scope of the VITA 76.0 Standard. 

The base VITA 76.0 Specification defines the bulkhead-receptacles and copper based cable 

end plugs. Subsequent VITA 76.0 Specifications will define cable end plug assemblies with 

active optical engines. 

The base VITA 76.0 Specification deals with: 

1. The bulkhead receptacle interfaces 

2. The cable end plug interface 



High-Speed Ruggedized 

Interconnect System 

Meritec’s Hercules Interconnect System embedded in the rugged circular MIL-DTL-38999L 

Series III shell provides both a durable and high-bandwidth interconnect scheme suitable for 

Military, Aerospace and ruggedized commercial high-bandwidth applications not previously 

accommodated by industry standard interconnects. 

Features & Benefits 

• Rugged light-weight aluminum MIL-38999 

Series III size 9, 13, 17 and 23 threadedcoupling 

circular shells. 

• Keying: “N” (standard) “A”, “B”, “C”, “D” 

• Available as Plug-Cable Assemblies and 

Jam-Nut or Flange-Mount Receptacles for 

Solder Tail, Press Fit or Pigtail 

• Jacket types available: LSZH, PVC, FEP 

and Halar Expando 

• Cable types available in 24, 26, 28, 30 AWG, 

high bandwidth 

• Supports data rates in excess of 10 Gbs and 

differential-pair signaling with low-skew 

pairs & shielding for EMI/RFI protection 

• Meets the following standards: 

SAS 

InfiniBand 

USB 

PCIexpress 

Serial I/O 

Ethernet 

SATA 

• Matched impedance design of 100 Ohm 

• Fully electrically tested 

• Custom lengths built to order. Please 

consult Meritec 

Specifications 

Electrical 

(mated connector pair, less cable) 

• Impedance: 100 ± 10 Ohms differential 

at 100ps rise time 

• Crosstalk (NEXT): < –30 dB up to 5 GHz 

from multiple aggressors 

• Insertion loss: < 1 dB up to 5 GHz 

• Power per contact: 3 amp at 10 °C 

temperature rise 

• Low-level contact resistance: < 20 mΩ, 

(EIA-364-23) 

• Insulation resistance: > 300 MΩ for 1 min 

at 300 VDC, (EIA-364-21) 

• DWV: No defect for 1 min at 300 VDC, 

(EIA-364-20) 

Mechanical 


• Standard contact finish: 100 µ inch 

min Au over 100 µ inch min Ni 

• Aluminum shell with plating options 

• Durability: 500 cycles 

Environmental 

• –40 °C to +175 °C 

• VITA 46 Shock and Vibration 



Protocols Accommodated 

A pp l ic a t io n N o t e s 

Protocols* # 

9 # 

13 # 

17 # 

23 Comments 

USB 2.0 ✔ ✔ ✔ ✔ 

USB 3.0 ✔ ✔ ✔ 

10G E ✔ ✔ ✔ ✔ 10/100 Base -T 

100G E ✔ ✔ ✔ 1000 Base T 

SATA ✔ ✔ 

eSATA ✔ ✔ 

Micro-SATA ✔ ✔ ✔ 

Mini-SAS ✔ ✔ ✔ 

PCIe –16X ✔ ✔ 

4X IB ✔ ✔ 

12X IB 

✔ 

Serial I/O ✔ ✔ 

DVI ✔ ✔ 

Display Port ✔ ✔ ✔ 

HDMI ✔ ✔ ✔ 

Ethernet CX-4 ✔ ✔ ✔ 

* Note: ✔ Indicates the connector will accommodate that specific protocol. 

Additional protocols accommodated are TBD. Multiple protocols may be 

accommodated within a single connector. Please consult the factory. 




MIL-D-38999 Sizes / Pin Maps 

Shell Size 9 (1 lane) 

Number of Pairs: 2 | 0 spares | 8 total contacts | Protocols met: USB 2.0 

Image not to scale. 

Size 9 Plug 

Pigtail Plug Common Grounds 

MAIN KEYWAY 

ROW 1 2 3 4 

A 

G1 DP0+ DP0- G2 

B 

G3 DP1+ DP1- G4 

Size 9 map viewed looking into Plug Contacts. 

Size 9 Receptacles 

Pigtail Receptacle 

Common Grounds 

MAIN KEYWAY 

ROW 4 3 2 1 

A G2 DP0- DP0+ G1 

High Profile Board-Mount 

Receptacle Common Grounds 

ROW 4 3 2 1 

A 

MAIN KEYWAY 

A G2 DP0- DP0+ G1 

B G4 DP1- DP1+ G3 

B 

B G4 DP1- DP1+ G3 

Size 9 map viewed looking into Receptacle Contacts. 





6 | 6 spares | 28 total contacts | Protocols met in addition 

to previous: Internal MiniSAS 


Size 13 Plug 


MAIN KEYWAY 

ROW 

A 

1 2 3 4 5 6 7 8 

SE1 SE2 G1 DP0+ DP0- G2 

B 

G3 DP1+ DP1- G4 DP2+ DP2- G5 SE3 

C 

SE4 G6 DP3+ DP3- G7 DP4+ DP4- G8 

D 

G9 DP5+ DP5- G10 SE5 SE6 



Pigtail Receptacle 

Common Grounds 

High Profile Board-Mount 

Receptacle Common Grounds 

MAIN KEYWAY 

MAIN KEYWAY 

ROW 

8 7 6 5 4 3 2 1 

ROW 

8 7 6 5 4 3 2 1 

A 

G2 DP0- DP0+ G1 SE2 SE1 

A 

G2 DP0- DP0+ G1 SE2 SE1 

B 

SE3 G5 DP2- DP2+ G4 DP1- DP1+ G3 

B 


C 

G8 DP4- DP4+ G7 DP3- DP3+ G6 SE4 

C 


D 

SE6 SE5 G10 DP5- DP5+ G9 

D 

SE6 SE5 G10 DP5- DP5+ G9 






Number of Pairs: 18 | 6 spares | 66 total contacts 

Protocols met in addition to previous: PCIexpress 


Size 17 Plug 


ROW 

A 

MAIN KEYWAY 

1 2 3 4 5 6 7 8 9 10 11 12 13 

SE1 G1 DP0+ DP0- G2 DP1+ DP1- G3 

B 

G4 DP2+ DP2- G5 DP3+ DP3- G6 DP4+ DP4- G7 SE2 SE3 

C 

G8 DP5+ DP5- G9 DP6+ DP6- G10 DP7+ DP7- G11 DP8+ DP8- G12 

D 

G13 DP9+ DP9- G14 DP10+ DP10- G15 DP11+ DP11- G16 DP12+ DP12- G17 

E 

SE4 SE5 G18 DP13+ DP13- G19 DP14+ DP14- G20 DP15+ DP15- G21 

F 

G22 DP16+ DP16- G23 DP17+ DP17- G24 SE6 





ROW 

A 

Pigtail Receptacle Common Grounds 

MAIN KEYWAY 

13 12 11 10 9 8 7 6 5 4 3 2 1 


B 

SE3 SE2 G7 DP4- DP4+ G6 DP3- DP3+ G5 DP2- DP2+ G4 

C 

G12 DP8- DP8+ G11 DP7- DP7+ G10 DP6- DP6+ G9 DP5- DP5+ G8 

D 


E 

G21 DP15- DP15+ G20 DP14- DP14+ G19 DP13- DP13+ G18 SE5 SE4 

F 



High Profile Board-Mount Receptacle Common Grounds 

MAIN KEYWAY 

ROW 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 


B 

SE3 SE2 G7 DP4- DP4+ G6 DP3- DP3+ G5 DP2- DP2+ G4 

C 


D 


E 

G21 DP15- DP15+ G20 DP14- DP14+ G19 DP13- DP13+ G18 SE5 SE4 

F 






Number of Pairs: 44 | 4 spares | 145 total contacts 

Protocols met in addition to previous: PCIe &12X InfiniBand 


Size 23 Plug 


ROW 

MAIN KEYWAY 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 

A 

G1 DP0+ DP0- G2 DP1+ DP1- G3 DP2+ DP2- G4 

B 

G5 DP3+ DP3- G6 DP4+ DP4- G7 DP5+ DP5- G8 DP6+ DP6- G9 DP7+ DP7- G10 

C 

SE1 SE2 G11 DP8+ DP8- G12 DP9+ DP9- G13 DP10+ DP10- G14 DP11+ DP11- G15 DP12+ DP12- G16 

D 

G17 DP13+ DP13- G18 DP14+ DP14- G19 DP15+ DP15- G20 DP16+ DP16- G21 DP17+ DP17- G22 DP18+ DP18- G23 

E 


F 


G 

SE3 SE4 G38 DP31+ DP31- G39 DP32+ DP32- G40 DP33+ DP33- G41 DP34+ DP34- G42 DP35+ DP35- G43 

H 

G44 DP36+ DP36- G45 DP37+ DP37- G46 DP38+ DP38- G47 DP39+ DP39- G48 DP40+ DP40- G49 

I 

G50 DP41+ DP41- G51 DP42+ DP42- G52 DP43+ DP43- G53 




Size 23 

Receptacles 

ROW 

Pigtail Receptacle Common Grounds 

MAIN KEYWAY 

19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

G4 DP2- DP2+ G3 DP1- DP1+ G2 DP0- DP0+ G1 

B 

G10 DP7- DP7+ G9 DP6- DP6+ G8 DP5- DP5+ G7 DP4- DP4+ G6 DP3- DP3+ G5 

C 

G16 DP12- DP12+ G15 DP11- DP11+ G14 DP10- DP10+ G13 DP9- DP9+ G12 DP8- DP8+ G11 SE2 SE1 

D 

G23 DP18- DP18+ G22 DP17- DP17+ G21 DP16- DP16+ G20 DP15- DP15+ G19 DP14- DP14+ G18 DP13- DP13+ G17 

E 


F 


G 


H 


I 



High Profile Board-Mount Receptacle Common Grounds 

ROW 

MAIN KEYWAY 

19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 


B 


C 


D 


E 


F 


G 


H 


I 






38999 Cable Plug & Flanged Receptacle 

Cable Plug 

Ø Dim “A” 

Dim “B” 

Shell Size “A” Max. “B” 

9 .86 [21.8] 1.46 [37.1] 

13 1.15 [29.4] 2.15 [54.7] 

17 1.40 [35.7] 2.15 [54.7] 

23 1.77 [44.9] 2.15 [54.7] 

Flanged Receptacle 

Dim “A” 

Dim “B” 

Dim “C” 

Dim 

“F” 

Dim “G” Panel Thickness 

Dim“D” 

Dim“E” 

Shell 

Size 

“A” ±0.01 

[±0.3] “B” “C” 

“D” ±0.008 

[±0.20] 

“E” ±0.008 

[±0.20] “F” Max. “G” Max. 

9 0.94 [23.8] 0.719 [18.26] 0.594 [15.09] 0.216 [5.49] 0.128 [3.25] 0.82 [20.9] 0.234 [5.94] 

13 1.13 [28.6] 0.906 [23.01] 0.812 [20.62] 0.194 [4.93] 0.128 [3.25] 0.82 [20.9] 0.234 [5.94] 

17 1.31 [33.3] 1.062 [26.97] 0.969 [24.61] 0.194 [4.93] 0.128 [3.25] 0.82 [20.9] 0.234 [5.94] 

23 1.69 [42.9] 1.375 [34.93] 1.250 [31.75] 0.242 [6.15] 0.154 [3.91] 0.79 [20.1] 0.204 [5.18] 

38999 Jam Nut Receptacle 

Dim “A” 

Dim “B” 

Dim “E” Panel Thickness 

Dim “D” 

Ø Dim “C” 

.89 [22.6] Max. 

Shell Size 

“A” ±0.016 

[±0.4] “B” Max. “C” Ø Max. 

“D” =+.004/–.006 

[+0.10/–0.15] “E” Max. 

9 1.06 [27.0] 0.91 [23.0] 1.20 [30.5] 0.650 [16.53] 0.126 [3.20] 

13 1.37 [34.9] 1.22 [31.0] 1.51 [38.4] 0.938 [23.82] 0.126 [3.20] 

17 1.63 [41.3] 1.46 [37.0] 1.76 [44.8] 1.187 [30.15] 0.126 [3.20] 

23 2.06 [52.4] 1.85 [47.0] 2.20 [55.9] 1.562 [39.67] 0.138 [3.50] 




38999 Board Mount Receptacle Tail Length Dimensions 

Square 

Flange 

High Profile 

Square 

Flange 

Low Profile 

Dim “A” 

Dim “B” 

Tail Length 

Dim “A” 

Size 23 

Square 

Flange 

Sizes: 

9, 13 & 17 

Square 

Flange 

Dim “A” 

Dim “B” 

Low Profile .18 [4.6] .10 [2.5] 

High 

Profile 

.59 [15.0] .10 [2.5] 

.59 [15.0] .15 [3.8] 

.59 [15.0] .20 [5.1] 

.59 [15.0] .25 [6.4] 

Low Profile .15 [3.8] .10 [2.5] 

High 

Profile 

.56 [14.2] .10 [2.5] 

.56 [14.2] .15 [3.8] 

.56 [14.2] 20 [5.1] 

.56 [14.2] .25 [6.4] 

Dim “B” 

Tail Length 

Jam Nut 

High Profile 

Jam Nut 

Low Profile 

Dim “C” 

Dim “D” 

Tail Length 

Dim “C” 

Size 23 

Jam Nut 

Dim “C” 

Dim “D” 

Low Profile .15 [3.9] .10 [2.5] 

High 

Profile 

Sizes: 

9, 13 & 17 High 

Jam Nut Profile 

.57 [14.6] .10 [2.5] 

.57 [14.6] .15 [3.8] 

.57 [14.6] .20 [5.1] 

.57 [14.6] .25 [6.4] 

Low Profile .12 [3.0] .10 [2.5] 

.54 [13.7] .10 [2.5] 

.54 [13.7] .15 [3.8] 

.54 [13.7] 20 [5.1] 

.54 [13.7] .25 [6.4] 

Dim “D” 

Tail Length 




Size 9 & 13 PCB Layouts 

• DXF files available upon request at www.meritec.com 

• See Pages 4 and 5 for Pin Mapping 

o DP= Differential Pair (Signals) 

o SE= Spare Contacts 

o G= Grounds 

Size 9 

Receptacle Shell Main Keyway Shown as Wall Mount 

DP0– 

DP0+ 

.053 [1.33] 

G2 

G1 

.025 [0.62] 

0 

.025 [0.62] 

.053 [1.33] 

G4 

G3 

Note: connector side 

of circuit board shown. 

DP1– 

DP1+ 

.066 [1.68] 

.150 [3.81] 

Plated Through Hole 

Ø .021±.002 [.053±.005] for Solder Tails 

Ø .019±.002 [.048±.005] for Pressfit Tails 

Drilled Hole 



Size 13 


G2 

SE1 

.158 [4.00] 

SE3 

G3 

.053 [1.33] 

0 

.053 [1.33] 

.158 [4.00] 

G8 

SE4 



SE6 

G9 

.155 [3.92] 

.146 [3.70] 

.121 [3.06] 

.096 [2.43] 

0 




Drilled Hole 






Size 17 & 23 PCB Layouts 

• DXF files available upon request at www.meritec.com 

• See Pages 6 to 9 for Pin Mapping 

o DP= Differential Pair (Signals) 

o SE= Spare Contacts 

o G= Grounds 

Size 17 

.263 [6.67] 

.158 [4.00] 

.053 [1.33] 

0 

.053 [1.33] 

.158 [4.00] 

.263 [6.67] 

SE3 

G12 

G17 

G21 

G3 

SE6 

.271 [6.87] 


.246 [6.24] 

.146 [3.70] 

.071 [1.79] 

0 

SE1 

G4 

G8 

G13 

SE4 

G22 






Drilled Hole 



Size 23 

.420 [10.67] 

.315 [8.00] 

.210 [5.33] 

.105 [2.67] 

0 

.105 [2.67] 

.210 [5.33] 

.315 [8.00] 

.420 [10.67] 

G4 

G10 

G16 

G23 

G30 

G37 

G43 

G49 

G53 

.421 [10.86] 

.396 [10.05] 


.321 [8.14] 

.196 [4.97] 

0 

G1 

G5 

SE1 

G17 

G24 

G31 

SE3 

G44 

G50 






Drilled Hole 





Part # Scheme 

9850 Cable Plug Assembly 

Additional 

Information 

MIL 38999 Series III 

Shell Size 

09 

13 

17 

23 

Plug End 1 

Cable Exit 

S=Straight 

A=Angled 

Keying 

N 

A 

B 

C 

D 

Plug End 2 

Cable Exit 

S=Straight 

A=Angled 

P=Pigtail 

X=Other 

Keying 

N 

A 

B 

C 

D 

X* 

Shell Plating 

Finishes 

W=Olive Drab Cad 

F= Electroless Ni 

K=Stainless 

T=Ni PTFE 

Z=Black Zinc Ni 

Cable 

AWG 

E=24 AWG 

F=26 AWG 

G=28AWG 

H=30AWG 

X=Other 

Complete Assembly 

Length 

0.0 

(meters) 

98 50 09 SN SN W G 0 . 5 

Tolerance Table 

“L” Length 

Tolerance 

Up to 1M (39.37") ±40.0mm (1.57") 

1M (39.37") to 10M (393.70") ±70.0mm (2.76") of “L” 

Greater than 10M (393.70") ±100mm (3.94") of “L” 

“L” 

* Note: “X” indicates that Keying is not applicable due to “Pigtail” or “Other” type of connector. 



Part # Scheme 

9851 Cabled Receptacle (Pigtail) 

Additional 

Information 


Shell Size 

09 

13 

17 

23 

Type 

J=Jam Nut 

F=Flange 

Receptacle End 1 

Keying Cable Exit 

N 

A 

B 

C 

D 

S=Straight 

A=Angled 

End 2 

S=Straight 

A=Angled 

P=Pigtail 

X=Other 

Shell Plating 

Finishes 



K=Stainless 

T=Ni PTFE 


Cable 

AWG 

E=24 AWG 

F=26 AWG 

G=28AWG 

H=30AWG 

X=Other 

Complete Assembly 

Length 

0.0 

(meters) 

98 51 09 F N S P W G 0 . 5 

Tolerance Table 

“L” Length 

Tolerance 

Up to 1M (39.37") ±40.0mm (1.57") 

1M (39.37") to 10M (393.70") ±70.0mm (2.76") of “L” 

Greater than 10M (393.70") ±100mm (3.94") of “L” 

“L” 



Part # Scheme 

9852 Board Mount Receptacle 

Additional 

Information 


Shell Size 

09 

13 

17 

23 

Receptacle 

Type Keying 

J=Jam Nut 

F=Flange 

N 

A 

B 

C 

D 

Tail Style* 

P=Press Fit 

S=Solder Tail 

Low/High 

Profile** 

L=Low 

H=High 

Shell Plating 

Finishes 



K=Stainless 

T=Ni PTFE 


Tail 

Length 

A=.100" 

B=.150" 

C=.200" 

D=.250" 

98 52 09 F N P H W A 

Available Profile Options 

Tail Length Low High 

A=.100" S P & S 

B=.150" N/A S 

C=.200" N/A S 

D=.250" N/A S 

* If “P” press fit, only high profile “H” and .100" “A” available. 

** If “L” low profile, only .100" “A” available. 



Accessories 

98532 Plug Protective Cap 


Shell Size 

Shell Plating 

Finishes 

Accessories 

Length 

Eyelet or 

Ring Size 

09 

13 

17 

23 



K=Stainless 

T=Ni PTFE 


R=Accessories 

1/2" 

Increments 

Table Provided 

on the Meritec 

Website: 

www.meritec.com 

98 532 23 W R 

5.0 

20 

98533 Receptacle Protective Cap 


Shell Size 

09 

13 

17 

23 

Shell Plating 

Finishes 



K=Stainless 

T=Ni PTFE 


Accessories 

R=Accessories 

Length 

1/2" 

Increments 

Eyelet or 

Ring Size 

Table Provided 

on the Meritec 

Website: 

www.meritec.com 

98 533 23 W R 

5.0 

20 



Accessories 

98534 Gasket 


Shell Size 

09 

13 

17 

23 

98 534 23 

98535 Nut Plate 


Shell Size 

09 

13 

17 

23 

98 535 23 

98536 Stowage Receptacle 


Shell Size 

09 

13 

17 

23 

Shell Plating 

Finishes 



K=Stainless 

T=Ni PTFE 


98 536 23 W 



Excerpt from Report #886 

Signal Integrity Performance Test Report 

Purpose 

Samples 

Tested 

Conclusions 

To determine the signal integrity performance of the Meritec Hercules ® Connector System 

comprised of a 1 meter, 28 AWG plug cable assembly and two flange mount board receptacles. 

1 meter, 28 AWG, Size 23 Meritec Hercules ® Plug Cable Assembly (Meritec P/N: 

985023SNSNWG1.0) Size 23, flange mount, Meritec Hercules ® Board Receptacle with 0.100" 

press-fit tails (Meritec P/N: 985223FNPHWA) 

A 1 meter, 28 AWG, Size 23 Meritec Hercules ® Plug Cable Assembly was mated with the Size 23 

Meritec Hercules ® Flange Mount Board Receptacles with 0.100" press-fit tails. The board 

receptacles were mounted to the Meritec Hercules ® SI test boards. 

Measurements of the setup were taken and recorded, and they include the cable assembly, 

board connectors and test board vias. Insertion loss through the 1 meter cable and two pairs 

of mated cable and board connectors was less than –9 dB up to 10 GHz (see Figure 1). At 5 

GHz, which represents the Niquist frequency (1st harmonic) for a 10 Gb/s signal, the setup has 

roughly –4.5 dB insertion loss. The 1 meter, unterminated, bulk cable has roughly –3.1 dB loss 

at this frequency. This means that the two pairs of connectors have a total of –1.4 dB of loss at 5 

GHz, or –0.7 dB of loss for a single mated cable plug and board receptacle. 

Also, the cable assembly is well within the InfiniBand 10 Gb/s (QDR) insertion loss 

specification. The cable assembly and board receptacle setup also exhibits very good return 

loss of less then –10 dB up to 7 GHz (see Figure 2). The return loss present is also within the 

InfiniBand 10 Gb/s (QDR) return loss specification. 

Crosstalk measurements were also performed on one victim pair surrounded by seven 

aggressor pairs (see Figure 3). This setup represents the worse possible condition. The first 

measurements performed were with the aggressors coming from the near-end while the 

second measurements were performed with the aggressors coming from the far-end. The 

power sum of all the aggressors was then calculated for each of the near-end and the 

far-end aggressors. These measurements differ depending on which pairs are designated 

as transmit pairs and which ones are designated as receive pairs. Crosstalk coming from 

the seven near-end aggressors was around less than –30 dB up to 5 GHz (see Figure 4). 

Crosstalk coming from seven far-end aggressors was around –30 dB up to 5 GHz as well 

(see Figure 4). 

An eye diagram at 10 Gb/s data rate running through the mated cable assembly and board 

receptacles setup was also simulated. The eye is wide open, and it has 560 mV height, 89.8 

ps width and exhibits a total jitter of 10.2 ps. 

Differential impedance through the connector system is between 96 and 104 ohms at 100 

ps incoming pulse risetime (20–80%) and well within the InfiniBand specification limits of 

100 ±10 ohms (see Figure 6). 

Equipment 

Tektronix DSA8200 Digital Serial Analyzer with 80E04 TDR modules Meritec Size 23 Hercules 

SI test boards (P/N: 602177 Rev.B) 





Figure 1 Insertion loss (IL) 

Figure 2 Return Loss on Meritec cable end #1 





G S S G S S G S S G 

G S S G S S G S S G 

G S S G S S G 

Figure 3 Crosstalk measurement setup. The G represents the ground contacts, while the S 

represents the signal contacts. The differential pair in red color represent the victim pair while 

the differential pairs in blue color represent the aggressor pairs. 

Figure 4 Near-end & Far-end crosstalk power-sums 

from 7 closest neighbors. 



HERCULES ARINC Insert 

HERCULES Board Interface (HBI) 

Meritec HERCULES ® ARINC Insert Series 

Using the reliability of ARINC and the signal integrity and density of 

Hercules, Meritec now provides a fully compatible insert for the ARINC 

600 series. Designed to work with the shell size 1, 2 & 3, cavities 

A, B, D & E the insert provides 78 differential pairs, 39 lanes and 

supports up to 3 amps per contact when needed. ARINC no longer has 

to be limited to low-speed data and power distribution. With the 

Hercules ARINC insert, speeds of 10 Gbs can be realized maintaining 

the absolute best in high-speed performance. 

FEATURES 

› 10 Gbs per lane 

› –65 °C to + 125 °C operational temperature 

› Supports power up to 3 amps per trace 

› 10,000+ mating/unmating cyles* 

› RoHS compliant 

› 247 contacts supporting 78 differential pairs/39 lanes 

› Able to support most all high-speed protocols including USB 3.0, 

Display Port and more 

› Each contact plated with min. 100 µin Gold over 100 µin Nickel 

› 360° shield to the ARINC shell. 

* Hercules ARINC insert only. 

Meritec HERCULES ® Board-Interface (HBI) System 

As part of Meritec’s HBI system we now offer a high speed transition 

flexible printed circuit (FPC) designed exclusively for Hercules 

receptacle to board mating. The Hercules Board Interface Series 

completes the IO run from board to box – box to board. While 

providing unprecedented signal density, the pinout accommodates 

differential pairs, coaxial and single lines for hook up or power. All IO 

lines are accommodated! Giving you the flexibility to use this 

transition flex for all of your Hercules designs. 

FEATURES 

› 10 Gbs per lane 

› Interfaces with both high & low profile Hercules solder tails 

› Supports power up to 3 amps per trace 

› Designed for Size 23 38999 Hercules receptacle. 

› RoHS compliant 

› Made with DuPont Pyralux ® 

› 145 contacts supporting 44 differential pairs/22 lanes 

› Able to support most all high-speed protocols including USB 3.0, 

Display Port and more 



HERCULES ® Board-Interface 

System (HBI) 

Meritec’s HBI system extends the present Hercules product line to include additional options for terminating 

receptacles inside of the box. 

 

 

 

 


Supports data rates in excess of 10 Gbs 

Matched impedance design of 100 Ohm 

Fully electrically tested 

Receptacle mates with standard Hercules 

38999 plug assemblies 


ELECTRICAL: 

Impedance 100 ± 10 Ohms differential 

at 100ps rise time 

 

 

Crosstalk (NEXT):

® 

HERCULES Board Interface 

System (HBI) 

" W " 

BOARD INTERFACE 

CONNECTOR 

SIZE 23 FLANGE MOUNT SHOWN 

5.20 in [132 mm] 

SHELL SIZE "W" WIDTH 

BOARD INTERFACE 

CONNECTOR (SAMTEC) 

9 .95 in [24.13 mm] (1) ST4-10 

13 1.15 in [29.21 mm] (1) ST4-20 

17 1.3 in [33.02 mm] (2) ST4-20 

23 1.7 in [43.18 mm] (2) ST4-40 

PART NUMBER ORDERING SPECIFICATION 

CONTACT FACTORY FOR AVAILABILITY 

* STANDARD LENGTH 

CONFIDENTIAL AND PROPRIETARY NOTICE: This document and the information contained in it are confidential property of Meritec. 

The document and information are provided to you for your review and evaluation and must not be furnished or disclosed to 

others without prior written consent by an authorized representative of Meritec. 



4X (S FF-8470) Interface embedded within a 

MIL-C -38999 Circular S hell 

MERITEC • 1359 WEST JACKSON STREET • 

POST OFFICE BOX 8003 • PAINESVILLE, 

OHIO 44077 PHONE: 888-MERITEC or (888- 

637-4832) / (440) 354-3148 • FAX: (440) 354- 

0509 • WWW.MERITEC.COM 

MIL-C-38999 Shell with 

embedded SFF-8470 Plug 

Meritec’s 4X (SFF-8470) 

Plug Termination with 

LSZH cable and its 

Receptacle embedded in 

the mating rugged circular 

MIL-C-38999 shells 

provides both a durable 

and high bandwidth 

interconnect scheme 

suitable for many Military, 

Airborne and Medical 

applications not previously 

accommodated by industry 

standard interconnects. 


embedded SFF-8470 

Receptacle to Pigtail 


embedded SFF-8470 

Feed-Thru Receptacle 

Meritec’s LSZH cable assemblies support 

differential pair signaling with low-skew 

pairs and with shielding for maximum 

EMI/RFI protection. Meritec’s cable 

technology allows data rates in excess of 

6.0 Gb/s and meets or exceeds SAS, 

InfiniBand, Ethernet CX4 and SATA 

requirements. Reduced crosstalk and low 

insertion loss enhance the scalability. 

FEATURES and BENEFITS: 

• LSZH (Low Smoke Zero Halogen) jacketed 

cable 

• Available in 24, 26, 28 and 30 AWG cable 

• Optional connectors are available for both 

Cable assemblies and Pigtail assemblies 

• Durable SFF-8470 Receptacles 

• Rugged light weight Aluminum MIL-C-38999- 

Series III Size 23, Circular Shells 

• Supports data rates in excess of 6.0 Gb/s 

• Meets or exceeds SAS, InfiniBand, Ethernet 

CX4 and SATA specifications 

• Matched impedance design of 100 Ohm +/- 

10% 

• Mated cycles – 250 minimum 


• Available lengths built to order 

CABLE SPECIFICATIONS 

ELECTRICAL: 

• Impedance 

• Crosstalk: (NEXT) 

• Plug Cable Assembly 

Insertion loss: 

E NVIR ONME NTAL: 

• Cable insulating material: 

• Operating temperature: 

• UL Listed materials 

• Contact material: 

• Standard contact finish: 

• Plating: 

• Durability: 

100 +/- 10 ohms differential at 

100psec risetime 

4X (SFF-8470) Interface embedded within a 

MIL-C-38999 Circular Shell 

SI 

S2 

"L1" 

1.89 

48.09 

"L2" 

S16 

S15 

S15 

S16 

P1* 

4X PLUG IN MIL-C-38999 

SERIES III, SIZE 23 SHELL 

P2 

P3 P4 

FEED THRU 

RECEPTACLE 

P5 P6* 

4X PLUG ASSEMBLY 

S2 

S1 

FLANGE MOUNT OR 

JAM NUT STYLE SHELLS 

A. 

* OPTIONS (P1, P4, P6) 

CIRCULAR 38999 (AS SHOWN) 

"L3" 

S16 

S15 

B. 

C. 

4X STRAIGHT TS 

4X ANGLED TS 

P3 

4X PIGTAIL ASSEMBLY 

P4* 

S2 

S1 

D. 

4X STRAIGHT LATCH 

E. 

4X ANGLED LATCH 

F. 

MINI-SAS 

G. 

QSFP 

H. 

OTHER (RJ, SFP+, HM 2mm, ETC.) 

WIRING DIAGRAM 4X TO 4X* 

P1 END P2 END P3 END P4 END P5 END P6 END 

S1 S16 S1 S16 S1 S16 

S2 S15 S2 S15 S2 S15 

S3 S14 S3 S14 S3 S14 

S4 S13 S4 S13 S4 S13 

S5 S12 S5 S12 S5 S12 

S6 S11 S6 S11 S6 S11 

S7 S10 S7 S10 S7 S10 

S8 S9 S8 S9 S8 S9 

S9 S8 S9 S8 S9 S8 

S10 S7 S10 S7 S10 S7 

S11 S6 S11 S6 S11 S6 

S12 S5 S12 S5 S12 S5 

S13 S4 S13 S4 S13 S4 

S14 S3 S14 S3 S14 S3 

S15 S2 S15 S2 S15 S2 

S16 S1 S16 S1 S16 S1 

G1-G9 SIGNAL GROUNDS 

* FOR PINOUT TERMINATIONS OPTIONS F THRU H CONSULT FACTORY 



4X (SFF-8470) Interface embedded within a 

MIL-C-38999 Circular Shell 

PART NUMBER ORDERING SPECIFICATION: 

CIRCULAR 4X FEED-THRU 

MOUNTING 

STYLE 

9842 - A - 

RETENTION 

TYPE 

TS 

A = JAM NUT 

B = FLANGE 

TS = THUMBSCREW 

LT = LATCH 


WITH PIGTAIL 

MOUNTING 

STYLE 

WIRE 

AWG 

LENGTH IN 

METERS 

9843 A - 24 - 00.0 - A 

TERMINATION 

STYLE 

A = JAM NUT 

B = FLANGE 

24 = 24 AWG 

26 = 26 AWG 

28 = 28 AWG 

30 = 30 AWG 

A = CIR 4X PLUG-STANDARD 

CUSTOM OPTIONS: 

= 4X STRAIGHT TS 

B 

C = 4X ANGLED TS 

D = 4X STRAIGHT LATCH 

E = 4X ANGLED LATCH 

F = MINI-SAS 

G = QSFP 

H = OTHER (RJ,SFP+,HM2mm,etc.) 

CIRCULAR 4X PLUG TO 

OPTIONAL PLUG CABLE 

ASSY 

PLUG 

STYLE 

WIRE 

AWG 

LENGTH IN 

METERS 

9844 A - 24 - 00.0 - A 

A = CIR 4X 

PLUG 

24 = 24 AWG 

26 = 26 AWG 

28 = 28 AWG 

30 = 30 AWG 

TERMINATION 

STYLE 

A = CIR 4X PLUG-STANDARD 

CUSTOM OPTIONS: 

= 4X STRAIGHT TS 

B 

C = 4X ANGLED TS 

D = 4X STRAIGHT LATCH 

E = 4X ANGLED LATCH 

F = MINI-SAS 

G = QSFP 

H = OTHER (RJ,SFP+,HM2mm,etc.) 


DUST COVER 

984520-01 



4X (SFF-8470) PDA 

Meritec’s new Printed Direct Attach (PDA) is in addition to Meritec’s original “Direct Attach” 4X line of InfiniBand 

cables and is also a more cost effective solution. While the Direct Attach line provided superior performance when 

compared to all other industry standard offerings, the PDA line meets or exceeds the same rigorous industry 

standards at a more than competitive price. The signal conductors in the cable are directly attached to the printed 

circuit board which then becomes direct interface with the contacts in the board receptacle. 


• Available in 24, 26, 28 and 30 AWG 

• Optional connectors are available 


• Supports data rates in excess of 

6.0 Gb/s 

• Meets or exceeds SAS, InfiniBand, 

Ethernet CX4 and SATA specs 

• Matched impedance design of 100 

Ohm +/- 10% 




• A cost effective, industry 

compliant solution 


ELECTRICAL: 

• Impedance: 100+/- ohms differential 

at 100 psec risetime 

• Crosstalk: (NEXT) 4% at 100ps 

(multiple aggressors) 

• Insertion Loss: 1M 28awg cable – 

1.3dB @ 1.5GHz connectors – 

0.8dB per pair at 1.5GHz 

• Skew:

4X (SFF-8470) PDA 

SLIDE LATCH CABLE 

14.2 

.56 

"L" LENGTH 

S16 

S15 

7.0 

.28 

46.6 

1.84 

S16 

S15 

24.7 

.97 

S2 

P1 

S1 

LATCH ACTUATOR 

S2 

P2 

S1 

8.7 

.34 

STANDARD PINOUT 

WIRING DIAGRAM 

PLUG 1 PLUG 2 

S1 S16 

S2 S15 

S3 S14 

S4 S13 

S5 S12 

S6 S11 

S7 S10 

S8 S9 

S9 S8 

S10 S7 

S11 S6 

S12 S5 

S13 S4 

S14 S3 

S15 S2 

S16 S1 

THUMBSCREW CABLE 

14.3 

.56 

"L" LENGTH 

S16 

S15 

6.7 

.27 

42.6 

1.68 

S16 

S15 

29.8 

1.17 

S2 

P1 

S1 

M2.5 THUMBSCREW 

S2 

P2 

S1 

8.7 

.34 



12X (SFF-8470) PDA 

Meritec’s new Printed Direct Attach (PDA) is in addition to Meritec’s original “Direct Attach” 12X/4X line of 

InfiniBand cables and is also a more cost effective solution. While the Direct Attach line provided superior 

performance when compared to all other industry standard offerings, the PDA line meets or exceeds the same 

rigorous industry standards at a more than competitive price. The signal conductors in the cable are directly 

attached to the printed circuit board which then becomes direct interface with the contacts in the board receptacle. 


• Available in 24, 26, 28 and 30 AWG 

• Optional connectors are available 


• Supports data rates in excess of 

6.0 Gb/s 

• Meets or exceeds SAS, InfiniBand, 

Ethernet CX4 and SATA specs 

• Matched impedance design of 100 

Ohm +/- 10% 




• A cost effective, industry 

compliant solution 


ELECTRICAL: 

• Impedance: 100+/- ohms differential 

at 100 psec risetime 

• Crosstalk: (NEXT) 4% at 100ps 

(multiple aggressors) 

• Insertion Loss: 1M 28awg cable – 

1.3dB @ 1.5GHz connectors – 

0.8dB per pair at 1.5GHz 

• Skew:

12X (SFF-8470) PDA 

SLIDE LATCH CABLE 

14.7 

.58 

S48 

S47 

7.0 

.27 

48.0 

1.89 

"L" LENGTH 

S48 

S47 

49.0 

1.93 

S2 

P1 

S1 

LATCH ACTUATOR 

S2 

P2 

S1 

8.3 

.33 

STANDARD PINOUT 


PLUG 1 PLUG 2 

S1 S48 

S2 S47 

S3 S46 

S4 S45 

S5 S44 

S6 S43 

S7 S42 

S8 S41 

S9 S40 

S10 S39 

S11 S38 

S12 S37 


PLUG 1 PLUG 2 

S13 S36 

S14 S35 

S15 S34 

S16 S33 

S17 S32 

S18 S31 

S19 S30 

S20 S29 

S21 S28 

S22 S27 

S23 S26 

S24 S25 


PLUG 1 PLUG 2 

S25 S24 

S26 S23 

S27 S22 

S28 S21 

S29 S20 

S30 S19 

S31 S18 

S32 S17 

S33 S16 

S34 S15 

S35 S14 

S36 S13 


PLUG 1 PLUG 2 

S37 S12 

S38 S11 

S39 S10 

S40 S9 

S41 S8 

S42 S7 

S43 S6 

S44 S5 

S45 S4 

S46 S3 

S47 S2 

S48 S1 

THUMBSCREW CABLE 

14.4 

.57 

S48 

S47 

6.9 

48.5 

.27 1.91 

"L" LENGTH 

S48 

S47 

53.6 

2.11 

S2 

P1 

S1 

9.7 

.38 

M2.5 THUMBSCREW 

S2 

P2 

S1 



NX+ Board Mount Receptacles 

SFF-8473 4X & 12X 

12X LATCH WITH PANEL MOUNT 

4X LATCH 

Meritec’s NX+ brand product family includes PCB surface mount, SFF-8473 IO connector receptacles that 

mate with all SFF-8470 cable assemblies and offer improved crosstalk performance at InfiniBand 5G DDR, 

10G QDR and the developing 20G EDR data rates. 


4X and 12X configurations available 

Meets the SFF-8473 Enhanced Shielded Multi- 

Lane specification; see www.sffcommittee.org 

for SFF specs 

Performance enhanced to 20Gbps per 

differential pair or lane in combination with 

Meritec enhanced NX cable assemblies 

Improved crosstalk and insertion loss 

Die cast housings for rugged applications 

Screw and Solder Post hold down features 

available 

Latch attachment (Thumbscrew options 

available 1 st quarter of 09) 

RoHS compliant 

Removable tab for pick and place applications 

SMT configuration 

Panel mount option 

Supports Ethernet CX-4, Myrinet, RapidIO, 

Aurora and other high speed IO applications 

Optional EMI shield available 

Optional EMI gasket available 


ELECTRICAL: 

Current rating: 

Contact resistance: 

Dielectric withstanding 

voltage: 

Insulation resistance: 

Impedance: 

MECHANICAL: 

Contact material: 

Standard contact finish: 

Die cast shell with Ni 

plating 

Durability: 

½ amp per contact 

10 milliohms 

300VDC 

100Mohms minimum 

100 +/- 10 ohms differential at 

50psec risetime (20-80%) 

Low crosstalk:

SOLDER POST ATTACHMENT 

SFF-8473 4X Board Mount Receptacle 

REMOVABLE 

PICK AND PLACE TAB 

12.7 

EMI 

GASKET 

(OPTIONAL) 

6.4 

M2X0.4 THRU 

6.0 

0.5 

8.5 

2.5 

13.0 

10.2 

15.4 

11.3 

13.0 

14.9 

S1 

SHOWN WITHOUT OPTIONAL PANEL MOUNT 

S1 

SHOWN WITH OPTIONAL PANEL MOUNT 

6.6 

REMOVABLE 


21.3 

12.7 

1.8 THRU 

0-80 UNF 

THRU 

12.7 

12.7 

24.9 

BELLY TO BELLY CONFIGURATION 

EMI 

GASKET 

(OPTIONAL) 

6.4 

M2X0.4 THRU 

24.9 

6.0 

0.5 

8.5 

2.5 

13.0 

10.2 

15.4 

S1 

S1 


S1 

11.3 

13.0 

S1 


14.9 

6.6 

Screw Length 

7.6mm + PCB Thickness 

2.4 MIN. 

BOARD 

THICKNESS 




REMOVABLE 


SCREW ATTACHMENT 

21.3 

12.7 

4X 0-80 UNF 

THRU 

EMI 

GASKET 

(OPTIONAL) 

6.4 

M2X0.4 THRU 

24.9 

6.0 

11.3 

13.0 

14.9 

12.7 

0.5 

8.5 

2.5 

13.0 

10.2 

15.4 

S1 


S1 


6.6 

Screw Length 


4X RECEPTACLE FOOTPRINT 

18.3 ±0.05 

0.254 ±0.025 

.05 A S 

15.2 ±0.05 

3.0 ±0.05 

0.254 ±0.025 

.05 A S 

SIGNAL 

4.6 

0.00 

+0.05 

1.9 

GROUND 

+ 0.05 

1.8 - 0.05 (PTH) 

(4) PLCS 

A 

A 

S1 

0.00 

0.05 

- 

1.8 

3.9 ±0.05 

0.00 

0.05 

4.6 - 

±0.05 

5.8 

0.95 

+0.05 

0.00 

1.9 

0.75 

1.6 

+0.05 

1.8 0.00 (TH) 

(2) PLCS 

A 

DETAIL A 

SCALE 2 : 1 

DIMENSIONS TO BE USED AS REFERENCE ONLY - PLEASE REFER TO SALES DRAWINGS FOR DETAILED DIMENSIONS 

SPECIFICATIONS SUBJECT TO CHANGE 




PANEL CUTOUT 

22.7 ±0.1 

19.7 ±0.1 

WITH PANEL MOUNT OPTION 

2.5 

R0.3 

MAX. (8X) 

10.3 ±0.1 

7.2 ±0.1 

8.1 ±0.1 

RECOMMENDED 4X PANEL CUTOUT 

(RECOMMENDED THICKNESS OF PANEL : 1.0 +/-0.1 MM) 


Part number specification - Fill in part number specification from the information on the chart below. 

Size: 

Code 

37 

39 

98 3 7 22A L 2QM 

SIZE 

Description 

4X 

12X 

ATTACHMENT 

HOLD 

DOWN 

PICK & 

PLACE 

TAB 

Attachment: 

Code Description 

L Latch 

PACKAGE 

CODE 

Pick & Place Tab: 


N None 

P Pick & Place Tab 

Package: 


F Tray 

K Tape & Reel 

Hold Down: 


A Mounting screws 

B Solder posts 

C Mounting screws with top panel mount 

D Solder posts with top panel mount 

E Belly-to-Belly 

F Belly-to-Belly with top panel mount 

Options: 

EMI Shield - P/N 986025-04 

EMI Gasket - P/N 986026-04 




REMOVABLE 


SOLDER POST ATTACHMENT 

12.7 

6.4 

M2x0.4 THRU 

6.0 

0.5 

8.5 

2.5 

13.0 

10.2 

11.3 

13.0 

14.9 

12.7 

48.9 

EMI 

GASKET 

(OPTIONAL) 

15.4 

S1 



S1 

6.6 

BELLY TO BELLY CONFIGURATION 

REMOVABLE 


1.2 THRU 

0-80 UNF 3.6 

45.3 

12.7 

1.8 

THRU 

EMI 

GASKET 

(OPTIONAL) 

6.4 

M2x0.4 THRU 

6.0 

0.5 

8.5 

2.5 

13.0 

11.3 

13.0 

14.9 

12.7 

48.9 

10.2 

15.4 

S1 

S1 

S1 

S1 

6.6 



Screw Length 


2.4 MIN. 

BOARD 

THICKNESS 



SCREW ATTACHMENT 


REMOVABLE 


45.3 

12.7 

0-80 UNF THRU 

(4) PLCS 

EMI 

GASKET 

(OPTIONAL) 

6.4 

M2x0.4 THRU 

48.9 

6.0 

12.7 

0.5 

8.5 

2.5 

13.0 

11.3 

10.2 

13.0 

15.4 

14.9 


S1 


S1 

6.6 

Screw Length 


12X RECEPTACLE FOOTPRINT 

42.2 ±0.05 

39.2 ±0.05 

E 

S1 

A 

0.00 

0.05 

3.0 ±0.05 

1.8 - 

±0.05 

3.9 

0.00 

4.6 - 0.05 

5.8 ±0.05 4.6 

0.254 ±0.025 

.05 A S 

0.00 

+0.05 

1.9 

0.254 ±0.025 

.05 A S 

SIGNAL 

GROUND 

+ 0.05 

1.8 - 0.05 (PTH) 

(4)PLCS 

0.95 

+0.05 

0.00 

1.9 

0.75 

1.6 

+0.05 

1.8 0.00 (TH) 

(2)PLCS 

A 

DETAIL E 

SCALE 2 : 1 



PANEL CUTOUT 


46.7 ±0.1 

2.5 

43.1 ±0.1 

WITH PANEL MOUNT OPTION 

R0.3 

max. (8X) 

10.3 ±0.1 

7.2 

±0.1 

8.1 ±0.1 

RECOMMENDED 12X PANEL CUTOUT 

(RECOMMENDED THICKNESS OF PANEL : 1.0 +/-0.1 MM) 


Part number specification - Fill in part number specification from the information on the chart below. 

Size: 

Code 

37 

39 

98 3 7 22A L 2QM 

SIZE 

Description 

4X 

12X 

ATTACHMENT 

HOLD 

DOWN 

PICK & 

PLACE 

TAB 

Attachment: 


L Latch 

PACKAGE 

CODE 

Pick & Place Tab: 


N None 

P Pick & Place Tab 

Package: 


F Tray 

K Tape & Reel 

Hold Down: 


A Mounting screws 

B Solder posts 

C Mounting screws with top panel mount 

D Solder posts with top panel mount 

E Belly-to-Belly 

F Belly-to-Belly with top panel mount 

Options: 

EMI Shield - P/N 986025-12 

EMI Gasket - P/N 986026-12 



NX+ EMI Shield 

OPTIONAL 

4x EMI Shield 

P/N 986025-04 

22.3 

2.3 

Material: 770 Nickel Silver 


Sold in 20 packs 

12x EMI Shield 

P/N 986025-12 

10.5 

10.5 

46.3 

2.3 

Material: 770 Nickel Silver 





NX+ EMI Gasket 

OPTIONAL 

4x EMI Gasket 

P/N 986026-04 

3.0 

24.9 

22.2 

6.7 

11.9 

1.0 

Material: CF Conductive Foam or Equivalent 



12x EMI Gasket 

P/N 986026-12 

2.0 

50.8 

46.2 

8.1 

12.2 

1.0 

Material: CF Conductive Foam or Equivalent 





PCI Connectors and 

Card Edge Connectors 

25° 5V/32 Bit Connector 

5V/64 Bit Right Angle Connector 

5V/32 Bit Right Angle Connector 

2 x25 Right Angle Card Edge Connector 

Meritec offers the PCI family shown above. All Meritec PCI connector footprints are identical to the vertical mount 

versions for joint compatibility in the PCB design. 


• RoHS Compliant product available 

• Horizontal PCI card mating 

• Meets all PCI local bus standards (revision 2.3) 

for a 3.3V or 5V/64 bit configuration 

• Plastic cover protects unused PCI connectors 

from dust and debris, and supports connector 

for hybrid soldering applications requiring 

convection/IR heating 

• Mounting holes for board attachment 

• Through hole solder mount application 

compatible with wave soldering process 

• Card mounting heights from .230” to .657” (see 

layout drawing for height table) 

• Solves space problem applications where card 

edge connector is needed and where low 

clearance above PCB prohibits use of vertical 

configuration 

• Insert molded in liquid crystal polymer for 

stability in hybrid board applications involving 

surface mount components 

• Offers PCB design flexibility 

• Designed to mate with .062” thick PCB 

• Choice of rivets or retention clips as hold down 

fasteners 


ELECTRICAL: 

• Contact resistance: 40 milliohm (maximum) 

• Dielectric withstanding voltage: 500 VAC 


• Current rating: 1.0 amp (continuous) 

• Insulation resistance: >1 x 10 9 ohms @ 500 

VDC 

MECHANICAL: 

• Contact material: copper alloy 

• Number of contacts: 25º 120 

32 Bit 120 

64 Bit 184 

2 x 25 50 

• Standard contact finish: selectively plated 

contact surface consists of gold flash over 

nickel on the mating interface 

• Special order contact finish: specific gold 

plating thickness available upon request 

• Rivet material: brass nickel plated 

• Retention clip: copper alloy 

• Insertion force: 150 grams/opposing contact 

pair (maximum) 

• Normal force: 75 grams/contact (minimum) 

• Dielectric material: glass filled liquid crystal 

polymer (black) 



• Operating Range: -40ºC to 105ºC 



25º 3.3V and 5V/32 Bit PCI Connectors 

LAYOUT DRAWING ILLUSTRATED: 25º 5V/32 BIT PCI CONNECTOR 

DAUGHTER CARD ORIENTATION 

RELATIVE TO MOUNTING HOLE PATTERN 

PCI DAUGHTER CARD 

.93 

.24 

.34 -B- 

.02 

-A- 

25 

25 

HOLD-DOWN FASTENER 

SEMI-TUBULAR BRASS 

RIVET, 2 REQ'D 

.51 

-B- 

-A- 

3.60 .11 DIM "C" 

RECOMMENDED MOUNTING HOLE PATTERNS 

PER PCI SPECIFICATION, REV. 2.0 

Ø .040 ± .003 PLATED 

THRU HOLES 120 PLACES 

5V/32 Bit PCI Connector PIN A1 

.542 

.93 .88 

.150 DAUGHTER CARD ENTRY SIDE Ø .096 PLATED THRU 

3.350 MOUNTING HOLES 2 PLACES 

PROJECTED CONNECTOR 3.60 

REAL ESTATE 

ON MOTHER BOARD 

Ø .040 ± .003 PLATED 


3.3V/32 Bit PCI Connector 

PIN A1 

.542 

.93 .88 

PROJECTED CONNECTOR 

REAL ESTATE 


DAUGHTER CARD ENTRY SIDE .150 

3.350 

3.60 

Ø .096 PLATED THRU 

MOUNTING HOLES 2 PLACES 

3.3V CONNECTORS 

5V CONNECTORS 

DIM "C" PART NUMBER DIM "C" PART NUMBER 

.100 

980141-120-2MXF 

.100 

980161-120-2MXF 

.125 

980142-120-2MXF 

.125 

980162-120-2MXF 

.140 

980143-120-2MXF 

.140 

980163-120-2MXF 

X = Designate C for SnPb plating or M for RoHS Compliant Au plating 

Note: 25° 32 Bit PCI Connectors available with rivets only. 



Right Angle 3.3V and 5V/32 Bit PCI Connectors 

LAYOUT DRAWING ILLUSTRATED: RIGHT ANGLE 5V/32 BIT PCI CONNECTOR 

.98 

.39 

DIM "A" 

DIM "B" 


SOLDER PLATED COPPER ALLOY 

RETENTION CLIPS, 2 REQD 



3.34 RIVETS, 2 REQD PCI DAUGHTER CARD 

DIM "B" 

.11 

-B- -B- 

.088 

-A- 

3.60 

-A- DIM "C" 

PIN A1 

DAUGHTER CARD 

ORIENTATION RELATIVE TO MOUNTING 

HOLE PATTERN 


Ø .040 ± .003 PLATED 



5V/32 Bit PCI Connector 

PIN A1 

Ø .120 PLATED THRU .542 

MOUNTING HOLES FOR 

RETENTION CLIPS 

.98 

.93 

2 PLACES 

.150 

DAUGHTER CARD ENTRY SIDE 


REAL ESTATE 3.60 



Ø .067 PLATED THRU MOUNTING 

HOLES FOR RIVETS 2 PLACES 

Ø .040 ± .003 PLATED 


PIN A1 


MOUNTING HOLES FOR .98 

RETENTION CLIPS 

2 PLACES 

.542 

.93 

.150 



HOLES FOR RIVETS 2 PLACES 


REAL ESTATE 

3.60 


3.3V and 5V CONNECTORS 

DIM "A" DIM "B" DIM "C" 

.4 

.4 

.4 

.4 

.4 

.4 

.6 

.6 

.6 

.8 

.8 

.8 

DIM "A"=OVERALL HEIGHT, DIM "B"=CARD MOUNTING HEIGHT, DIM "C"=TAIL LENGTH 

X = Designate C for SnPb plating or P for RoHS Compliant Pd plating 

PART NUMBERS 

3.3V with Rivets 3.3V with Clips 5V with Rivets 5V with Clips 

.2 .10 980 981131-120-2MXF 980151-120-2MXF 981151-120-2MXF 

.23 .12 980132-120-2MXF 981132-120-2MXF 980152-120-2MXF 981152-120-2MXF 

.2 .14 980133-120-2MXF 981133-120-2MXF 980153-120-2MXF 981153-120-2MXF 

.32 .10 980134-120-2MXF 981134-120-2MXF 980154-120-2MXF 981154-120-2MXF 

.32 .125 980135-120-2MXF 981135-120-2MXF 980155-120-2MXF 981155-120-2MXF 

.32 .14 980136-120-2MXF 981136-120-2MXF 980156-120-2MXF 981156-120-2MXF 

.492 .10 980137-120-2MXF 981137-120-2MXF 980157-120-2MXF 981157-120-2MXF 

.49 .12 980138-120-2MXF 981138-120-2MXF 980158-120-2MXF 981158-120-2MXF 

.49 .14 980139-120-2MXF 981139-120-2MXF 980159-120-2MXF 981159-120-2MXF 

.65 .10 98013A-120-2MXF 98113A-120-2MXF 98015A-120-2MXF 98115A-120-2MXF 

.65 .12 98013B-120-2MXF 98113B-120-2MXF 98015B-120-2MXF 98115B-120-2MXF 

.65 .14 98013C-120-2MXF 98113C-120-2MXF 98015C-120-2MXF 98115C-120-2MXF 



Right Angle 3.3V and 5V/64 Bit PCI Connectors 

.98 

LAYOUT DRAWING ILLUSTRATED: RIGHT ANGLE 5V/64 BIT PCI CONNECTOR 


SOLDER PLATED COPPER ALLOY 

RETENTION CLIPS, 2 REQD 

.30 HOLD-DOWN FASTENER 


.04 REF. RIVETS, 3 REQD PCI DAUGHTER CARD 

DIM "A" 

DIM "B" 

.11 

-B- 

-B- 

DIM "B" .088 

-A- 

-A- 

5.13 

DIM. "C" 

PIN A1 

DAUGHTER CARD ORIENTATION 




Ø .040 ± .003 PLATED 

5V/64 Bit PCI Connector THRU HOLES 184 PLACES 

.105 

5.13 

PIN A1 



RETENTION CLIPS .98 .93 

ONLY 2 HOLES REQD, 

ONE ON EACH END OF 

THE CONNECTOR 


2.580 

.088 

PROJECTED CONNECTOR 4.960 Ø .067 PLATED THRU MOUNTING 

REAL ESTATE 5.04 HOLES FOR RIVETS 3 PLACES 



Ø .040 ± .003 PLATED 

5.13 


.105 PIN A1 



RETENTION CLIPS .98 .93 

ONLY 2 HOLES REQD, 

ONE ON EACH END OF 

THE CONNECTOR 


.088 




ON MOTHER BOARD 5.04 HOLES FOR RIVETS 3 PLACES 

3.3V and 5V CONNECTORS 


.40 

.40 

.40 

.49 

.49 

.49 

.66 

.66 

.66 

.83 

.83 

.83 

(SEE 2 X 25 RIGHT ANGLE CARD EDGE CONNECTOR P/N 980121-050-2MCF FOR COMPANION USAGE) 

.230 .10 

.23 .125 

.23 .14 

.320 .10 

.32 .12 

.320 .14 

.49 .10 

.492 .125 

.492 .140 

.657 .10 

.657 .12 

.657 .14 


X = Designate C for SnPb plating or P for RoHS Compliant Pd plating 

PART NUMBERS 

3.3V with Rivets 3.3V with Clips 5V with Clips 5V with Clips 

980131-184-2MXF 981131-184-2MXF 980151-184-2MXF 981151-184-2MXF 

980132-184-2MXF 981132-184-2MXF 980152-184-2MXF 981152-184-2MXF 

980133-184-2MXF 981133-184-2MXF 980153-184-2MXF 981153-184-2MXF 

980134-184-2MXF 981134-184-2MXF 980154-184-2MXF 981154-184-2MXF 

980135-184-2MXF 981135-184-2MXF 980155-184-2MXF 981155-184-2MXF 

980136-184-2MXF 981136-184-2MXF 980156-184-2MXF 981156-184-2MXF 

980137-184-2MXF 981137-184-2MXF 980157-184-2MXF 981157-184-2MXF 

980138-184-2MXF 981138-184-2MXF 980158-184-2MXF 981158-184-2MXF 

980139-184-2MXF 981139-184-2MXF 980159-184-2MXF 981159-184-2MXF 

98013A-184-2MXF 98113A-184-2MXF 98015A-184-2MXF 98115A-184-2MXF 

98013B-184-2MXF 98113B-184-2MXF 98015B-184-2MXF 98115B-184-2MXF 

98013C-184-2MXF 98113C-184-2MXF 98015C-184-2MXF 98115C-184-2MXF 



2 x 25 Right Angle Card Edge Connectors 

LAYOUT DRAWING ILLUSTRATED: 2 X 25 RIGHT ANGLE CARD EDGE CONNECTOR 

.98 .29 

DIM "A" 


1.410 SEMI-TUBULAR BRASS 

1.200 

RIVETS, 2 REQD 

PCI DAUGHTER CARD 

.11 

DIM "B" 

-B- -B- 

.112 

DIM "B" 1.300 PIN A1 -A- 

-A- DIM "C" 

1.58 DAUGHTER CARD ORIENTATION 


RECOMMENDED MOUNTING HOLE PATTERN 

Ø .040 ± .003 

1.490 

PLATED THRU HOLES. 

50 PLACES 

1.200 

PIN A1 

.105 .050 

.100, 3 PLACES 

.98 

.742 

.93 

DAUGHTER CARD 

ENTRY SIDE 

PROJECTED CONNECTOR 



1.580 


MOUNTING HOLES 2 PLACES 

TYPICAL COMPANION USAGE SHOWING STACKABILITY 

OF CONNECTORS 

2X25 

5V/64 BIT PCI CONNECTOR 

2X25 

.38 .38 


DIM "A" DIM "B" DIM "C" PART NUMBER 

.40 .230 .100 980121-050-2MXF 

.40 .230 .125 980122-050-2MXF 

.40 .230 .140 980123-050-2MXF 

X = Designate C for SnPb plating or M for RoHS Compliant Au plating 

Note: 2 x 25 Right Angle Card Edge Connectors available with rivets only. 



ZIF Test Connector 

32 BIT Test Connector Custom Test Connector 

Meritec’s ZIF TEST CONNECTORS offer the user an accurate and reliable way in which to test their PCBs. 

Meritec’s ZIF Connector plugs directly into the Board Mount Connector in the test bed and is actuated by a lever 

for easy loading and unloading of cards. Meritec’s solution eliminates the uncertainty associated with intermittency 

between the PC Board and Test Connector during the test cycle. The Test Connector is now available in a 32-bit 

PCI assembly. 


• Mates to 32 Bit 3.3 and 5.0 volt 

standard PCI connectors 

• Minimum of 10,000 cycles 

• Available with or without adapter cards 

to mate with standard PCI Connectors 

or a .062” PC Board 

• Custom adapter cards available upon 

request 

• Straddle mount design allows the 

connector to be terminated to a test 

designer’s own adapter card 

• The lever-actuated design allows for 

quick and easy loading and unloading 

of PCI cards 

• Reduces tester downtime for increased 

production flow 

• Minimal rotation of 40 degrees of the 

cam accommodates the full open and 

closed position of the contact 



ELECTRICAL: 


• Dielectric withstanding voltage: 1000 VAC 


• Current rating: 1.0 amp/contact (continuous) 

• Insulation resistance: >1 x 10 12 ohms @ 500 

VDC 

MECHANICAL: 


• Number of contacts: 120 

• Normal force: 75 grams/contact 

(minimum) 

• Actuation force: 1 in/lb of torque 

• Dielectric material: glass filled liquid 

crystal polymer (black) 






ZIF PCI TEST CONNECTOR 

4.35 

.650 

1.60 

STANDARD PCI 

CARD LAYOUT 

ZIF PCI TEST CONNECTOR WITH BOARD 

RoHS P/N 980550-120-ACFR 

3.405 

.100 .255 

.063 

.020 

.68 

.74 3.64 

.381 

ZIF PCI TEST CONNECTOR WITHOUT BOARD 

RoHS P/N 980550-120-ABFR 

.84 

3.88 

.376 

CARD SLOT 

2.400 

.500 

.100 

.150 

.030 

.050 

45° 30° 

.066 

.072 .010 

LEVER WITH CONTACTS 

IN CLOSED POSITION 

LEVER WITH CONTACTS 

IN OPEN POSITION 

PCI CARD LAYOUT 

PART NUMBERS: 9800550-120-ACFR – 32 Bit ZIF PCI Test Connector with adapter board (RoHS Compliant) 

9800550-120-ABFR – 32 Bit ZIF PCI Test Connector without adapter board (RoHS Compliant) 



PCI Express 100 Ohm Right Angle 

Through-Hole Mount Connectors 

This Right Angle Through-Hole PCIe connector solves space problem in applications where a card edge 

connector is needed and where low clearance above PCB prohibits use of vertical configurations 


• Parallel Daughter card mating for low profile 

applications 

• Plastic cover protects connectors from dust 

and debris, and supports connector for 

hybrid soldering applications requiring 


• Compliant board locating posts 

• Card slot heights 5.84mm to 16.68mm 

• Insert molded using liquid crystal polymer for 


surface mount components requiring 

convection or IR heating 

• Offers PCB design flexibility 

• Designed to mate with .062” thick daughter 

card 

• Meets PCIe 2.0 Electrical data requirements 



Electrical 

• Contact resistance: 40 milliohms nominal 

• Dielectric withstanding voltage: 300VDC 

Current rating: 1.1 AMP per contact 

• Insulation resistance: 100 Mohms (minimum) 

Mechanical 

• Contact material: Copper alloy 

• Number of contacts: X1=36, X4=64, X8=98, X16=164 

• Standard contact finish: contact and solder tail finish 

surface consists of 5µ Au over 50µ min Ni 

• Custom contact finish: specific gold plating thickness 

available upon request 

• Insertion force:150 grams maximum per opposing 

contact pair 

• Normal force: 5 grams minimum per contact 

• Dielectric material: glass filled Liquid Crystal Polymer 

(LCP) 

Environmental 

• Material: UL 94 V-0 rated 

• Temperature Range: -40°C to +105°C 





DIM "D" 

REF 

DIM "E" ±.23 [.009] 

14.75 

.581 

1.78 

.070 

11.65 REF 

.459 

CENTERLINE OF 

DAUGHTER CARD 

8.03 

.316 

CARD INSERTION DEPTH 

15.24 

.60 

DIM "B" 

DIM "A" 

"N" SPACES AT 

1.00[.039] REF 

1.50 REF 

.059 

OFF SET FROM DATUM 

.15 KEY THIS DIRECTION 

PIN 1 

10 SPACES AT 

1.00 [.039] REF 

CONNECTOR 

LINK WIDTH 

X1 

X4 

X8 

X16 

# POS 

REF 

36 

64 

98 

164 

"N" 

6 

20 

37 

70 

DIM "D" 

4 

.157 

7.65 [.301] 

21.65 [.852] 

38.65 [1.522] 

71.65 [2.821] 

DIM "E" 

25.50 [1.004] 

39.50 [1.555] 

56.50 [2.224] 

89.50 [3.524] 

DIM "F" 

DIM "C" 

OPTIONAL POSTS MAY BE ELIMINATED 

FOR PICK AND PLACE APPLICATIONS 

9.15 [.360] 

23.15 [.911] 

40.15 [1.581] 

73.15 [2.880] 

DIM "G" 

8.15 [.321] 

22.15 [.872 

39.15 [1.541] 

72.15 [2.841] 

RECOMMENDED MOTHER BOARD FOOTPRINT 

RECOMMENDED DAUGHTER CARD LAYOUT 

2X 

"N" SPACES 

AT 1.00 [.039] 

0.70±0.08 

PTH (typ) 

.028±.003 

2.35±0.05 

.093±.002 

B2 

B1 

A1 

A2 

1.65 

.065 

1.35 

.053 

10 SPACES 

AT 1.00 [.039] 

4.48 

.176 

2 

.079 

8.41 MIN. 

.331 

2.50 

.098 

0.71 

.028 

5.59 

.220 

"N" SPACES 

AT 1.00 [.039] 

10 

.394 

12.14 

.478 

1.91±0.05 

.075±.002 

1.49 

.059 

1.40 

.055 

1.57 

.062 

ACROSS PADS 

DIM "F" ± .10 

DIM "G" 

[±.004] 


PART NUMBER 

STRUCTURE 

9.39 [.370] 5.84 [.230] 2.54 [.100] 983171-XXX-2MMF XXX= Number of Positions 

9.39 [.370] 5.84 [.230] 3.17 [.125] 983172-XXX-2MMF 

Replace XXX with number 

9.39 [.370] 5.84 [.230] 3.55 [.140] 983173-XXX-2MMF 

of positions: 

14.73 [.580] 11.17 [.440] 2.54 [.100] 98317G-XXX-2MMF 

14.73 [.580] 11.17 [.440] 3.17 [.125] 98317H-XXX-2MMF 

036 = X1 

14.73 [.580] 11.17 [.440] 3.55 [.140] 98317J-XXX-2MMF 

064 = X4 

098 = X8 

20.32 [.800] 16.68 [.657] 2.54 [.100] 98317A-XXX-2MMF 164 = X16 

20.32 [.800] 16.68 [.657] 3.17 [.125] 98317B-XXX-2MMF 

20.32 [.800] 16.68 [.657] 3.55 [.140] 98317C-XXX-2MMF 

20° 





This Right Angle Through-Hole PCIe connector solves space problem in applications where a card edge 

connector is needed and where low clearance above PCB prohibits use of vertical configurations 

 

 

 

 

 

 

 

 

 


Parallel Daughter card mating for low profile 

applications 

Plastic cover protects connectors from dust 

and debris, and supports connector for 

hybrid soldering applications requiring 


Compliant board locating posts 

Card slot heights 5.84mm to 11.17mm 

Insert molded using liquid crystal polymer for 


surface mount components requiring 

convection or IR heating 

Offers PCB design flexibility 

Designed to mate with .062” thick daughter 

card 

Meets PCIe 3.0 Electrical data requirements 

for 8.0 Gb/s 

RoHS compliant 


Electrical 

Contact resistance: 40 milliohms nominal 

Dielectric withstanding voltage: 300VDC 

Current rating: 1.1 AMP per contact 

Insulation resistance: 100 Mohms (minimum) 

Mechanical 

Contact material: Copper alloy 

 

 

 

 

 

 

Number of contacts: X1=36, X4=64, X8=98, X16=164, 

X24=230 

Standard contact finish: contact and solder tail finish 

surface consists of 5µ Au over 50µ min Ni 

Custom contact finish: specific gold plating thickness 

available upon request 

Insertion force:150 grams maximum per opposing 

contact pair 

Normal force: 5 grams minimum per contact 

Dielectric material: glass filled Liquid Crystal Polymer 

(LCP) 

Environmental 

Material: UL 94 V-0 rated 

Temperature Range: -40C to +105C 





DIM "D" 

REF 

DIM "E" ±.23 [.009] 

14.75 

.581 

1.78 

.070 

11.65 REF 

.459 

CENTERLINE OF 

DAUGHTER CARD 

8.03 

.316 

CARD INSERTION DEPTH 

15.24 

.60 

DIM "B" 

DIM "A" 

"N" SPACES AT 

1.00[.039] REF 

1.50 REF 

.059 

OFF SET FROM DATUM 

.15 KEY THIS DIRECTION 

PIN 1 

10 SPACES AT 

1.00 [.039] REF 

4 

.157 

DIM "C" 

OPTIONAL POSTS MAY BE ELIMINATED 

FOR PICK AND PLACE APPLICATIONS 

CONNECTOR # POS 

LINK WIDTH REF 

"N" DIM "D" DIM "E" DIM "F" DIM "G" 

X1 36 6 7.65 [.301] 25.50 [1.004] 9.15 [.360] 8.15 [.321] 

X4 64 20 21.65 [.852] 39.50 [1.555] 23.15 [.911] 22.15 [.872 

X8 98 37 38.65 [1.522] 56.50 [2.224] 40.15 [1.581] 39.15 [1.541] 

X16 164 70 71.65 [2.821] 89.50 [3.524] 73.15 [2.880] 72.15 [2.841] 

X24 230 103 104.65 [4.120] 122.50 [4.823] 106.15 [4.179] 105.15 [4.140] 

RECOMMENDED MOTHER BOARD FOOTPRINT 


"N" SPACES 

AT 1.00 [.039] 

0.70±0.08 

PTH (typ) 

.028±.003 

2X 2.35±0.05 

.093±.002 

B2 

B1 

A1 

A2 

1.65 

.065 

1.35 

.053 

DIM "F" ± .10 

[±.004] 

10 SPACES 

AT 1.00 [.039] 

4.48 

.176 

2 

.079 

8.41 MIN. 

.331 

2.50 

.098 

0.71 

.028 

5.59 

.220 

"N" SPACES 

AT 1.00 [.039] 

DIM "G" 

10 

.394 

12.14 

.478 

1.91±0.05 

.075±.002 

1.49 

.059 

1.40 

.055 

1.57 

.062 

ACROSS PADS 

20° 


PART NUMBER 

STRUCTURE 

9.39 [.370] 5.84 [.230] 2.54 [.100] 983571-XXX-2MMF 

9.39 [.370] 5.84 [.230] 3.17 [.125] 983572-XXX-2MMF 

9.39 [.370] 5.84 [.230] 3.55 [.140] 983573-XXX-2MMF 

14.73 [.580] 11.17 [.440] 2.54 [.100] 98357G-XXX-2MMF 

14.73 [.580] 11.17 [.440] 3.17 [.125] 98357H-XXX-2MMF 

14.73 [.580] 11.17 [.440] 3.55 [.140] 98357J-XXX-2MMF 

XXX= Number of Positions 

Replace XXX with number 

of positions: 

036 = X1 

064 = X4 

098 = X8 

164 = X16 

230 = X24 

CONFIDENTIAL AND PROPRIETARY NOTICE 

This document and the information contained in it are confidential property of Meritec. The document and information are provided to you 

for your review and evaluation and must not be furnished or disclosed to other without prior written consent by an authorized representative 

of Meritec. 



52 Position 

Card Edge Connector 

(Side-entry) 


• Close pitch .50” centers minimize board 

space requirements 

• Designed to meet convection, IR or 

vapor phase reflow requirements 

• Through-hole and SMT contact tail 

configurations are available 

• 50 ohm impedance matched connector 

• Precision, high strength molded 

terminations provide reliability in critical 

applications 

• Designed for a variety of PC Board 

thickness 

• Custom designs are available from 10 

to 100 positions 


ELECTRICAL: 

• Current rating: .75 amp/contact 

(continuous) 

• Contact resistance: 7 milliohm (max) 

• Dielectric withstanding voltage: 

>1000 VAC (RMS) @ sea level 

• Insulation resistance: >5 x 10 12 ohms @ 

500 VDC 

MECHANICAL: 


• Contact finish: Selectively plated contact 

surface consisting of 30 micro” gold (min) 

over 50 micro” nickel (min)Tails are 

gold flash over 50 micro” nickel (min) 




• Dielectric material: liquid crystal polymer 

resin 


• Materials: UL 94V-0 

• Heat deflection temperature per 

ASTM D648: 235ºC @ 264 PSI 



Card Edge Connector (Side-entry) 

.050 PITCH SMT CARDEDGE CONNECTOR 

.050 PITCH SMT 

CONNECTOR 

VERSION 

.050 PITCH THRU 

HOLE VERSION 

RECOMMENDED THRU HOLE PCB LAYOUT 



Card Edge Connector (Side-entry) 

RECOMMENDED SMT PCB LAYOUT 


MERITEC PART NUMBERS 

THRU HOLE 981011-052-2QMF 

SMT 

981021-052-2QMF 



Hermaphroditic Connectors 

The Hermaphroditic Connector has a dual wipe contact design that was developed for use in severe 

environments. Shallow entry angles on the contacts ensure a smooth insertion force profile, great for high-mating 

cycle applications. 


• Close pitch .050” centers minimize 

board space requirements 

• 50 ohm impedance matched connector 

• Hermaphroditic contacts eliminate the 

need for separate male and female 

connectors 



• Through-hole and SMT contact tail end 

configurations are available 

• Precision, high strength insert molded 

contacts provide reliability in critical 

applications 

• Available with locating and mounting 

features 

• Designed with polarization features 

• RoHS Compliant (available) 


ELECTRICAL: 

• Current rating: .75 amp/contact 

(continuous) 


• Dielectric withstanding voltage: >1000 

VAC (RMS) at sea level 

• Insulation resistance: >5 x 10 12 ohms at 

500 VDC 

MECHANICAL: 

• Contact Material: Copper Alloy 

• Plating, mating end: Selectively plated 

contact surface consisting of 30 micro” 

gold (min), over 50 micro” nickel (min) 




• Shock and Vibration: MIL standard 1344 

(method 2004 and 2005) 

• Dielectric material: Liquid crystal polymer 

resin 


• Material: UL 94 V-0 rated 

• Operating temperature: -40ºC to 105ºC 



Hermaphroditic Connectors 

RECOMMENDED SURFACE MOUNT PCB 

RECOMMENDED THRU HOLE MOUNT PCB 

Ø .159 THRU 

HOLE FOR 

FASTENER 

HARDWARE 

Ø .120 THRU 

HOLE FOR 

FASTENER 

HARDWARE 

RECOMMEDED THRU HOLE MOUNT PCB 

Part# 

M 

C 

Description 

Flash AU (RoHS Compliant) 

Tin/Lead Pb 

Q 

DIMENSIONS TO BE USED AS REFERENCE ONLY - PLEASE REFER TO SALES DRAWINGS FOR DETAILED DIMENSIONS - SPECIFICATIONS SUBJECT TO CHANGE 



480 Position Hermaphroditic 

Mezzanine Connector 


• Hermaphroditic contacts eliminate the 

need for separate male and female 

connectors 



applications 

• Low insertion force 

• 100 ohm impedance matched 

connector 




• Locating posts for blind mate 

applications 

• Thru hole configuration 

• 23mm mated stacked height 


ELECTRICAL: 

• Current rating: 3 amp/contact (continuous) 


• Insulation resistance: >5x10 ohms 500 VDC 

• Dielectric withstanding voltage: >1000 VAC 

(RMS) at sea level 

MECHANICAL: 


• Plating, mating end: Selectively plated 

contact surface consisting of 15µ Au 

(minimum), over 50µ Ni minimum. Tail end: 

Au flash over 50µ Ni minimum. 

• Insertion force: 18.5 grams/contact 

(nominal) 

• Withdrawal force: 14 grams/contact 

(nominal) 



resin 


• Material: U.L. rated 94 V-O 

• Operating temp range: -40°C to 105°C 



HERMES Connector System 

Straight 42 Position Shown 

Preliminary 


• Hermaphroditic Contacts in both Plug 

and Receptacle 

• 10 Gb/s per Differential Pair 



applications 

• Low insertion force 




• Other sizes available upon request 

• Can be manufactured in right angle or 

vertical mount configuration 

• 5,000+ mating cycles 

• Rugged & Durable 


ELECTRICAL: 

• Current rating: 3 amp/contact (continuous) 


• Insulation resistance: >5x10 ohms 500 VDC 

• Dielectric withstanding voltage: >1000 VAC 

(RMS) at sea level 

• Impedance: 100 ± 5Ohms at 100 psec rise 

time 

• Insertion Loss: < -1dB up to 5GHz for 

mated plug & receptacle pair 

• Crosstalk (NEXT, one aggressor): 

< -40dB up to 5GHz 

• Return Loss: < -20dB up to 5GHz for mated 

plug & receptacle pair 

MECHANICAL: 


• Plating: Mating End, Au Flash over 30µ min 

PdNi, over 50µ min Ni; Tail End, Au flash over 

50µ min Ni. 



Normal force: 80 grams/contact (nominal) 


resin 


• Material: U.L. rated 94 V-O 

• Operating temp range: -40°C to 105°C 




Male Straight 42 Position 

.142 THRU 

.163 

.925 

1.850 

.740 

.166 

.141 

2.175 

1.320 

.434 

.800 

.035 

.500 

.225 

.085 

.100 

RECOMMENDED BOARD LAYOUT 

0 

.4170 

1.4250 

1.850 

.0807 

.0527 

0 

.0527 

.0807 

0 

.4250 

.0660 TYP. 

.0420 TYP. 

.0660 TYP. 

.0420 TYP. 

S 

S 

G 

.140 

(2)PLCS 

FINISHED 

.025 PTH 

(42)PLCS 

G 

S 

S 



0 


Female Straight 42 Position 

.142 THRU 

.720 

.163 

.141 

.165 

1.000 

2.000 

2.330 

1.360 

1.230 

.430 

.340 

.480 

.805 

.030 

.500 

.250 

.089 

.060 


.0531 

.0251 

0 

.0251 

.0531 

0 

.5000 

.4920 

.0420 TYP. 

.0660 TYP. 

.0420 TYP. 

.0660 TYP. 

1.5080 

G 

2.000 

S 

S 

.140 

(2)PLCS 

FINISHED 

.025 PTH 

(42)PLCS 

S 

S 

G 




Right Angled 42 Position 

.344 

1.730 

.267 

.285 

.795 

.489 

.084 

.125 

1.230 

2X .093 

POST 

0 

.105 

.405 

2X .070 THRU 

2-56 UNC THRU 

1.475 


P.W.B. EDGE 

FINISHED 

.025 PTH 

(42)PLCS 

1.4750 

1.2375 

1.2455 

.0660 TYP. 

.0420 TYP. 

.0660 TYP. 

.0420 TYP. 

.2295 

.2375 

0 0 

2X 

2X 

.096 THRU 

.0940 THRU 

P.F. POST 

.3000 

.1914 

.1634 

.1394 

.1114 

0 

.0850 



A P Products 

Notes 



A P Products 

Datasheets 


Section 1 


Section 2 


Section 3 


Section 4 


Section 5 


Section 6 


Section 7 




Compact Brute 

CB-140 

Rugged Interconnect 

Developed for use as a rugged test floor interconnect, 

the Compact Brute series connector allows 

for design flexibility with up to 140 pins on a 4x35 

matrix. 

The pins can be configured as signals, grounds or 

power up to 2A . For lower performance applications 

a typical configuration could be 32 signals and 3 

grounds on three rows for a total of 96 signals and 9 

grounds. The remaining 35 pins could be power supply. 

For a higher performance application each row can be 

configured in a sig/gnd/sig/gnd repeating pattern with 17 

signals and 18 grounds per row or a connector total of 68 

single ended signals. Differential signals running on shielded 

twisted pair or shielded parallel pair is also possible with this connector. 

All cable end connectors are female. There are board mounted headers available 

in vertical male, right angle male, vertical female and right angle female 

configurations. The female board connectors are for board to 

board connection in conjunction with the male board connectors. 

Features and Benefits 

Vertical Male 

PCB Mounted 

Right Angle Male 

PCB Mounted 

• Rugged, hard anodized aluminum shell with PTFE Mil-Spec 

coating 

• Contacts are protected by an LCP grid 

• Patented hermaphroditic contact for low insertion force 

and long life 

• Contacts are dual wipe for redundancy and high reliability 

• 140 positions available for signal, ground or power 

• Up to 2A per contact 

• Resilient LCP Quick Latch system for quick attach and removal 

• Two stainless steel alignment pins on board mounted conns 

• Secured to PCB with two 4-40 screws 

• Available PCB mounted connectors: 

Vertical Male 

Vertical Female 

Right Angle Male 

Right Angle Female 

• Female board mount connectors for board to board applications 

• Cable end connector always female 

• Vert Male Board footprint: 2.23" [56.6] x 0.66" [16.8] 



012345678594 5439267279 012345678594515952 9291126 27279612 5162922927557 5434515952 926595 9265929126 2626 "#9$%&'(5!1 54124515952 )9626)1578796 "#9$$&'( 269655!58195 195* &'(9%$&'(5!1* &97 01234567859#59 4397 25972796 92*415!6725 !22692K7L762# 62895792* 23962212355159 

21279657162856229 

26259 2946 25592!69 5!126 

012375678595436$% 49799653 4979592626 0:58192$$&'(#562=878796 #5259#1266991A%787 969292659291237567859A%7879665712 &72796929 959267299 7892662856229* 2452M2122 982592626 %1268 



Meritec’s socket interconnects are designed for .025” square or round pins. 

Terminations may be housed individually or consolidated into Single Signal Carrier 

Systems (SSC) for grouped interfacing with single, dual or triple row headers. The 

drawings below represent both the high performance, cost effective SSI terminations and 

the impedance matched Ground Plane Interconnect (GPI) terminations, which are used 

for faster edge rate applications. Reconfiguration of Meritec’s GPI Carrier Assemblies in 

the field is not recommended. See pages 10 and 11 for electrical test data performance. 

.100” Pitch Socket Interconnects 

PIN 1 

LATCH SIDE 

PINOUTS 

AXIAL 

1 x 2 

.198 

.100 

L 

LATCH SIDE 

S G 

G S 

A B 

.098 .605 

PIN 1 

.645 

LATCH SIDE 

.100 

L 

LATCH SIDE 

AXIAL 

1 x 3 

AXIAL 

1 x 1 

.298 .200 

.098 .605 

.645 

.098 SQ. .605 

L 

S 

N/C 

G 

G 

S1 

S2 

S1 

G 

S2 

S1 

S2 

G 

C D E F 

G 

S2 

S1 

S2 

G 

S1 

S2 

S1 

G 

G H J 

FOR 

ADDITIONAL 

PINOUTS, 

CONTACT 

MERITEC 

CUSTOMER 

SERVICE 

.645 

RIGHT 

ANGLE 

1 x 2 

.098 

.100 

.198 

LATCH SIDE 

.725 

.605 

L 

L = Length in inches 

RIGHT 

ANGLE 

1 x 3 

LOW PROFILE 

RIGHT ANGLE 

1 x 2 

.098 

.098 

.100 

.298 

SIGNAL 

.20 

.10 

.200 

SHIELD 

PIN 1 

LATCH SIDE 

.725 

.605 

PIN 1 

.41 

.33 

.100” Pitch .025” Socket Interconnects Termination Style Numbers 

STYLE # TERMINATION SPACING PINOUT 

(see diagram) 

00 No termination — — 

01 Axial 1x2 .100” x .100” A 

02 Axial 1x2 .100” x .100” B 

03 Axial 1x3 .100” x .200” C 

04 Axial 1x3 .100” x .100” D 

05 Axial 1x3 .100” x .100” E 

06 Axial 1x3 .100” x .100” F 

07 Axial 1x3 .100” x .100” G 

08 Axial 1x3 .100” x .100” H 

09 Axial 1x3 .100” x .100” J 

10 Axial 1x1 .100” x .100” — 

21 Right angle 1x2 .100” x .100” A 

22 Right angle 1x2 .100” x .100” B 

23 Right angle 1x3 .100” x .200” C 

24 Right angle 1x3 .100” x .100” D 

L 

L 

Material and Finish: 

Contact material: Phosphor bronze 

Contact finish: Selectively plated, 

.000030” gold (min.) over 

.000050” nickel (min.) 

Dielectric material: Liquid crystal polymer resin, 

UL rated 94 V-O 

STYLE # TERMINATION SPACING PINOUT 

(see diagram) 

25 Right angle 1x3 .100” x .100” E 

26 Right angle 1x3 .100” x .100” F 

27 Right angle 1x3 .100” x .100” G 

28 Right angle 1x3 .100” x .100” H 

29 Right angle 1x3 .100” x .100” J 

41 Axial GPI 1x2 .100” x .100” A 

42 Axial GPI 1x2 .100” x .100” B 

44 Axial GPI 1x3 .100” x .100” D 

51 Right angle GPI 1x2 .100” x .100” A 

52 Right angle GPI 1x2 .100” x .100” B 

54 Right angle GPI 1x3 .100” x .100” D 

61 Right angle low profile1x2 .100” x .100” A 

71 Right angle GPI low profile 1x2 .100” x .100” A 

XX Special applications — — 



Single Signal Carrier Systems (SSC) 

1x2 SSI 

.098 

.61 

SINGLE ROW 1x2 

.048 MAX. 

PIN 1 INDICATOR 

.100 TYP. 

1x3 SSI 

SINGLE ROW 1x3 

.098 

.049 MAX. 

.100 TYP. 

LATCH AND EJECT 

FEATURE 

.61 


DUAL ROW 

LATCH AND EJECT 

.24 

.14 

CENTER KEY 

OPTIONAL 

.61 

.56 

.100 

.100 TYP. 


DUAL ROW 

END STACKABLE 

.24 

.10 

.14 

CENTER KEY 

OPTIONAL 

.61 

.100 TYP. 


.049 

TRIPLE ROW 

END STACKABLE 

.335 

.200 

.100 

.100 TYP. 

.61 


.04 

.12 

.100 TYP. 

TRIPLE ROW DIN 

.34 

.61 

.100 TYP. 


Single Signal Carrier Systems Style Numbers 

STYLE # CARRIER STYLE POSITIONS 

1 Single row 1x2 4-36 

2 Single row 1x3 6-36 

3 Dual row — latch and eject with center key 10, 14, 16, 20, 

26, 34, 40, 44, 

50, 60 and 64 

4 Dual row — end stackable with center key 4-64 

5 Dual row — end stackable without center key 4-64 

6 Triple row — end stackable with center key 6-96 

7 Triple row — end stackable without center key 6-96 

8 Triple row — DIN 96 

9 Dual row — latch and eject without center key 10, 14, 16, 20, 

26, 34, 40, 44, 

50, 60 and 64 

Materials 

Housing: Thermoplastic glass filled 

polyester, UL rated 94 V-O 



PCB Soldertail Contact Interconnects 

Meritec PCB Soldertail Contact and BNC Interconnects may be 

specified as “opposite end” terminations for Meritec SSI or SSC 

assemblies, or be specified in their own assemblies. SMA, SMB 

and SMC connectors may also be specified by contacting your 

Meritec Customer Service Representative at 1-800-860-9014. 

SIGNAL 

CONTACT 

.350 

L 

RIGHT ANGLE 

1x2 .100 x .100 

SPACING 

.140 

.098 MAX. 

.100 

.010 

.025 

.110 OR .160 

SIGNAL 

CONTACT 

L 

.450 

RIGHT ANGLE 

1x2 .100 x .200 

SPACING 

.140 

.098 MAX. 

.200 

.010 

.025 

.110 OR .160 

RIGHT ANGLE 

1x3 .100 x .100 

SPACING 

SIGNAL 

CONTACTS 

.140 

.450 

L 

.098 MAX. 

.100 

.010 

.200 

.025 

.110 OR .160 

SOLDER PIN 

CROSS SECTION 

.016 

.025 

L = Length in inches 

PCB Soldertail Contact Interconnects Termination Style Numbers 

STYLE # TERMINATION SPACING PIN LENGTH 

11 Right angle 1x2 .100” x .100” .110” 

12 Right angle 1x2 .100” x .100” .160” 

13 Right angle 1x2 .100” x .200” .110” 

14 Right angle 1x2 .100” x .200” .160” 

15 Right angle 1x3 .100” x .100” .110” 

16 Right angle 1x3 .100” x .100” .160” 

Material and Finish 

Contact material: Copper alloy 

Contact finish: Tin plated 

Dielectric material: Liquid crystal polymer resin, 


Meritec PCB Soldertail Contact Interconnects are also available with gold plated pins to plug into socket contacts. 

For information on gold plated pins, contact your Meritec Customer Service Representative. 



BNC Interconnects 

50 OHM BNC TERMINATIONS 

75 OHM BNC TERMINATIONS 

CABLE END PLUG 

HEAT SHRINK 

TUBING 

.37 

1.19 

CABLE END PLUG 

HEAT SHRINK 

TUBING 

.30 

1.30 

MOLDED STRAIN 

RELIEF 

CABLE END JACK 

HEAT SHRINK 

TUBING 

.45 

MOLDED STRAIN 

RELIEF 

FRONT PANEL MOUNT JACK 

HEAT SHRINK 

TUBING 

1.31 

1.18 

.47 

.57 

.50 

.47 .38 DIA. 

MOLDED STRAIN 

RELIEF 

CABLE END JACK 

HEAT SHRINK 

TUBING 

.31 

MOLDED STRAIN 

RELIEF 

FRONT PANEL MOUNT JACK 

HEAT SHRINK 

TUBING 

1.30 

1.30 

.47 

.57 

.50 

.47 .38 DIA. 

.31 

MOLDED STRAIN 

RELIEF 

.50 

.16 

RECOMMENDED 

MOUNTING HOLE 

.31 

MOLDED STRAIN 

RELIEF 

.50 

.16 

RECOMMENDED 

MOUNTING HOLE 

FRONT PANEL MOUNT JACK WITH ISOLATED GROUND 

HEAT SHRINK 

TUBING 

.31 

MOLDED STRAIN 

RELIEF 

1.30 

.47 .38 DIA. 

.50 

.16 

RECOMMENDED 

MOUNTING HOLE 

FRONT PANEL MOUNT JACK WITH ISOLATED GROUND 

HEAT SHRINK 

TUBING 

.31 

MOLDED STRAIN 

RELIEF 

1.30 

.47 .38 DIA. 

.50 

.16 

RECOMMENDED 

MOUNTING HOLE 

REAR PANEL MOUNT JACK 

MOLDED STRAIN 

RELIEF 

1.26 

1.09 

.22 

REAR PANEL MOUNT JACK 

MOLDED STRAIN 

RELIEF 

1.26 

1.08 

.22 

.38 

HEAT SHRINK 

TUBING 

.69 

.51 DIA. 

RECOMMENDED 

MOUNTING HOLE 

.38 

HEAT SHRINK 

TUBING 

.69 

.51 DIA. 

RECOMMENDED 

MOUNTING HOLE 

BNC Interconnects Termination Style Numbers 

CHARACTERISTIC 

STYLE # TERMINATION IMPEDANCE (±10%) 

31 BNC cable end plug 50 

32 BNC cable end plug 75 

33 BNC cable end jack 50 

34 BNC cable end jack 75 

35 BNC front panel mount jack 50 

36 BNC front panel mount jack 75 

37 BNC front panel mount jack with isolated ground 50 

38 BNC front panel mount jack with isolated ground 75 

39 BNC rear panel mount jack 50 

40 BNC rear panel mount jack 75 

Material and Finish 

Male center conductor: Brass 

Female center conductor: Beryllium copper or phosphor bronze 

Center conductor finish: Silver plated 

Connector body: 

Nickel plated brass 

Overmold: Black thermoplastic, UL rated 94 V-0 



Standard Cable Selection Guide 

Cable Style Numbers 

STYLE # IMPEDANCE CONSTRUCTION CONDUCTOR DIELECTRIC SHIELD PROPAGATION WIRE SIZE DC RESISTANCE MAXIMUM JACKET JACKET NOMINAL 

(OHMS) INSULATOR DELAY NS/FT (AWG SOLID MAX. (OHMS/ SKEW MATERIAL COLOR O.D. 

(±10%) OR STRANDED) [1000 FT] BETWEEN 

20°C) CONDUCTORS 

21 50 Coax Silver Low Aluminum/ 1.20 30 103.7 N/A FEP Blue .054 

±10 Plated Density Polyester ± .03 AWG ± .004 

Copper Extruded w/drain Solid 

TFE 

05 50 Braided Silver Low TPC 1.20 26 37.3 N/A FEP Yellow .073 

±2 Coax Plated Density Braid ± .03 AWG ± .003 

Copper Extruded 7 x 34 

TFE 

09 50 RG-178 Silver Solid SPC 1.46 30 96.1 N/A FEP Tan .071 

±2 Braided Plated PTFE Braid ± .03 AWG ± .004 

Coax Copper 7 x 38 

Covered 

Steel 

22 75 Coax Silver Low Aluminum/ 1.20 32 162.1 N/A FEP Green .058 



TFE 

06 75 Braided Silver Low TPC 1.20 30 96.1 N/A FEP Green .074 

±5 Coax Plated Density Braid ± .03 AWG ± .003 

Copper Extruded 7 x 38 

TFE 

23 90 Coax Silver Low Aluminum/ 1.20 33 205.7 N/A FEP Orange .064 



TFE 

24 100 Coax Silver Low Aluminum/ 1.20 33 205.7 N/A FEP Red .070 



TFE 

34 100 Twin Silver Low Aluminum/ 1.20 30 96.1 .010 PVC Blue .056/ 

±10 Coax Plated Density Polyester ± .03 AWG ns/ft .076 

Copper Extruded w/drain 7 x 38 

TFE 

42 100 Jacketed Silver Extruded N/A 1.43 26 37.3 N/A FEP Red .066 

±10 Twisted Plated PTFE ± .05 AWG ± .008 

Pair Copper 7 x 34 

43 100 Shielded Silver Low Aluminum/ 1.25 30 96.1 N/A PVC Black .092 

±10 Jacketed Plated Density Polyester ± .05 AWG ± .004 

Twisted Copper PTFE w/drain 7 x 38 

Pair 

Standard 

Length Tolerance 

Under 36”: ±0.5” 

36” - 120”: ±1.0” 

Over 120”: ±2.0” 



Specifications 

Electrical 

Current rating: 

Contact resistance: 

Dielectric withstanding voltage: 

Insulation resistance: 

Insulation resistance (BNCs only): 

Nominal impedance (BNCs only): 

1.0 amp/contact (continuous) 

10 milliohm (maximum) 

300 VRMS (minimum) @ 60 Hz 

>1 x 10 9 ohms @ 500 VDC 

500 megaohms (minimum) 

50 ohms and 75 ohms 

Mechanical — Socket Interconnects/Single Signal Carrier Systems 

Pin insertion depth: 

.160” (min.) to .340” (max.). 

May vary depending on header style used. 

.250” (max.) for low profile configuration. 

Insertion force: 

245 grams/contact (nominal) 

Withdrawal force: 


Normal force: 


Mechanical — PCB Soldertail Interconnects 

Pin length: .110” or .160” 

Mating device: 

.100” x .100” plated through hole pattern 

(.035” diameter ±.003” finished hole size) 

Environmental 

Temperature rating: 

Materials: 

-40°C to +105°C 




Electrical Test Data 

Meritec SSI Cable Assemblies are designed to transmit high 

speed digital and analog signals with minimal signal distortion 

and low crosstalk. All assemblies are put through rigorous 

testing to assure maximum signal fidelity. Additional test data 

is available on request. 

Near End Connector Crosstalk 

50 OHM IMPEDANCE 

CONTROLLED BOARD 

TEKTRONIX 

CSA 803/SD24 

SIGNAL ANALYZER 

18 INCHES 

36 INCHES 

CABLE ASSEMBLY 

UNDER TEST 

50 OHM (3 PLCS) 

Connector Crosstalk (Near End) 50 Ohm 1x2 Cable Assembly. 

50 OHM 

INTERFACE CABLE ASSEMBLY 

NEAR END 

MEASUREMENT 

ACTIVE LINE 

QUIET LINE 

Connector Crosstalk (Near End) 50 Ohm 1x2 Cable Assembly. 

4% 

1 ns Risetime 500 ps Risetime 

4% 

Percent Crosstalk 

2% 

0% 

-2% 


2% 

0% 

-2% 

-4% 

-4% 

Time 500 ps/Div. 


SSI 

GPI 

SSI 

GPI 

Far End Connector Crosstalk 



TEKTRONIX 

CSA 803/SD24 


18 INCHES 

36 INCHES 


UNDER TEST 

50 OHM (3 PLCS) 

50 OHM 


ACTIVE LINE 

FAR END 

MEASUREMENT 

QUIET LINE 

Connector Crosstalk (Far End) 50 Ohm 1x2 Cable Assembly. 

Connector Crosstalk (Far End) 50 Ohm 1x2 Cable Assembly. 

4% 

1 ns Risetime 

4% 

500 ps Risetime 


2% 

0% 

-2% 


2% 

0% 

-2% 

-4% 

-4% 



SSI 

GPI 

SSI 

GPI 



Electrical Test Data (continued) 

Impedance Mismatch 

PT. B 

CONNECTOR 1 

CONNECTOR 2 

7 INCHES 

TEKTRONIX CSA 

803/SD24 



UNDER TEST 

PT. A 

50 OHM 


AND AIR LINE 

36 INCHES 

TOTAL 

36 INCHES 



1x2 SSI And GPI Assemblies. 36 Inches Long 50 Ohm Coax Cable, Style # 05. 

1x2 SSI And GPI Assemblies. 36 Inches Long 50 Ohm Coax Cable, Style # 05. 

70 

1 ns Risetime 

70 

250 ps Risetime 

Impedance (Ohms) 

60 

50 

40 

CONNECTOR 2 

PT. A 

PT. B 

IMPEDANCE 


Impedance (Ohms) 

60 

50 

40 

PT. A 

CONNECTOR 2 

PT. B 

IMPEDANCE 


30 

SIGNAL 

AND GROUND 

SHORTED AT 

THE FAR SIDE 

OF THE BOARD 


30 

SIGNAL 

AND GROUND 

SHORTED AT 

THE FAR SIDE 

OF THE BOARD 


SSI GPI 

Input Rise Time To Connector 2 = 1 ns 

SSI GPI 

Input Rise Time To Connector 2 = 250 ps 

Wave Form Degradation and Attenuation vs. Frequency 

HP 8082/A 

PULSE GENERATOR 

TEKTRONIX 7854 

OSCILLOSCOPE 

INPUT VOLTAGE TEST: 

18 INCHES L 


UNDER TEST 

50 OHM 

18 INCHES 

HP 8082/A 

PULSE GENERATOR 

50 OHM 

INTERFACE 


OUTPUT VOLTAGE TEST: 

L 


UNDER TEST 

50 

OHM 

TEKTRONIX 7854 

OSCILLOSCOPE 

50 OHM 

INTERFACE 


Wave Form Degradation: 1x2 SSI, 50 Ohm Coax Cable Assembly, 

At 65 Mhz Cable Style #05. L = 36” 

100 

Attenuation vs. Frequency: 

1x2 SSI Cable Assembly, L = 100 ft. 

Voltage (0.5 V/Div.) 

dB/100 ft. 

10 

Time (ns) 1.016 ns /Div. 

Input Pulse Output Pulse 

Rise Time Of Pulse: Input = 1 ns, Output = 1.016 ns 

1 

1 10 

100 

Frequency (Mhz) 

Cable Style #21 (30 AWG Signal Conductor) 

Cable Style #05 (26 AWG Signal Conductor) 




How to order: Meritec’s modular cable assembly description 

system makes it easy to order an assembly to meet your exact needs. 

To construct an order number, please fill in the boxes below from the 

termination, housing and cable information on pages 4-8. 

To order SSI, GPI, PCB or BNC assemblies: 

— — — — . 

Connector Type Left Right Cable Assembly 

Termination Termination Style Length 

Fill in SSI, GPI, PCB See pages 4, 6 and 7 for termination style numbers See page 8 for “L” length is measured 

or BNC, based on the cable style tip to tip in inches 

left termination 

numbers 

connector type. 

To order carrier assemblies: 

S S C 

— — — — — — . 

Left Right Carrier Positions Cable Assembly 

Termination Termination Style Style Length 

See page 4 for termination See page 5 See page 8 “L” length is measured 

style numbers for carrier for cable style tip to tip in inches 

style numbers 

numbers 

If carriers are not fully populated or harnessing is required, 

please contact your Meritec Customer Service Representative. 

To order carriers only: 

S S C 

— — 

Carrier 

Style 

See page 5 

for carrier 

style numbers 

Positions 

To order, call Meritec Customer Service at 1-800-860-9014. 

For technical questions and additional information, ask for the 

name and location of your nearest Meritec Sales Representative. 

Internet: www.meritec.com 



989 58 5**47& 56'8)54*4&)6+ 005 176!5 

2319, 



0110345676489687648 ,74/25 /0#1%00#1 

,-9-,6)645+' "#1$1%8&67&8568'!4( .451- 368510#740#!855)48'57!488!7465 )68*)!67648)5**47& -,6*)768'

A P Products 

Notes 



A P Products 

Notes 



A P Products 

Datasheets 


Section 1 


Section 2 


Section 3 


Section 4 


Section 5 


Section 6 


Section 7 




A P Products 

Elastomer 

Goldwire/Elastomer Interconnection Technology 

• Contact element is gold wire embedded in 

elastomeric substrate 

• Contact spacing from 0,3 mm and up 

• Height between boards 0,5 mm and up 

• Substrate size 3 x 3 mm to 50 x 50 mm 

Product Application 

All type of board to board, flex to board, sensor or device to board, both for dynamic as well as static 

applications in: 

• Industrial and robotics 

• Medical 

• Portable devices 

• Military 

• Test & Measurement 

• Prototyping 

Features and Benefits 

• Small pitch and low height allow compact design 

• Electrically almost invisible allowing high data rates 

• Versatile, can use PCB, FEC, FPC or other interconnect material 

• High number of mating cycles allows use in demanding applications 

• Field replaceable – keeps maintenance cost low 

• High number of positions eliminate need of aligning multi components 

Electrical 



Inductance: 

Environmental 


50 mA per wire 

20 mOhm 

-1 dB @ 10 GHz bandwidth 

-40°C to +120°C 



A P Products 

Elastomer 


930100-03-xx-xx-xx 

Pitch Thickness of pad (in mm) Lengths of pad (in mm) width of pad (in mm) 

0,3 mm 05 = 0,5 mm min. 03 mm min. 03 mm 

10 = 1,0 mm max. 50 mm max. 50 mm 

15 = 1,5 mm 

20 = 2,0 mm 

25 = 2,5 mm 

30 = 3,0 mm 

35 = 3,5 mm 

40 = 4,0 mm 

Mounting hardware can be provided on request. 











15.06.2015 14.26.00

A P Products 

Notes 



A P Products 

Notes 



A P Products 

Notes

Gesamtkatalog 2016-2

Create successful ePaper yourself

Delete template?

Save as template?