The Role of Flip Chip

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Solder bumping • Typical solder alloys High melting point Lead/Tin (95/5) solder Eutectic Tin/Lead (63/37) solder Lead-free solder: Tin/Copper/Silver etc Eutectic Gold/Tin (80/20) solder • Common solder deposition techniques Evaporation Plating Stencil printing Laser dispense Mould transfer IC Interconnect
Solder bumping underfill • Required for flip chip on board (FCOB) reliability • Underfill process underfill dispense underfill cure Dispense needle <strong>Flip</strong> <strong>Chip</strong> Integrated Circuit Laminate Printed Circuit Board Underfill drawn under die by capillary action
Page 1 and 2: “The Role of Flip Chip Bonding in
Page 3 and 4: Flip Chip Definitions * Flip “ A
Page 5 and 6: Flip chip bonding history • 1960
Page 7 and 8: Flip chip bonding advantages • Ve
Page 9 and 10: Solder flip chip bonding • Common
Page 11 and 12: Solder flip chip bond design mg/n S
Page 13 and 14: Solder flip chip bond design As dep
Page 15: Solder bumping • Wafer level proc
Page 19 and 20: Adhesive flip chip bonding • Comm
Page 21 and 22: Adhesive flip chip bonding Anisotro
Page 23 and 24: Solid phase flip chip bonding • C
Page 25 and 26: Solid phase bump coining Individual
Page 27 and 28: Flip chip industry infrastructure
Page 29 and 30: Flip chip discretes Source: Nationa
Page 31 and 32: Flip chip RFIC Bluetooth Radio Modu
Page 33 and 34: Source:GMMT Flip chip GaAs
Page 35 and 36: Flip chip SiPs Source: Intarsia. So
Page 37 and 38: Flip chip 3D integration Source: iN
Page 39 and 40: 16Gb memory (8 x 2Gb) 560μm Flip c
Page 41 and 42: Flip chip IR sensor devices Source:
Page 43 and 44: Flip Chip Trends Much wider uptake
Page 45: Thank you for your attention David

The Role of Flip Chip

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