Clusters - Leybold Optics GmbH

SPECIAL SYSTEMS
Clusters
Systems

Introduction
Leybold Optics Dresden designs and manufactures
Cluster Systems according to customers requirements.
These systems can employ physical vapour deposition
(PVD), namely sputtering and evaporation as well as
plasma cleaning and plasma enhanced chemical vapour
deposition (PECVD).
The Cluster Systems can be fully automatically controlled
and utilize a robot for substrate handling and a wafer
cassette loading chamber but can also be largely manu-
ally operated as for lower cost research and development
applications.
Substrates to be coated are usually silicon or glass
wafers but the Cluster Systems made by Leybold Optics
Dresden can be designed for handling of other substra-
tes as well.
CLUSTEX 100M

CLAB 500ebsp
CLUSTEX 250

CLUSTEX 100M Customer Benefit
The CLUSTEX 100M is a versatile lower cost magnetron
sputter tool intended for the use in research and deve-
lopment. The system can be largely manually operated
and easily be modified, providing maximum flexibility for
process development. The CLUSTEX 100M can be equip-
ped with various vacuum pumping systems depending
on the intended application.
Sputter chambers for use with single cathodes as well as
chambers for multiple sources and substrates are availa-
ble.

Process Equipment
The process equipment to be used in the CLUSTEX 100M
includes magnetrons up to 100 mm target diameter for
use with DC or RF power. There are also plasma sources
for use with inert and reactive gases available for the
CLUSTEX. Other process options include substrate hea-
ters, biased or rotary substrate holders, and cooling sta-
tions.
Applications
The CLUSTEX 100M has been successfully employed for
metallization of wafers by means of DC magnetron sput-
tering
deposition of dielectric films by means of RF sputtering
cleaning and activation of substrates before coating ion
beam sputtering and reactive ion etching of surfaces.
Other processes can be implemented on request.

CLAB 500ebsp
Customer Benefit
The CLAB series of systems represents Clusters that com-
prise an e-beam evaporation system and a magnetron
sputter and/or ion beam treatment system. These fully
automatically operated systems employ an automatic
vacuum robot for substrate handling and one or two sub-
strate loading stations for use with wafer cassettes.
CLAB systems are designed to meet semiconductor indu-
stry standards and can be operated from the clean room
side or from the grey room side during normal operation
or during maintenance or service, respectively.

Process Equipment
The process equipment implemented in the CLAB
500ebsp includes thermal and electron beam evapora-
tors, also in combination with ion beam assistance instal-
led in a LAB 500 chamber magnetrons up to 150 mm tar-
get diameter for use with DC or RF power implemented in
a sputter chamber a plasma source for substrate
cleaning implemented in a preparation chamber.
Other process options include substrate heaters, biased
or rotary substrate holders, and cooling stations.
Applications
The CLAB 500ebsp has been successfully employed for
metallization of wafers by means of DC magnetron sput-
tering deposition of metallic films by means of DC sput-
tering cleaning and activation of substrates before
coating.
Other processes can be implemented on request.

CLUSTEX 250
Customer Benefit
The CLUSTEX 250 is a fully automatic magnetron sputter
coating system with 250 mm diameter magnetrons for
substrates up to 200 mm diameter. It employs an auto-
matic vacuum robot for substrate handling, a substrate
loading station with wafer cassette elevator, and a sepa-
rate substrate cleaning and pre-treatment chamber.
CLUSTEX 250 systems are designed to meet semiconduc-
tor industry standards and can be operated from the
clean room side or from the grey room side during normal
operation or during maintenance or service, respectively.

Process Equipment
The process equipment implemented in the CLUSTEX
250 includes magnetrons with 250 mm target diameter
for use with DC or RF power increased source to substra-
te distance option rotary substrate table for improved
coating uniformity RF parallel plate plasma etcher for
substrate cleaning implemented in a preparation cham-
ber.
Other process options include substrate heaters, biased
substrate holders, and cooling stations.
Applications
The CLUSTEX 250 has been successfully employed for
metallization of 8 inch diameter wafers by means of DC
magnetron sputtering deposition of thin oxide films by
means of reactive magnetron sputtering cleaning and
activation of substrates before coating.
Other processes can be implemented on request.

Technical Features Overview CLUSTEX 100M
• manually operated R&D cluster tool
• manual substrate loading and transfer
• magnetron sputtering with DC and/or RF power
• metallic or reactive sputtering
• target size up to 100 mm diameter
• oil sealed or dry vacuum pumping systems
• turbo molecular high vacuum pumps

CLAB 500ebsp CLUSTEX 250
• fully automatic high vacuum coating cluster tool
• combination of e-beam or thermal evaporation and
magnetron sputtering in one cluster
• robotic substrate loading and transfer
• magnetron sputtering with DC and/or RF power
• metallic or reactive sputtering
• ion beam or plasma cleaning of substrates
• oil sealed or dry vacuum pumping systems
• turbo molecular or cryogenic high vacuum pumps
• installed through a clean room wall
• fully automatic high vacuum magnetron sputter
cluster tool
• robotic substrate handling with wafer cassette
elevator in loading chamber
• magnetron sputtering with DC and/or RF power
• metallic or reactive sputtering
• RF parallel plate plasma cleaning of substrates
• oil sealed or dry vacuum pumping systems
• turbo molecular or cryogenic high vacuum pumps
• installed through a clean room wall

CHINA
LEYBOLD OPTICS CHINA
#25, Kangsheng Industrial Park
No.11 Kangding Street
Beijing BDA, 100176, China
Phone: +86 10 67803366 - 0
Fax: +86 10 67803366 - 100
FRANCE
LEYBOLD OPTICS FRANCE
7 Avenue du Quebec
91140 Villebon sur Yvette
Z.A. de Courtaboeuf, France
Phone: +33 1 698248 - 12
Fax: +33 1 698248 - 40
GERMANY
LEYBOLD OPTICS DRESDEN
Zur Wetterwarte 50
Haus 303
01109 Dresden, Germany
Tel.: +49 351 86695 - 16
Fax: +49 351 86695 - 42
GREAT BRITAIN /
IRELAND
LEYBOLD OPTICS UK
St. Modwen Road, Stretford
Manchester M32 OZE, Great Britain
Phone: +44 161 86628 - 00
Fax: +44 161 86628 - 01
ITALY / AUSTRIA / SLOWENIA
LEYBOLD OPTICS ITALIA
Via Trasimeno 8
20128 Milano, Italy
Phone: +39 02 263050 - 84
Fax: +39 02 272096 - 95
HEADQUARTERS:
LEYBOLD OPTICS GmbH
Siemensstrasse 88
63755 Alzenau, Germany
Tel.: +49 6023 500 - 0
Fax: +49 6023 500 - 150
E-Mail: info@leyboldoptics.com
www.leyboldoptics.com
JAPAN
LEYBOLD OPTICS JAPAN
Kazama Bldg.
19-5, Nishi Shinbashi 2-chome,
Minato-ku, Tokyo, 105-0003 - Japan
Phone: +81 35 77755 - 51
Fax: +81 35 77755 - 53
KOREA
LEYBOLD OPTICS KOREA
# 1406, HyunDae 41 Tower, 917-9
Mok-1Dong, Yangcheon-Gu
Seoul 158-051, Korea
Phone: +82 2 2168 - 2136
Fax: +82 2 2168 - 2078
SPAIN / PORTUGAL
LEYBOLD OPTICS IBÉRICA
C/Carles Buigas 57-59
08980 Sant Feliu de Llobregat
Barcelona, Spain
Phone: +34 93 666 - 0778
Fax: +34 93 666 - 4612
TAIWAN
LEYBOLD OPTICS TAIWAN
82, Shien-Cheng 11th St., Chu-Bei City
302, Hsinchu County
Taiwan
Phone: +886 35 5831 - 23
Fax: +886 35 5831 - 39
USA / CANADA / SOUTH AMERICA
LEYBOLD OPTICS USA
539 James Jackson Ave.
Cary, NC 27513, USA
Phone: +1 919 65771 - 00
Fax: +1 919 65771 - 01