JEITA EDR-7315B Design guide for semiconductor packages Ball ...

JEITA
Technical Report of Japan Electronics and Information Technology Industries Association
JEITA EDR-7315B
Design guide for semiconductor packages
Ball Grid Array (BGA)
Revised March, 2006
Investigated by
Technical Standardization Committee on Semiconductor Device Package
Published by
Japan Electronics and Information Technology Industries Association

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C 2006 by the Japan Electronics and Information Technology Industries Association
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CONTENTS
Introduction ··········································································································································· 1
1. Scope ············································································································································· 1
2. Normative references ······················································································································ 1
3. Terminology ···································································································································· 1
4. Definition of BGA ···························································································································· 1
5. Terminal position numbering ··········································································································· 3
6. Nominal package dimension ··········································································································· 3
7. Symbols and drawings ···················································································································· 5
7.1 BGA outline ··································································································································· 5
8. Dimensions ··································································································································· 11
8.1 Group I ······································································································································· 11
8.2 Group II ······································································································································ 17
9. Registration procedure of standard outline drawings ······································································ 21
10. Recommended BGA variations ··································································································· 23
EXPLANATION ··································································································································· 29