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■ MEMS-Based Spectroscopy<br />
replication of semiconductor capabilities<br />
for the photonics industry. The technology<br />
pulls from a library of well-characterized<br />
and validated optical and mechanical<br />
components to design and fabricate optical<br />
benches — on a single silicon chip.<br />
The team used this technology to develop<br />
a fully monolithic Michelson interferometer<br />
with moving mirrors.<br />
The Michelson interferometer, the core<br />
of any FT-NIR spectrometer, is an optical<br />
interferometer. A beamsplitter splits the<br />
incident beam into two paths: One of the<br />
beams is reflected by a moving mirror<br />
and the other is used as a reference when<br />
reflected by a fixed mirror. The moving<br />
mirror controls the optical path, or simply<br />
the delay, of the first beam and thus the<br />
two reflected beams interfere, producing<br />
a pattern that corresponds to the spectral<br />
content of the input light. The latter is<br />
captured by the single photodetector,<br />
generating an “interferogram.” The<br />
spectrum of the input light is directly<br />
generated by applying a Fourier transform<br />
over the interferogram.<br />
The three-dimensional SiMOST spectrometer<br />
design is printed onto masks<br />
in the same way that other MEMS devices<br />
are produced. These masks pattern the<br />
design onto silicon wafers by photolithography.<br />
The patterns are subsequently<br />
etched in layers, using batch processes.<br />
The chips are then diced and packaged,<br />
enabling unprecedented economies of<br />
scale that significantly lower costs.<br />
The scanning electron microscope<br />
photo of the miniaturized version of the<br />
Michelson interferometer shows all the<br />
optical components (fixed mirror, moving<br />
mirror and beamsplitter) as well as<br />
the mechanical components (a MEMS<br />
comb drive micro-actuator) integrated<br />
onto the single chip. The components<br />
are aligned using a single photolithography<br />
process. They are fabricated with a<br />
single deep reactive ion-etching (DRIE)<br />
process.<br />
The dedicated ASIC chip complements<br />
the functionality of the interferometer, resulting<br />
in the creation of a full spectrometer.<br />
It achieves this by generating the<br />
From Quality Control to Health Monitoring<br />
To capitalize on the potential of<br />
this technology to allow for a small, low-cost<br />
and scalable NIR spectral sensor, a chipsized<br />
spectral sensor module was developed.<br />
The photodetector, the MEMS chip and the<br />
ASIC chips have been housed under one<br />
roof in a single 18 × 18-mm package. The<br />
smaller footprint enables the creation of new<br />
usage models and applications for spectroscopy.<br />
Portable spectrometry, in-line process<br />
monitoring, wireless spectrometry networks<br />
under an IoT umbrella, and integration into<br />
mobile consumer devices are just a few<br />
examples. Each of these usage models can<br />
include qualitative and/or quantitative analysis<br />
of materials in different sectors including<br />
medical, industrial, food and beverage, forensics,<br />
and law enforcement applications.<br />
includes a wide steel tube to plunge into<br />
the soil to secure a representative sample.<br />
When the button is pushed, the scanner<br />
activates, obtains the soil signatures and<br />
relays them via mobile phone to a cloudbased<br />
database for a determination on the<br />
amount of nitrogen, phosphorus, potassium<br />
Portable soil analysis<br />
As an example of a new usage model<br />
made possible by the smaller FT-NIR form<br />
factor, a company called SoilCares, in the<br />
Netherlands, has incorporated the FT-<br />
NIR-based spectrometer into a ruggedized<br />
portable instrument for field use. The tool<br />
Exploded view of the spectral sensor in a chip-scale<br />
package.<br />
Si-Ware Systems<br />
www.photonics.com