The Role of Flip Chip
The Role of Flip Chip
The Role of Flip Chip
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Solder flip chip bond properties<br />
Bonding Parameter Wire Bond TAB <strong>Flip</strong> <strong>Chip</strong><br />
Material(s) Al Au Cu Pb-Sn<br />
Melting temperature, o C 660 1064 1084 310 or 183<br />
Typical bond geometry 25m diameter 25x100m tape x 100m diameter<br />
x 2.5mm length 2.5mm length 80m height<br />
Typical pitch, m 100m perimeter 200m perimeter 200m area<br />
Bond strength, grams 6 10 50 20<br />
Bond resistance, m.ohms 142 122 17 1.2<br />
Interbond capacitance, pF 0.025 0.025 0.006 0.001<br />
Bond inductance, nH 2.6 2.6 2.1
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