DSB-3000 or DSB-6000 SerieS User Manual

DSB-3000 or DSB-6000 SerieS
surface activation and
Organic photo resist striping
User Manual
Vers. : 3.0

Table of Contents
Safety Information 1
Safety Notes 1
Installation 2
How to Unpack DSB-3000 or DSB-6000 2
Recommended mounting: 2
Ventilation: 2
Connection to AC Mains: 2
Fittings 3
Use 3
Pressures/Gas 3
Contaminants 3
Service 3
Qualified Personnel 3
User Instructions 4
Introduction 4
Start Up 4
1.1 First use 4
Configuration Menu 5
2.1 Interface : 5
2.2 Date : 5
2.3 Vacuum Chamber: 6
2.4 Gas Interval Setup 6
2.5 Warm Substrate (option) : 7
2.6 Language : 7
2.7 Gas & T° Setup : 7
2.7.1 Vent MFC (option) : 8
2.7.2 Gas Setup : 8
2.7.3 T° End Recipe : 9
2.7.4 T° Security : 9
2.8 Error Review : 9
2.9 Storage Interval (ArH2): 10
Edit Menu 11
3.1 Recipe Name :; 12
3.2 RFG 1 : 13
3.3 Chamber Temp: 13
3.4 Substrate Temp. (option) : 14
3.5 Plasma Duration : 14
3.6 MFC Vent (option): 15
3.7 MFC O2 : 15
3.8 MFC gas 2 (N2-Ar-CF4-ArH2) 16
3.9 Set Point Pressure (option) 16
3.10 Storage Process (ARH2) 16
3.11 Pulse Process (Option) 17
Run Menu 18
4.1 Chosing Recipes 18

4.2 Starting the Process 20
4.3 Monitoring 21
Connection Facilities 23
Drawings 25
Electrical Schematics 25
Fluid Schematics 28
TYPICAL PROCESS CYCLE 30
Typical Process Cycle .....................................................................................................30
CE Certificat 32

Safety Notes
The DSB-3000 and DSB-6000 have been designed and tested to meet strict safety requirements. These include independent
lab examination and approval, and compliance to established standards. Please read the following instructions
carefully before operating the DSB-3000 or DSB-6000 and refer to them as needed to ensure the continued safe
operation of the DSB-3000 and DSB-6000. Failure to comply with these precaution or with specific warnings elsewhere
in this manual violates safety standards of intended use of the DSB system and may impair the protection
provided by the equipment. Nanoplas, SAS assumes no liability for the customer’s failure to comply with these
requirements.
Symbology:
CAUTION HAZARDOUS
VOLTAGE
GROUND
PROTECTIVE
RF POWER
Safety Information
BURN
HAZARD
ALTERNATING
CURRENT
Follow all warnings and instructions marked on or supplied with the product.
Unplug or disconnect this equipment from the power source before servicing.
Do not use this equipment near water, wet locations, or outdoors.
Do not operate in an explosive environment
It is the responsibility of the customer to provide a proper protective ground from the DSB-3000 or 6000 equipment
to earth ground, in accordance with local and national electrical codes, and any other codes applicable to the user.
The DSB-3000 or DSB- 6000 equipment should be operated from the type of power source indicated by the ratings
plate. If you are not sure of the type of power available, consult an electrician or your local power company.
CAUTION!
ELECTRICAL SHOCK HAZARD PRESENT INSIDE UNIT, AT
THE RF OUTPUT CONNECTOR, AND AT THE MAINS INPUT
CONNECTOR. DO NOT REMOVE COVERS. REFER SERVIC-
ING TO QUALIFIED SERVICE PERSONNEL.
1

Installation
How to Unpack DSB-3000 or DSB-6000
Nanoplas has packed the DSB-3000 or DSB-6000 so that it will reach you in perfect operating order. Upon receiving
the unit, however, you should check for defects, cracks, broken connectors, etc., to be certain that damage has not
occurred during shipment. If you find any damage, notify your carrier and NANOPLAS immediately
The weight of the DSB-3000 or DSB-6000 is around 185kg and has dimensions of 500mm x 640mm x 1410mm, so use
adequate equipment for the crate (forklift). After opening the crate (Front face), you can extract the equipment by rolling
it carefully forward on wheels. Once in place, the wheels must be removed and the equipment must stand firmly on its
feet. Be sure, once the equipment is in place, that the general breaker (at the rear of the DSB-3000 or DSB-6000) is always
accessible !
Recommended mounting:
DSB- 3000 and DSB- 6000 are designed for placement on the ground in a clean environment. The ground must be
capable of supporting the full weight of the unit. (450kg/ m 2 )
Ventilation:
2
The DSB 3000 and the DSB 6000 equipment require ventilation.
Connection to AC Mains:
Placing the DSB- 3000 or DSB-6000 in an unventilated enclosure will create an
“oven” effect and force the unit to shut down. Continued operation under conditions
of poor ventilation may degrade or damage the ports of DSB-3000 or DSB-
6000
Maximum air intake temperature is +40°C
BEFORE connecting the DSB-3000 or DSB-6000, verify the AC Mains voltage marked on the ratings plate, located on
the back panel of the DSB system, is compatible with your AC Mains voltage. If the AC Mains voltage on the ratings
plate is not compatible with your AC Mains voltage, contact Nanoplas service assistance.
The power cable connected to the customer power supply must be provided by customer. Connection must be done
by qualified service personnel only following the appendix connection facilities recommandentions.
CAUTION: CHECK YOUR MAINS VOLTAGE AND THE MAINS VOLTAGE
SPECIFIED ON THE RATINGS PLATE OR CONSULT A QUALIFIED ELECTRICIAN
BEFORE CONNECTING THE DSB-3000 or DSB-6000 TO MAINS POWER. CON-
NECTING THE DSB-3000 or DSB-6000 TO THE WRONG MAINS VOLTAGE MAY
DAMAGE THE DSB-3000 or DSB-6000 AND VOID THE WARRANTY.
Safety Information

Fittings
Use proper fittings and tightening procedures. (See appendix)
All DSB-3000 and DSB-6000 fittings must be consistent with DSB-3000 and DSB-6000 specifications, and compatible
with the intended use of the equipment. Assemble and tighten fittings according to manufacturer’s directions.
Check for leak-tight fittings
Carefully check vacuum connections to the pump to ensure leak-tight installation.
Use
Pressures/Gas
It is the responsibility of the customer to provide a proper gas installation. Make sure that the gas installation is in accordance
with local and national gas codes. Please find instructions on connecting the DSB in the appendix.
Contaminants
WARNING!
Never operate the DSB-3000 or DSB-6000 at pressures higher and the rated maximum
pressure, 1-2 bars.
HOT SURFACE
The DSB-3000 or DSB- 6000 could be equipped with an option to warm the substrate
up to 180 ° C. You must use protective gloves or instruments to remove the sample
from the chamber
Do not allow contaminants to enter the system before or during use. Contamination such as dust, dirt, lint, glass
chips, and metal chips may permanently damage the unit or contaminate the process.
Service
Qualified Personnel
Operating personnel must not attempt component replacement and internal adjustments. Any service must be performed
by qualified service personnel only.
Safety Information
3

4
Introduction
The purpose of this handbook is to facilitate the use
of equipment DSB 3000 or DSB 6000.
Start Up
Once the connections are made to the equipment
(pump, gas and electricity), switch on the controller.
The touch screen (in front) illuminates and displays
the message “POWER NOW ALLOWED”. Press the
“Power” button on your equipment. The basic hardware
configuration screen will appear as shown in
Figure 1.
Three features are available: “RUN”, “EDIT”, and
“CONFIG.”
RUN: launch recipe
EDIT: Edit recipe
CONFIGURATION: setup and access certain features.
1.1 First use
Push “CONFIG.” (CONFIGURATION). The following
screen appears as shown in Fig. 2 and asks you for a
password.
Press on the site located under “Password” (containing
**** asterisks). You can then enter your password
(factory default is 10 ) on the screen below, then
press « ENTER ».
You may also change this password by selecting the
box “Password modification”. A new page opens requiring
you to enter your current password again and
to also input and then confirm your new password.
Figure 1
Figure 2
Figure 3
User Instructions

Configuration Menu
The “CONFIGURATION” menu will then open, providing
access to the following sub-menus as shown in Figure
4
Hint: in any menu, tap “BACK” to return to the previous
screen…
2.1 Interface :
This menu gives you access to the screen adjustments
(Contrast and Brightness). You need just to click on the
keys “+” or “-” to adjust the level of desired contrast or
light.
The other keys relate to the internal memory flash…
2.2 Date :
This menu enables you to regulate the hour and the
date. For that, press “DATE”. The following screen appears
and gives you the possibility of setting the hour
and the current date:
The procedure is always the same: push on the part of
the screen you wish to modify (for example here the
date “07-Mar-08”). A new window will open enabling
you to input the new date. If you wish to change the
hour, the procedure is identical: press the hour (here:
18 :08 :44), and a new window will appear enabling
you to input the current hour.
Figure 4
Figure 5
Figure 6
User Instructions
5

6
2.3 Vacuum Chamber:
This menu allows you, if you wish, to put the chamber
under vacuum by activating the solenoid vacuum valve.
It will also allow you to return to atmospheric pressure
if you previously had vacuum conditions. The value of
the chamber pressure is also shown…
2.4 Gas Interval Setup
This page lets you define the different intervals used in
the plasma treatment process (see Annex 1 for details):
«Gas Pre Open»: Interval before turning on the gasses
once the threshold “Pressure 1” is reached.
« Gas Stabilisation »: interval after turning on the
gasses which allows for pressure stabilization before
starting the RF Generator (plasma).
« Gas Pre Plasma »: In the case of option “Pressure
Throttle Valve”, the interval before starting the RF generator
(plasma).
« Gas Post Plasma »: the interval before the closure
of gases once the RF generator is off (plasma process
completed).
« Gas Pre Vent»: The interval after the closure of gases
(once plasma process is completed) before the the
chamber is returned to atmospheric pressure.
«Vent Time»: Interval by default at the end of the
recipe to return to atmosphere in the chamber. This
interval will not be used if you have the Vent Mass Flow
controller…
The changing of the interval value can be done by
pressing the interval value you wish to modify. A new
window like the one shown in Fig. 9 will open allowing
you to enter the new value.
Press « ENTER » to set the new value.
The procedure will be the same for all inputs…
Figure 7
Figure 8
Figure 9
User Instructions

2.5 Warm Substrate (option) :
This option allows you to use warm substrate option.
You may select “With” or “Without” depending on the
needs of your process.
2.6 Language :
This page enables you to choose the language in which
you want to work. Choose your language and push
“BACK” to return to the previous menu.
2.7 Gas & T° Setup :
After having pushed the “Gas & T° SETUP” menu, the
page in Fig. 12 appears.
The submenus allow you to view and change the options
for the Vent, Gas, and Temperature settings.
Figure 10
Figure 11
Figure 12
User Instructions
7

8
2.7.1 Vent MFC (option) :
This menu allows you to select or not (ON or OFF) the
MFC option for venting the chamber. If you have this
option, you will able to manage the vent time on each
recipe by declaring the vent time and the flow you
want while the chamber returns to atmosphere. We
will see that in more detail in the recipe section.
2.7.2 Gas Setup :
This menu allows you to chose the secondary gas used
for the plasma in conjunction with O2 (used by default
except for where ArH2 is required).You can select either
N2 or Ar or CF4 or ArH2 (N2 is selected by default).
The software will automatically adjust the necessary
flow on the Mass Flow Controller depending on the gas
selected.
Once the desired gas is selected, the display below appears
as in Fig. 15 indicating the adjusted parameters
of the “Mass Flow Controller.”
Figure 13
Figure 14
Figure 15
User Instructions

2.7.3 T° End Recipe :
This option allows you to set the chamber temperature
at the end of the process.
2.7.4 T° Security :
The window will appear as in Fig 17.
This menu enables you to select the level of safety
concerning the process chamber temperature once
the plasma process is finished. If you select the mode
“OFF”, at the end of the plasma process the opening of
the door will be authorized after a the chamber returns
to atmosphere (once the chamber temperature has
been brought back to « Temperature End Recipe » and
the substrate temperature to 0°).
If the “ ON ” mode is chosen, the vacuum in the chamber
will be maintained until the temperature falls to
the preset “threshold” temperature (« Temperature
Security » . 40 ° is the minimum).
2.8 Error Review :
This page allows you to view any problems that occurred
during the previous plasma process.
NOTE : You can exit this page only by pressing the button
“M”
To go from one error to another, use the buttons
“PREV” and “NEXT”. The “CLEAR” button will allow you
to clear the error selected beforehand.
Figure 16
Figure 17
Figure 18
User Instructions
9

10
2.9 Storage Interval (ArH2):
This menu allows you to define the different intervals
used in the “Storage Process”…
When you select this option for your ArH2 recipe, at
the end of the plasma ArH2 process, the software will
decrease the chamber temperature to the temperature
you will have indicated (T° Chamber) in the storage
process option (Storage Parameter) and will continue
to purge the chamber with ArH2 at the flow you will
have also indicated in your storage parameter (MFC
Gas 2) during the time you will have also indicated
(Storage Timing) (see below in the recipe section). At
the end of this time, the software will restart the ArH2
recipe again… And so on until you abort (ABORT key)
this recipe…
At that time, the procedure will follow the steps below:
--The software stops the gas but will continue to pump
the chamber over the time indicated by the interval
“Gas cycle 1 Off “
--The software restarts the gas and continues to pump
the chamber during the time indicated by the interval
“Gas cycle 1 On “
--The software stops the gas but continues to pump the
chamber during the time indicated by the interval “Gas
cycle 2 Off “
--The software restarts the gas and continues to pump
the chamber during the time indicated by the interval
“Gas cycle 2 On “
--The automat stops the gas but continues to pump the
chamber during the time indicated by the interval “Gas
cycle 3 Off “
The software will introduce air into the chamber until
atmospheric pressure is achieved.
The change of the interval value can be done by pressing
the value you wish to modify. A new window will
open allowing you to enter the new value.
Figure 19
User Instructions

Edit Menu
After having returned to the starting menu (below),
click “EDIT” menu to define and describe your recipes.
A password will be requested and the screen in Fig. 21
appears. Enter the value “10” (default)
The “EDIT” menu appears as shown in Fig 22:
You have the possibility of defining a hundred different
recipes on six pages accessible by the arrows “\” “c”.
Figure 20
Figure 21
Figure 22
User Instructions
11

12
After having pressed on a box (whether or not a value
is already present) a new window opens as shown in
Fig. 23
3.1 Recipe Name :;
You can change or define a new name into clicking on
the box “ Recipe name : ” (here Hybride02). A new
window opens then enabling you to define the name of
your recipe (see Fig. 24) :
NOTE: hit the « ENTER » key first and then use the
alphanumeric keys to enter the name of your recipe (8
characters max). The “” and “” enable you to make
corrections if necessary.
Figure 23
Figure 24
User Instructions

3.2 RFG 1 :
Here, for the recipe in question, you define the RF
power at which you wish to work (here 180W). The
input method shown in Fig. 26 is similar for all values in
this menu.
3.3 Chamber Temp:
In this menu, you indicate the chamber temperature at
which you wish to work during the plasma process:
Here, the instruction was given for 50°C. You can
choose another value not exceeding 180°C
Figure 25
Figure 26
Figure 27
User Instructions
13

14
3.4 Substrate Temp. (option) :
In addition to chamber temperature control, you also
have the possibility to heat the sample at a chosen
temperature (here 30°C : maximum 180°C)
3.5 Plasma Duration :
In this new window you enter the desired duration
for your plasma treatment knowing that the timer will
start only when the RF power will be enabled, that is
to say when the “reflected RF power” value will be less
than or equal to a threshold of 10W.
Figure 28
Figure 29
Figure 30
User Instructions

3.6 MFC Vent (option):
If you have the Mass Flow Controller option to manage
the air intake in the chamber, you have here the
capability to choose the duration of the air vent to the
chamber to achieve atmospheric pressure.
You select at the same time the flow of the MFC Vent
you require for the air intake to the chamber to avoid
any problem to your sample during the air vent (here :
1000 sccm):
3.7 MFC O2 :
You indicate in the window below the oxygen flow (O2)
desired for the recipe in question: (Here 40sccm is
required):
Figure 31
Figure 32
Figure 33
User Instructions
15

16
3.8 MFC gas 2 (N2-Ar-CF4-ArH2)
You indicate in a window similar to the preceding one
the flow of Nitrogen, Argon or CF4 or ArH2 (according
to your gas configuration) desired for the recipe in
question: (here 6 sccm is required).
3.9 Set Point Pressure (option)
This menu allows you to choose (if you have the
Throttle Valve option) what process pressure you want
during the plasma process…(Here 0.8 Torr is required)
3.10 Storage Process (ARH2)
In case you want to use “Storage Process” for an ArH2
plasma process, confirm this option as indicated in the
screen below. First click on the box “NO” (default):
Note: then press the « ENTER » key and use the keys
« » or « » to choose “NO” or “YES”.
If you selected the option, press « Next para. », a new
screen appears allowing you to enter parameters necessary
for the function « Storage Process »:
Enter the values for chamber temperature (T ° Chamber)
you wish during the “Storage” phase as well as the
flow of gas 2 (MFC gas 2: often ArH2) and the desired
amount of time (Stor. Timing) before automatic recovery
process plasma.
Don’t forget to save your recipe by pressing “SAVE”
Figure 34
Figure 35
Figure 36
User Instructions

3.11 Pulse Process (Option)
In case you want to use « Pulse Process », validate this
option as indicated in the screen below. Tap the box
“NO” and select “YES” with the arrows “” and “”
after pressing on the arrow « ENTER ».
If you selected the option, press “Next para.”, a new
screen appears allowing you to enter parameters
needed for the “Pulse Process” function :
Enter the values of « Duty Cycle » required (10 to
100%: 50% here) during the Pulse phase and the
frequency requested (between 1 Hz and 9999 Hz; here
10Hz).
Don’t forget to save your recipe by pressing “SAVE”.
**************************************
Once you have registered the parameters of your
recipe, do not forget to press “SAVE”.
Press “BACK” to return to the starting menu (below
right).
Figure 37
Figure 38
Figure 39
User Instructions
17

18
Run Menu
All you need to do now is choose the recipes you want
to run
4.1 Chosing Recipes
For this, press “Run”. The “Recipes window” opens
allowing you to choose the recipe from the ones you
have created by selecting the “keys” “+” and “”. If you
want to chain several recipes, do the same in the lower
boxes (Recipe 2, Recipe 3,…). You can chain up to 5
recipes.
Figure 40
Figure 41
Figure 42
User Instructions

You can see again the parameters of your recipes by
clicking on the recipe name. A new window will open
displaying the parameters of the recipe in question.
Push “Back” to return to the recipe menu
Figure 43
Figure 43
Figure 45
User Instructions
19

20
4.2 Starting the Process
Press “START” to start the process. The window displays
as shown in Fig. 46 and launches the process as
soon as you close the front door of the equipment.
Once the door is closed, pumping starts automatically.
The cycle proceeds then according to the steps below:
1) Close the door to begin pumping.
2) Door closed: the light tower turns orange and
pumping begins (“Vac” icon turns green- see Fig. 47)
3) Pause until the temperature chamber reaches its
instruction at + or – 5%.
4) Then, the program confirms that pressure is lower
than “Pressure 1” (Pressure Set menu) Torr.
5) If the pressure is lower than “Pressure 1” Torr, the
« Gas Pre Open » interval is launched and then the gas
flow begins according to the pre-specified values.
6) The « Gas Stabilisation » interval is launched to
enable the gases and pressure chamber to stabilize.
At the end of this phase, the machine verifies that the
pressure has returned to less than “Pressure 2” Torr
(Pressure Set menu) and that the gas flow is equal to
the preselected value at + / - 15%.
7) If you have selected the option “Pressure Control
Valve,” the controller then adjusts the “Throttle Valve
pressure” to the pressure requested. Once the pressure
is attained (« Set Pressure » indicated in the recipe),
the« Gas Pre Plasma » interval is launched…
8) Then, the controller starts the RF power generator
and research the “RF grant” to minimize reflected RF
power (P. RFL)
9) The timer starts once the RF power is enabled (i.e.
once the reflected RF power (P. RFL) is less than or
equal to 10W). The timer is then posted on the screen
(see example in Fig. 48):
Figure 46
Figure 47
User Instructions

Note: the “ABORT” Key allows you to stop the process
at anytime if necessary…
Wait for the end of the timer (duration of the process)…
4.3 Monitoring
During the process, you have the possibility to monitor
some of the parameters. Push “MONITORING ” and the
menu appears as shown below:
Choose the parameters you want to view by pressing
the corresponding area of the screen.
A new screen appears as shown in FIg. 50 & 51 (here T°
Chamber had been selected as MFC O2/AR too):
Use “BACK” to return to the preceding screens.
Figure 48
Figure 49
Figure 50
User Instructions
21

22
At the end of the timer, the software stops the RF generator
and launches the « Gas Post Plasma » interval
and afterwards stops the gases. The temperature is
then adjusted to “Temperature End Recipe” (CONFIGU-
RATION) and that of the temperature of the sample to
0°:
A new interval « Gas Pre Vent » is launched and after
pumping is stopped (closing of the electromagnetic
vacuum valve). Another interval of 5s is then started
and purging begins (duration of the purging = « VENT
TIME » parameter). If you have the MFC VENT option
turned on then the duration of the purging is given in
the recipe (“MFC Duration”) and not by “VENT TIME”
parameter
11) If you have chained several recipes, those will be
carried out in sequence as described above (maximum
5). The air entry will be carried out only after the final
recipie.
……..
The light tower will flash orange and the message
“Completed” is posted on the screen once the air intake
is finished.
Note: if safety “T° Chamber” is activated, after item 13
the system waits until the chamber temperature has
gone down to the “threshold temperature” required by
the customer (see page 11).
As soon as the chamber temperature reaches the set
point of “safety temperature” (at + or - 5%), the cycle
restarts again at point 14: purging followed by the
flashing orange light on the light tower and the “Completed”
message on the screen
Once you pressed on the screen “Completed”, the
tower rocks then turns green and the screen returns to
the starting menu.
We hope that you find this equipment completely
satisfactory.
Best regards
NANOPLAS team.
Figure 51
User Instructions

24
Footprint
500 mm x 690 mm x 1410 mm
Weight
185 kg
Electricals
100/240 volts - 32/16 Amp. - 50/60 Hz
Vacuum
28 m3/h (minimum)
Working Pressure : 0.2 – 1 Torr
KF25 elbow connection (DN25)
Adixen ADP28 vac.
Pump (recommended)
Connection Facilities
Process gases available
(gases : pressure input 1-2 bars, ¼’’
Swagelok connectors)
O2
O2 + N2
O2 + Ar
O2 + CF4
O2 + SF6
Ar/H2 (Arcal)
1410 mm

25
(Option)
Exhaust
V3
24 volts DC
100-240 volts AC 50/60Hz
Vacuum
pump
Throttle
valve
Thermocouple
RFG
Air Cooling
RF
generator
300W
Over temp. safety
Thermocouple
MN
Matching
Network
24 volts AC 50/60Hz
Wafer
Drawings
Matching
Network
MN
ICP Source
RF
generator
RFG
Pressure gauge 0.1-10 Torr
24 volts DC
HDRF only
DSB 3100- Electrical Schematics

DSB 6000- Electrical Schematics
HDRF only
24 volts DC
Pressure gauge 0.1-10 Torr
ICP Source
Wafer
Drawings
24 volts AC 50/60Hz
Matching
Network
MN
Thermocouple
Over temp. safety
RF
generator
600W
Air Cooling
RFG
Thermocouple
Throttle
valve
Vacuum
pump
100-240 volts AC 50/60Hz
V3
Exhaust
24 volts DC
(Option)
26

27
(Option)
Exhaust
V3
24 volts DC
100-240 volts AC 50/60Hz
Vacuum
pump
Throttle
valve
Thermocouple
RFG
Air Cooling
RF
generator
600W
Over temp. safety
Thermocouple
MN
Matching
Network
24 volts AC 50/60Hz
Wafer
Matching
Network
MN
Drawings
ICP Source
RF
generator
RFG
Pressure gauge 0.1-10 Torr
24 volts DC
HDRF with bias
DSB 6100- Electrical Schematics

DSB 6000- Fluid Schematics
2 gas configuration for photoresist stripping
Pressure
gauge
ICP Source
Wafer
Loading
door
Drawings
V2 V4
V1
Throttle
valve
(Option)
MFC 4
MFC 2
MFC 1
V3
Exhaust
Vacuum
pump
N2
N2, Ar,
CF4, SF6,
or ArH2
O2
(Option)
For Process For Venting
28

29
For Process For Venting
(Option)
O2
N2, Ar,
CF4, SF6,
or ArH2
N2
Vacuum
pump
Exhaust
V3
MFC 1
MFC 2
MFC 4
(Option)
Throttle
valve
V1
V2 V4
Loading
door
Wafer
Drawings
ICP Source
Pressure
gauge
2 gas configuration for photoresist stripping
DSB 3000- Fluid Schematics

P (Torr)
ATM
processing
pressure limit
T2
Set Pressure
T1
Base Pressure
limit set
Pump p limit
Typical DSB 3000 3000-6000 6000 Process Cycle
“T “T° T Chb” Chb Chb” Chb wait
With Throttle
Valve option
In standard mode
“STORAGE” option
start if selected !
Check Temperature
security y if selected !
t1 t2 t3 t4 t5 t6 t7 t8
Gas Valves OFF OFF ON ON ON ON OFF OFF
Pressure
Valve
(option)
Vacuum
Vacuum
Valve
OPEN OPEN OPEN
Set point
pressure
Set point pressure OPEN OPEN OPEN
OFF ON ON ON ON ON ON OFF
R.F. Power OFF OFF OFF OFF ON OFF OFF OFF
L.T. Mar-08 Vers. 2.0
1/2
time

Definition of the different timings
used diin th the DSB software ft
“Gas Gas Pre Open”: Open : temporisation before opening the gases once the threshold
“Pressure 1” is reached.
“Gas Stabilisation”: It is the temporisation after opening gases which allows
stabilization of the pressure before starting the RF Generator (plasma).
“Gas Pre Plasma”: In the case of option "Pressure Throttle Valve" it is the
temporisation before starting the RF generator (plasma).
“Gas Post Plasma”: This is the temporisation before the closure of gases once the
RF generator g is off (p (plasma pprocess completed). p )
“Gas Pre Vent”: This is the temporisation after the closure of gases (once plasma
process is completed) before the air inlet in the process chamber.
“Vent Time” : This window allows you to set the duration of valve opening of the air
inlet during the award at atmospheric pressure of the chamber chamber. The maximum
duration is 5 minutes…
L.T. Mar-08 Vers 2.0
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