Hermetic Packaging Market Analysis and Trends Report Over 2026

Browse key industry insights spread across 165 pages with 189 market data tables & 24
figures & charts from the report, “Hermetic Packaging Market Size By Configuration (Multilayer
Ceramic, Pressed Ceramic, Metal Can), By Product (Ceramic-Metal, Glass-Metal,
Passivation Glass, Transponder Glass, Reed Glass), By Application (Sensors, Lasers,
Transistors, MEMS (Microelectromechanical) Switches, Airbag Initiators, Photodiodes),By
Industry (Military & Defense, Aerospace, Automotive, Medical, Telecommunication),
Industry Analysis Report, Regional Outlook, Application Growth Potential, Price Trends,
Competitive Market Share & Forecast, 2019 – 2026” in detail along with the table of
contents:
https://www.gminsights.com/industry-analysis/hermetic-packaging-market
Evolving airline industry along with rising consumer expenditure on flights has accelerated
the expansion of commercial aircrafts sector. As per estimates, the air travel business will be
2.5 times larger over the next 2 decades and the global commercial jet fleet is estimated to
double in size along with growth of air passenger traffic by more than 4.5% by 2038.
Hermetic connecters are expansively used in aircraft systems to ensure the safety of
delicate electronics. Growing consumption of hermetic connectors in sensors and fuel
systems of aircrafts is estimated to provide impetus to the industry growth.
In the healthcare sector, hermetic packaging is commonly utilized in implantable medical
devices, such as micro-housings for miniature components in endoscopic applications,
cardiac implants, pacemakers, defibrillators, and UV lasers for surgical drilling. Expansion of
North American healthcare sector along with increasing expenditure on advanced medical
services across the United States may result in product proliferation. In 2017, the medical
device industry in the U.S. was the largest with over USD 150 billion and the U.S R&D
investments for medical devices accounts for 7% of the sales revenue.
Configuration-wise, pressed ceramic packages is estimated to showcase a notable CAGR of
above 6% over 2019-2026. This escalating growth rate can be attributed to the relatively
low cost of the product as compared to multilayer ceramic packages.
MEMS (Microelectromechanical) switches are delicate and possess moving structures,
which can be disrupted by the air or pressure in the environment, and hence require
hermetic packaging. MEMS switches application segment is estimated to register an
appreciable growth rate of around 8% over the forecast period.
Key industry players operating in hermetic packaging market include SCHOTT AG, Materion
Corporation, Texas Instruments, Teledyne Technologies, Willow, Renesas Electronics
Corporation, Legacy Technologies, AMETEK.Inc., Micross, KYOCERA Corporation, EGIDE,
Special Hermetic Prod., SGA Technologies, and Winchester Interconnect among others.
These manufacturers are engaged in product innovation, strategic collaborations, and
mergers for expanding their business operations to gain profitable growth.
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