flip chip technology market trends
flip chip technology market trends by wafer bumping process (CU pillar, lead-free), packaging technology (2D, 2.5D, 3D), packaging type (FC BGA, FC PGA, FC LGA), product, application (consumer electronics, automotive) – Forecast till 2023
flip chip technology market trends by wafer bumping process (CU pillar, lead-free), packaging technology (2D, 2.5D, 3D), packaging type (FC BGA, FC PGA, FC LGA), product, application (consumer electronics, automotive) – Forecast till 2023
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Flip Chip Technology Market Forecast To 2023
Global Flip Chip Technology Market Segmented on the basis of
MRFR’s argument regarding the global flip chip technology market is based on a detailed segmentation.
The segmentation includes wafer bumping process, packaging technology, packaging type, product, and
application.
Based on the wafer bumping process, the flip chip technology market can be segmented into copper (CU)
pillar, lead-free, Tin-lead eutectic solder and gold stud plated solder.
Based on the packaging technology, the flip chip technology market ca be segmented into 2D, 2.5D, and
3D packaging technology.
Based on the packaging type, the flip chip technology market comprises FC PGA (Flip Chip Pin Grid Array),
FC LGA (Flip Chip Land Grid Array), FC QFN (Flip Chip Quad Flat No-Lead), FC SIP (Flip Chip System-In-
Package), FC BGA (Flip Chip Ball Grid Array), and FC CSP (Flip Chip-Chip-Scale Package).
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