Laminate substrates - EUPORES
Laminate substrates - EUPORES
Laminate substrates - EUPORES
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Always Innovating<br />
Microcircuit Microcircuit Technology<br />
Technology<br />
(a wholly owned subsidiary of AEM Holdings)
Thickness<br />
2 Layers<br />
(thickness/core/sm)<br />
4 Layers<br />
(thickness/core/pp/sm)<br />
4L Layers HDI<br />
(thickness/core/pp/sm)<br />
Always innovating<br />
Substrate Roadmap<br />
2006<br />
1Q<br />
2Q<br />
2007<br />
3Q<br />
Slide No. 2<br />
4Q<br />
200/100/30 160/60/30<br />
230/60/40/20 210/50/30/20<br />
250/60/40/20<br />
230/50/30/20<br />
1Q<br />
2Q<br />
2008<br />
Advance Mass Production<br />
3Q<br />
4Q<br />
1Q<br />
120/60/15 105/50/15 90/40/10<br />
190/50/30/10 180/40/30/10<br />
210/50/30/10<br />
200/40/30/10<br />
2Q<br />
2009<br />
3Q<br />
4Q
6 Layers FC BuildUp<br />
(Epoxy BuildUp Film)<br />
(thickness/core/bf)<br />
8 Layers FC BuildUp<br />
(thickness/core/bf)<br />
BuildUp Films available : ABF,<br />
ASZ-II.<br />
Processing of teflon, LCP<br />
dielectric also available<br />
Always innovating<br />
Substrate Roadmap<br />
2006<br />
1Q<br />
2Q<br />
2007<br />
3Q<br />
700/400/40<br />
820/400/40<br />
Slide No. 3<br />
4Q<br />
1Q<br />
2Q<br />
2008<br />
3Q<br />
520/200/40 430/150/30<br />
4Q<br />
640/200/40 560/150/30<br />
Advance Mass Production<br />
1Q<br />
2Q<br />
2009<br />
3Q<br />
4Q
Substrate Technology Roadmap<br />
Coreless CSP / Frame Level<br />
Package (Bridge Semi) WB and FC<br />
-1 Layer (t=0.030-0.040mm)<br />
-2 Layer (with Copper Stub)<br />
(t=0.08mm, Stud = 0.035mm)<br />
-2 Layer (LGA)<br />
(t = 0.08mm)<br />
Always innovating<br />
1Q<br />
2007<br />
2Q<br />
3Q<br />
Slide No. 4<br />
4Q<br />
1Q<br />
2Q<br />
2008<br />
3Q<br />
4Q<br />
Advanced Mass Production<br />
1Q<br />
2Q<br />
2009<br />
3Q<br />
4Q
Embedded Passives<br />
Inductor Coils<br />
Capacitance<br />
Embedded Actives<br />
2-3Dies embedded RF<br />
Application<br />
Substrate Technology Roadmap<br />
Always innovating<br />
2006<br />
1Q<br />
2Q<br />
2007<br />
3Q<br />
Slide No. 5<br />
4Q<br />
50/50 (Cu 20um)<br />
65/65 (Cu 28um)<br />
1Q<br />
2Q<br />
2008<br />
3Q<br />
3M c-ply Dk=16 (5.5nF/sq in)<br />
Rogers 2808 Dk= 8<br />
4Q<br />
UNDER TECHNOLOGY EVALUATION<br />
Advanced Mass Production<br />
1Q<br />
2Q<br />
2009<br />
3Q<br />
4Q
Finishing<br />
OSP + E’lytic Ni/Au<br />
ENIG<br />
E’less Ni/Au (Au wire<br />
bondable)<br />
DIG<br />
SOP<br />
DIG + E’lytic Ni/Au<br />
Substrate Technology Roadmap<br />
Always innovating<br />
2006<br />
1Q<br />
2Q<br />
2007<br />
3Q<br />
Slide No. 6<br />
4Q<br />
1Q<br />
2Q<br />
2008<br />
Advance Mass Production<br />
3Q<br />
4Q<br />
1Q<br />
2Q<br />
2009<br />
3Q<br />
4Q
2L Min Via/Land<br />
Mechanical Through<br />
Laser Through<br />
Laser Blind<br />
1-2-1 Laser Blind<br />
Substrate Technology Roadmap<br />
Always innovating<br />
2006<br />
100/250<br />
100/ 250<br />
100/250<br />
1Q<br />
2Q<br />
2007<br />
3Q<br />
100/ 220<br />
100/220<br />
Slide No. 7<br />
4Q<br />
75/175<br />
Advance<br />
1Q<br />
80/180<br />
2Q<br />
100/ 200<br />
2008<br />
3Q<br />
75/ 150<br />
60/130<br />
4Q<br />
Mass Production<br />
1Q<br />
60/120<br />
100/250 80/200 60/160 60/130 50/110<br />
2Q<br />
2009<br />
3Q<br />
4Q
Via In Pad<br />
Cap via<br />
Blind via<br />
Copper Filled blind via<br />
Substrate Technology Roadmap<br />
Copper Filled Stack via<br />
Always innovating<br />
2006<br />
1Q<br />
2Q<br />
2007<br />
3Q<br />
Slide No. 8<br />
4Q<br />
1Q<br />
2Q<br />
4L HDI 6L HDI<br />
Advance<br />
2008<br />
3Q<br />
4Q<br />
Mass Production<br />
1Q<br />
2Q<br />
2009<br />
3Q<br />
4Q
Soldermask Type<br />
AUS308<br />
AUS320<br />
Soldermask<br />
Registration<br />
+/-50<br />
+/-30<br />
+/-20<br />
Substrate Technology Roadmap<br />
Film Type / Liquid Type<br />
for LDI<br />
Always innovating<br />
2006<br />
1Q<br />
2Q<br />
2007<br />
3Q<br />
Advance<br />
Slide No. 9<br />
4Q<br />
1Q<br />
2Q<br />
2008<br />
3Q<br />
4Q<br />
1Q<br />
Mass Production<br />
2Q<br />
2009<br />
3Q<br />
4Q
Trace Width/Space<br />
Min BF Pitch / Width<br />
Flip-Chip pitch/SRO<br />
Substrate Technology Roadmap<br />
Always innovating<br />
2006<br />
40/40<br />
1Q<br />
2Q<br />
2007<br />
3Q<br />
Slide No. 10<br />
4Q<br />
1Q<br />
2Q<br />
2008<br />
35/35 30/30 25/25<br />
Advance<br />
3Q<br />
4Q<br />
20/20<br />
120/55 110/55 105/55 90/50 85/50<br />
200/80 180/80 150//80<br />
130/80<br />
1Q<br />
Mass Production<br />
2Q<br />
2009<br />
3Q<br />
4Q
Always Innovating
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