UltraFLEX General Purpose DIB Page 1 - Teradyne GSO

UltraFLEX General Purpose DIB
TERADYNE P/N 979-493-00
Teradyne’s UltraFLEX General Purpose DIB is specifically designed to allow prototyping on the
most common UltraFLEX configurations. It supports a wide variety of signals and instruments,
ranging from high power to precision analog to high speed digital.
Signals are brought to a solder launch area in the SW1 & SW2 space. The 9 x 10 hole pattern
accommodates soldering of 24 AWG cables. Ground connections are common to a given slot. Slot
grounds can then be jumpered depending on the application requirements. The applications street
is filled with a 0.100” x 0.100” spaced grid of plated through holes that have no internal
connections. This allows any device to be connected by wiring from the launch area to the bread
board area. The through holes accommodate a 24 AWG cable. In addition, there are several
common hole groups throughout the space, to facilitate power and ground return wiring.
FEATURES
Configuration supports a number of UltraFLEX
probe applications and configurations.
Economical 22 Layer, FR4 construction.
Separate analog and digital ground planes.
0.100” x 0.100” grid supports cable headers,
point to point wiring using 24 AWG cable.
Common wiring points for power, ground
connections using 18 AWG cable.
Supports GPIO.
PROTOTYPING AND CONCURRENT ENGINEERING
Enables test of a device using low cost,
full-scale interface hardware, providing
functional test results at low cost.
Enables test engineers to work proactively
with a device’s designers.
Catches unnecessary tests and gaps in the test
list, before production ramp.
Shortens overall test program
development time.
PRODUCT BENEFITS
Reduces turnaround time to get working
samples out the door.
Performs experiments to maximize
performance before committing to production
DIB design, avoiding costly DIB respins.
Refines test methodologies or design errors at
an early stage, reducing overall
development cost.
GSO INTEGRATION SERVICES - INTERFACES
THAT WORK RIGHT, THE FIRST TIME, EVERY TIME
UltraFLEX GENERAL PURPOSE DIB
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ULTRAWAVE AND GEN4 COMPATIBLE CONFIGURATIONS
INSTRUMENT TYPE # OF INSTRUMENTS CHANNELS TEST HEAD DIB SLOT
DC30 4 80 5, 18, 20, 23
DC75 0 0
HexVS 4 24 2, 19, 21, 22
GigaDig 0 0
AWG6G 0 0
TurboAC TM 0 0
BBAC TM 2 8 10, 11
VHFAC 2 4 12, 13
SB6G 0 0
HSD1000/UltraPin800 12 768
0, 1, 3, 4, 6, 7, 8, 9,
14, 15, 16, 17
HDVS 0 0
UltraWave TM 0 0
Gen4 0 0
UDB NA 32
User Supplies 6 3V - 15V 24, 25, 26, 27, 31, 35
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Teradyne, Inc.
Semiconductor Test Division
600 Riverpark Drive
North Reading, MA 01864
978-370-1200
www.teradyne.com
see how Teradyne Global Services Organization can help your business strategy,
contact your local Teradyne sales office or email gso-marketing-info@teradyne.com
Teradyne is a registered trademark and FLEX, UltraFLEX, BBAC, TurboAC and Ultrawave are trademarks of Teradyne, Inc.
in the U.S. and other countries. Information contained in this document is summary in nature and subject to change
without notice. Appearance of the final, delivered product may vary from photographs shown here.
© Teradyne 2010 • All Rights Reserved • Printed in the U.S.A.
ST-06148-0808-OK
FOR MORE INFORMATION
E-MAIL: GSO-Marketing-Info@teradyne.com
WEB: http://www.teradyne.com/gso/DeviceInterface