放熱・電磁波対策部材レポート - 株式会社 ジャパンマーケティングサーベイ

≪ 新 刊 レポートのご 案 内 ≫放 熱 ・ 電 磁 波 対 策 部 材 レポート◆ 発 刊 日 :2010 年 2 月 15 日◆ サイズ/ページ 数 :A4 サイズ/151 ページ◆ 価 格 :12 万 6,000 円 ( 税 込 )、オプションCD 付 *:15 万 7,500 円 ( 税 込 )*オプション CD をご 希 望 の 場 合 、NDA 契 約 書 ( 申 込 書 )へのサインが 必 要 となります。調 査 のポイント‣ 放 熱 部 材 の 市 場 動 向- 高 熱 伝 導 性 樹 脂 、グラファイトシート、ヒートパイプ、ファン、ヒートシンク 材 料 、フィン・ 製 品 概 要 、アプリケーション 別 採 用 状 況 、 採 用 事 例・ 参 入 メーカの 取 組 み 状 況・ 市 場 動 向 (アプリケーション 別 シェア、メーカ 別 シェア)・ 市 場 規 模 推 移 予 測‣ 電 磁 波 対 策 部 材 の 市 場 動 向-FPC 用 電 磁 波 シールドフィルム、ノイズ 抑 制 シート、PDP 用 電 磁 波 シールドフィルム・ 製 品 概 要 、アプリケーション 別 採 用 状 況 、 採 用 事 例・ 参 入 メーカの 取 組 み 状 況・ 市 場 動 向 (アプリケーション 別 シェア、メーカ 別 シェア)・ 市 場 規 模 推 移 予 測‣ アプリケーション 動 向 ( 携 帯 電 話 、PC/ノート PC、FPD)‣ メーカ 事 例 研 究〒103-0004 東 京 都 中 央 区 東 日 本 橋 3-10-14 サンライズ 橘株 式 会 社 ジャパンマーケティングサーベイTEL:03-5641-2871 FAX:0120-052-807URL) http://www.jms21.co.jp

目 次第 1 章 総 論1. 放 熱 ・ 電 磁 波 対 策 部 材 の 全 体 市 場 規 模 (2009 年 )- 金 額 ベース- ·········································· 22. 放 熱 部 材 の 市 場 規 模 (2009 年 、2013 年 )- 金 額 ベース- ······················································ 43. 電 磁 波 対 策 部 材 の 市 場 規 模 (2009 年 、2013 年 )- 金 額 ベース- ··········································· 54. 放 熱 ・ 電 磁 波 対 策 部 材 の 市 場 規 模 推 移 予 測 (2009~2013 年 )- 金 額 ベース- ······················· 65. 各 種 放 熱 ・ 電 磁 波 対 策 部 材 のメーカ 別 販 売 額 (2009 年 )····················································· 96. 各 種 放 熱 部 材 のメーカシェア(2009 年 )- 金 額 ベース- ························································ 107. 各 種 電 磁 波 対 策 部 材 のメーカシェア(2009 年 )- 金 額 ベース- ··············································118.メーカ 別 参 入 製 品 一 覧 ····································································································· 129. 参 入 メーカの 生 産 及 び 開 発 拠 点 ······················································································· 1510. 各 種 放 熱 部 材 の 市 場 規 模 (2009、2013 年 )/ 成 長 率 / 市 場 成 長 要 因 / 技 術 トレンド ······ 1811. 各 種 電 磁 波 対 策 部 材 の 市 場 規 模 (2009、2013 年 )/ 成 長 率 /市 場 成 長 要 因 / 技 術 トレンド··························································································· 1912. 主 要 セット 機 器 別 発 熱 デバイス/ 発 熱 量 の 変 化 / 放 熱 部 材 採 用 箇 所 (2009 年 )/今 後 の 採 用 動 向 (~2013 年 ) ························································································· 20第 2 章 放 熱 部 材 の 市 場 動 向Ⅰ. 高 熱 伝 導 樹 脂1. 製 品 概 要 ························································································································ 232. 製 品 分 類2-1. 熱 伝 導 性 ·················································································································· 232-2. 電 気 伝 導 性 ( 導 電 性 / 絶 縁 性 ) ················································································· 242-3.バインダ 樹 脂 ············································································································ 242-4. 熱 伝 導 フィラー·········································································································· 243. 価 格 帯 ···························································································································· 254. 応 用 分 野 別 採 用 状 況 ( 導 電 性 / 絶 縁 性 タイプ 別 ) ····························································· 255. 採 用 事 例 ························································································································ 266.メーカ 製 品 動 向 / 製 品 仕 様 / 特 徴 ························································································ 277.メーカの 生 産 拠 点 と 研 究 開 発 ・ 生 産 動 向 ··········································································· 288. 各 社 の 製 品 比 較 ·············································································································· 299. 応 用 分 野 別 / 電 気 伝 導 性 タイプ 別 市 場 規 模 推 移 予 測 (2008~2013 年 )··························· 3010.アプリケーション 別 シェア- 金 額 ベース-(2009 年 ) ···························································· 3111.メーカシェア- 金 額 ベース-(2009 年 ) ··············································································· 3212. 主 要 供 給 先 ··················································································································· 32Ⅱ.グラファイトシート1. 製 品 概 要1-1. 概 要 ························································································································· 33

1-2. 製 品 のタイプ ············································································································ 331-3. 価 格 帯 ····················································································································· 332. 応 用 分 野 別 採 用 状 況2-1. 最 終 用 途 における 採 用 状 況 ······················································································ 342-2. 携 帯 電 話 への 採 用 事 例 ···························································································· 353. 参 入 企 業 一 覧 と 製 品 ······································································································· 354. 各 社 製 品 比 較 ················································································································· 365. 市 場 規 模 推 移 予 測 (2008~2013 年 )··············································································· 376.アプリケーション 別 シェア(2009 年 )·················································································· 387.メーカシェア(2009 年 )····································································································· 398. 供 給 先 状 況 ····················································································································· 39Ⅲ.ヒートパイプ1. 製 品 概 要1-1. 概 要 ························································································································· 401-2. 動 作 原 理 ·················································································································· 401-3.ヒートパイプの 構 成 部 材 ···························································································· 401-4. 製 品 分 類1) 管 の 材 質 タイプ········································································································ 412)ウイックタイプ ·········································································································· 411-5. 価 格 帯 ····················································································································· 412. 応 用 分 野 別 採 用 状 況 ······································································································ 423. 採 用 事 例 ························································································································ 434.メーカ 動 向4-1. 参 入 企 業 と 製 品 / 種 類 ································································································ 444-2. 生 産 拠 点 と 能 力 ········································································································ 455. 市 場 規 模 推 移 予 測 (2008~2013 年 )··············································································· 466.アプリケーション 別 シェア(2009 年 )·················································································· 477.メーカシェア(2009 年 )····································································································· 488. 主 要 供 給 先 ····················································································································· 48Ⅳ.ファン1. 製 品 概 要1-1. 概 要 ························································································································· 491-2.AC/DC 型 ················································································································ 491-3.サイズ······················································································································ 491-4. 構 造 タイプ················································································································ 501-5. 価 格 帯 ····················································································································· 502. 応 用 分 野 別 採 用 状 況 / 採 用 個 数 ······················································································· 503. 採 用 事 例 ( 研 究 開 発 品 含 む)···························································································· 514. 製 品 別 メーカ 製 品 化 動 向 ································································································· 53

5. 生 産 拠 点 と 能 力 ·············································································································· 546. 応 用 分 野 別 市 場 規 模 推 移 予 測 (2008~2013 年 )····························································· 557.アプリケーション 別 シェア- 数 量 ベース-(2009 年 ) ······························································ 568.メーカシェア(2009 年 )····································································································· 579. 主 要 供 給 先 ····················································································································· 58Ⅴ.ヒートシンク 材 料 (Metal Matrix Materials)1. 製 品 概 要1-1. 概 要 ························································································································· 591-2. 製 品 分 類 ·················································································································· 601-3. 価 格 帯 ····················································································································· 621-4. 主 要 応 用 分 野 ·········································································································· 622.メーカ 動 向2-1.タイプ 別 参 入 企 業 一 覧 ······························································································ 632-2.メーカ 動 向 ················································································································ 643. 市 場 規 模 推 移 予 測 (2008~2013 年 )··············································································· 654. 種 類 別 シェア(2009 年 )··································································································· 665.アプリケーション 別 シェア(2009 年 )·················································································· 676.メーカ 別 シェア(2009 年 ) ································································································· 68Ⅳ.フィン1. 製 品 概 要1-1. 概 要 ························································································································· 691-2. 冷 却 方 式 ·················································································································· 691-3. 金 属 種 類 ·················································································································· 691-4. 製 造 工 法 ·················································································································· 701-5.サイズ······················································································································ 701-6. 価 格 帯 ····················································································································· 712. 最 終 用 途 における 採 用 状 況 ····························································································· 713. 採 用 事 例 ························································································································ 724.メーカ 別 製 品 概 要 ( 素 材 / 製 造 工 法 / 主 要 用 途 )··································································· 735. 生 産 拠 点 と 能 力 ·············································································································· 746. 市 場 規 模 推 移 予 測 (2008~2013 年 )··············································································· 757.アプリケーション 別 シェア(2009 年 )·················································································· 768.メーカシェア(2009 年 )····································································································· 779. 主 要 供 給 先 ····················································································································· 78第 3 章 電 磁 波 対 策 部 材 の 市 場 動 向Ⅰ.FPC 用 電 磁 波 シールドフィルム1. 製 品 概 要1-1. 概 要 ························································································································· 80

1-2. 製 品 タイプ················································································································ 801-3. 価 格 帯 ····················································································································· 802. 応 用 分 野 別 採 用 状 況2-1. 最 終 用 途 における 採 用 状 況 ······················································································ 812-2. 採 用 事 例 (スライド 式 携 帯 における 電 磁 波 シールドフィルムの 適 用 ) ···························· 823.メーカ 動 向3-1. 参 入 企 業 及 び 製 品 ··································································································· 833-2. 生 産 拠 点 と 能 力 ········································································································ 833-3.メーカ 事 業 動 向 ········································································································· 844. 製 品 比 較 ························································································································ 855. 市 場 規 模 推 移 予 測 (2008~2013 年 )··············································································· 866.アプリケーション 別 シェア(2009 年 )·················································································· 877.メーカシェア(2009 年 )····································································································· 888. 主 要 供 給 先 ····················································································································· 88Ⅱ.ノイズ 抑 制 シート1. 製 品 概 要1-1. 概 要 ························································································································· 891-2. 製 品 分 類1) 用 途 ························································································································ 892) 構 成 材 料 ················································································································ 901-3. 価 格 帯 ····················································································································· 901-4. 採 用 事 例 ·················································································································· 902. 応 用 分 野 別 採 用 状 況 ······································································································ 913.メーカ 動 向3-1. 主 要 参 入 メーカ/ 製 品 / 構 成 素 材 ················································································· 923-2. 生 産 拠 点 と 能 力 ········································································································ 924. 製 品 比 較1)ノイズ 抑 制 シート ········································································································· 932)RFID 用 シート ············································································································ 945. 市 場 規 模 推 移 予 測 (2008~2013 年 )··············································································· 956.アプリケーション 別 シェア(2009 年 )·················································································· 967.メーカシェア(2009 年 )····································································································· 978. 主 要 供 給 先 ····················································································································· 97Ⅲ.PDP 用 電 磁 波 シールドフィルム1. 製 品 概 要1-1. 概 要 ························································································································· 981-2. 製 品 分 類 ·················································································································· 991-3. 価 格 帯 ····················································································································· 992. 主 要 パネルメーカにおける PDP の 製 品 動 向 ···································································· 99

3.メーカ 動 向3-1.メーカ 別 取 扱 い 製 品 ································································································ 1003-2. 生 産 拠 点 と 能 力 (2009 年 )······················································································ 1004. 製 品 比 較 ······················································································································ 1015. 市 場 規 模 推 移 予 測 (2008~2013 年 )············································································· 1016.メーカシェア(2009 年 )··································································································· 1027.タイプ 別 シェア(2009 年 ) ······························································································· 1038.メーカ 別 供 給 先 の 状 況 と 採 用 比 率 ·················································································· 104第 4 章 主 要 アプリケーションの 市 場 動 向 と 放 熱 ・ 電 磁 波 対 策 部 材 の 採 用 状 況Ⅰ. 携 帯 電 話1. 市 場 規 模 推 移 予 測 (2008~2013 年 )············································································· 1062.メーカシェア-2009 年 -···································································································· 1063. 携 帯 電 話 メーカのアセンブリ/ 生 産 地 域 ········································································· 1074. 放 熱 ・ 電 磁 波 対 策 部 位 と 各 種 部 材 の 採 用 の 現 状4-1. 放 熱 ・ 電 磁 波 対 策 部 位 ····························································································· 1084-2. 携 帯 電 話 、スマートフォンにおける 放 熱 ・ 電 磁 波 対 策 部 材 の 採 用 の 現 状 (2009 年 )····· 1085. 放 熱 ・ 電 磁 波 対 策 部 材 の 採 用 動 向 (2013 年 )5-1. 放 熱 部 材 ················································································································· 1095-2. 電 磁 波 対 策 部 材 ······································································································ 109Ⅱ.PC/ノート PC(ネットブックを 含 む)1. 市 場 規 模 推 移 予 測 (2008~2013 年 )··············································································1102.メーカシェア-2009 年 -2-1.PC タイプ 別 ··············································································································1112-2.ノート 型 PC 全 体1)ブランドベース ··········································································································1122) 製 造 企 業 ベース········································································································1123. 放 熱 ・ 電 磁 波 対 策 部 位 と 各 種 部 材 の 採 用 の 現 状3-1.PC/ノート PC 別 、 放 熱 ・ 電 磁 波 対 策 部 位 ·································································1133-2. 放 熱 ・ 電 磁 波 対 策 部 材 の 採 用 の 現 状 (2009 年 )·························································1134. 放 熱 ・ 電 磁 波 対 策 部 材 の 採 用 動 向 (2013 年 )4-1. 放 熱 部 材1)PC ···························································································································1142)ノート PC··················································································································1143)ネットブック ···············································································································1144-2. 電 磁 波 対 策 部 材 ·······································································································114Ⅲ. 据 え 置 き 型 ゲーム 機1. 市 場 規 模 推 移 予 測 (2008~2013 年 )··············································································1152.メーカシェア-2009 年 -·····································································································115

3. 放 熱 対 策 部 位 と 各 種 部 材 の 採 用 の 現 状3-1. 放 熱 対 策 部 位1)XBOX360(Microsoft) ······························································································1162)Wii(Nintendo)/PS3(Sony Computer Entertainment) ···········································1163-2. 放 熱 部 材 の 採 用 の 現 状 (2009 年 ) ············································································1164. 放 熱 部 材 の 採 用 動 向 (2013 年 ) ·····················································································116Ⅳ.FPD1. 市 場 規 模 推 移 予 測 (2008~2013 年 )··············································································1172.メーカシェア- 金 額 ベース-(2009 年 )1)LCD ···························································································································1172)PDP ···························································································································1183. 放 熱 ・ 電 磁 波 対 策 部 位 と 各 種 部 材 の 採 用 の 現 状3-1.LCD/PDP 別 、 放 熱 ・ 電 磁 波 対 策 部 位 ·····································································1183-2. 放 熱 ・ 電 磁 波 対 策 部 材 の 採 用 の 現 状 (2009 年 )·························································1194. 放 熱 ・ 電 磁 波 対 策 部 材 の 採 用 動 向 (2013 年 )··································································119Ⅴ.LED 照 明1. 市 場 規 模 推 移 予 測 (2008~2013 年 )············································································· 1202.LED 電 球 ・LED 照 明 器 具 の 製 品 概 要 / 市 場 性 ······························································ 1213. 放 熱 対 策 部 位 と 各 種 部 材 の 採 用 の 現 状3-1. 放 熱 対 策 部 位 ·········································································································· 1213-2. 放 熱 部 材 の 採 用 の 現 状 (2009 年 ) ··········································································· 1224. 放 熱 部 材 の 採 用 動 向 (2013 年 ) ···················································································· 122第 5 章 企 業 事 例 研 究住 友 大 阪 セメント 株 式 会 社 ······························································································ 124住 友 軽 金 属 工 業 株 式 会 社 ( 住 友 軽 金 属 グループ)···························································· 127住 友 ベークライト 株 式 会 社 ······························································································· 129株 式 会 社 タイカ··············································································································· 131東 洋 インキ 製 造 株 式 会 社 ································································································ 134日 立 化 成 工 業 株 式 会 社 ·································································································· 136株 式 会 社 フジクラ············································································································ 138古 河 電 気 工 業 株 式 会 社 ·································································································· 141水 谷 電 機 工 業 株 式 会 社 ·································································································· 145ミネベア 株 式 会 社 ··········································································································· 146株 式 会 社 リョーサン········································································································· 148Delta Electronics, Inc. ····································································································· 151

内 容 見 本第 1 章 総 論放 熱 部 材 の 市 場 規 模放 熱 ・ 電 磁 波対 策 部 材 の市 場 規 模 推 移予 測各 種 放 熱 部 材 の 市 場 規 模 (2009、2013 年 )/ 成 長 率 /市 場 成 長 要 因 / 技 術 トレンド

第 2 章 放 熱 部 材 の 市 場 動 向Ⅲ.ヒートパイプ製 品 概 要応 用 分 野 別 採 用 状 況メーカ 動 向

申 込 書2010 年 月 日㈱ジャパンマーケティングサーベイ 行FAX:0120-052-807レポート 名 : 放 熱 ・ 電 磁 波 対 策 部 材 レポート□レポートのみ¥126,000-( 税 込 )□レポート+オプション CD 付 ¥157,500-( 税 込 )CD 付 をお 申 込 の 場 合 、 申 込 書 下 段 にある NDA 契 約 書 にサインが 必 要 となります。企 業 名 :申 込 希 望 担 当 者 :所 属 :役 職 :E-mail:住 所 :( - )TEL:FAX:( 社 名 )____________は Japan Marketing Survey Co., Ltd.( 以 下 JMS と 略 )の 調 査 資 料 「 放 熱 ・ 電 磁 波 対 策 部 材 レポート」の 内 容 について、JMS の 許 可 なく 第 三 者 へ 提供 したり、または 公 開 しないことをお 約 束 いたします。担 当 者 所 属 :担 当 者 名 (サイン):連 絡 事 項