Radiation Hardened Electronics Market

electronics market are the emerging of small satellites (SmallSats) with small life cycle. This
small satellites market is called Space 2.0.
The radiation hardened electronics component market can be segmented based on components
(power management, ASIC, logic, memory, FPGA), manufacturing technique (RHBD radiation
hardening by design, RHBP Radiation hardening by process), application (space, aerospace &
defense, nuclear power plant), geography (North America, Europe, Asia-Pacific, rest of the
world).
North America is the largest market for radiation hardened electronics market. Europe is the
second largest market for radiation hardened electronics followed by APAC. In North America,
U.S. accounts for the largest share in radiation hardened electronics . Canada and Mexico follow
the numbers in U.S. for radiation hardened electronics . The rising demand of the radiation
hardened electronics in North America region could be due to presence of rad-hard component
manufacturers in large numbers. Also presence of some famous defense and space research
institutes is the major reason for growing radiation hardened electronics market.
Space application is leading the radiation hardened electronics . Space application is further
segmented into commercial & military application.
Key players in the market include Honeywell Aerospace (U.S.), Xilinx, Inc. (U.S.), Atmel
Corporation (U.S.), and BAE Systems (U.K.). Other Players include STMicroelectronics,
Microsem, Texas Instruments, and IRC.
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