PA015 series Power LED chips integrated module

Av. División del Norte 3115 Col. La Candelaria C.P. 04380
PA015 series Power LED chips integrated module
Power LED down light is a revolutionary, energy efficient and ultra compact new light source,
combining from the lifetime and reliability advantages of Light Emitting Diodes with the
brightness of conventional lighting.
Key Benefits
l Lowest Thermal Resistance
l Easily To Control Junction Temperature
l Low Cost Packaging Structure
l High Luminance
l Long Lifetime
l Lower operating costs
l Reduced maintenance costs
l Environmentally friendly, no disposal issues
Typical Applications
l Commercial space Lighting
l Interior Lighting

Precaution
l Don’t touch, push or squish the light emitting area
Do not touch the LED Array or resin area during operation. Allow the LED Array to cool for a
sufficient period of time before handling. The LED Array may reach elevated temperatures
such that it can burn skin when touched.
Emitting area
Revision :3.1 Page 1 of 13

Table of Contents
Technology Overview ..................................................................... 3
Average Lumen Maintenance Characteristics ................................ 3
Environmental Compliance ............................................................ 3
Product Nomenclature .................................................................... 4
Dimensions ..................................................................................... 5
Circuit Layout ................................................................................. 6
Absolute Maximum Ratings ............................................................ 6
Forward Voltage Characteristics .................................................... 7
Operating Current and Luminous Flux Characteristics .................. 7
Reliability Test ................................................................................ 8
Color Temperature Characteristics ................................................ 9
Color Spectrum .............................................................................. 9
Recommend Heat Sink Surface Area .......................................... 11
How to measure the junction temperature ................................... 12
Assembly ...................................................................................... 13
Revision :3.1 Page 2 of 13

Technology Overview
EDISON ® Light Emitting Diodes Product benefit from a suite of innovations in the fields of
chip technology, packaging, and thermal management. These breakthroughs allow
illumination designers to achieve efficient light engine designs and deliver high brightness
solutions. Furthermore, the COHS ® design can be to reduce thermal resistances between
chips and heat sink, easily to control junction temperature.
Average Lumen Maintenance Characteristics
Lifetime for solid state lighting devices (LEDs) is typically defined in terms of lumen
maintenance—the percentage of initial light output remaining after a specified period of time.
EDISON ® to expect that Pacific-S series products will deliver, on average 70% lumen
maintenance at 30,000 hours of operation at suggested forward current. This projection is
based on constant current operation with junction temperature maintained at or below 70°C.
Environmental Compliance
EDISON ® Light Emitting Diodes help reduce power consumption and the amount of
hazardous waste entering the environment. All EDISON ® products manufactured by
EDISON ® are RoHS compliant and free of hazardous materials, including lead and mercury.
Product Nomenclature
The following table describes the available color, power type etc.
Revision :3.1 Page 3 of 13

PA 015 C CU H - 001
Pacific Power Packaging
Color Substrate
Type
Order Code Format
Initial Power Color Substrate Packaging Type
PA XXX Cool White CU (Copper Heat Sink) Horizontal PN Chip xxx
Notes for Table 1:
“x” Stands for 1 digit
Example:
PA015CCUH-001
Neutral White AL(Aluminum Heat Sink) Vertical PN Chip
Warm White FR (Fiber Reinforced Plastic) Flip-Chip
AC Power
Pacific Series / 15 watts / Cool White Color / Copper Heat Sink Substrate / Horizontal PN
Chip Package / Type 001.
Dimensions
Color code are replaced with question mark “?” in product code.
PA015?CUH-002
Revision :3.1 Page 4 of 13

.
Notes:
Top View
Front View
1. Solder pads are labeled “+” and “-“ to denote positive and negative, respectively.
2. Drawings are not to scale.
3. Drawing dimensions are in millimeters.
4. Unless otherwise specified, tolerances are ± 0.20mm.
Bottom View
5. The optical center of the LED Array is defined by the mechanical center of the array.
Revision :3.1 Page 5 of 13

Circuit Layout
Product code below neglect color、substrate and package code, for example instead of
PA015CCUH-001 with PA015-001.
PA015-002
Absolute Maximum Ratings
The following table describes absolute maximum ratings of Pacific-S series. Please refer to
circuit layout on previous page for DC forward current & voltage selection.
Product code below neglect “PA”、color、substrate and package code, for example instead of
PA015 CCUH-001 with 015-001.
Table 2.
Parameter Range Unit Symbol
LED Junction Temperature

1. DC forward current should not exceed LED’s operating current.
2. LEDs are not designed to be driven in reverse bias.
Forward Voltage Characteristics
The following tables describe forward voltage of Pacific-S005 series. Please note that the all
forward voltage range is based on constant driving current. Do not base on the values below
to design a constant voltage system.
Product code below neglect color、substrate and package code, for example instead of
PA015CCUH-001 with PA015-001.
Table 3.
Power Min. Voltage
(VF)
Typ.Voltage
(VF)
Max.Voltage
(VF)
PA015-002 17.9 19.8 21.4 V
Notes for Table 3:
Forward voltage is measured with an accuracy of ±10%
Operating Current and Luminous Flux Characteristics
The following tables describe luminous flux at Ta=25°C for Pacific-S series at DC forward current
suggested above.
Unit
Product code below neglect “PA”、color、substrate and package code, for example instead of
PA015CCUH-001 with 015-001.
Table 4.
Color 015-002 Unit
Cool White 3250 lm
Neutral White 2985
Warm White
Notes for Table 4:
2835
1. Luminous flux is measured with an accuracy of ±10% with 120° luminous
Revision :3.1 Page 7 of 13

Reliability Test
The following table describes operating life, mechanical, and environmental tests performed
on EDISON ® Pacific-S series.
Table 5.
Stress Test Test Description
Revision :3.1 Page 8 of 13
Stress
Duration
Natural Drop Equivalent drop height 112cm *
High temperature
operation or storage
125°C 1000 hours
High temperature &
Humidity
85°C/85%RH 1000 hours
Temperature Cycle
–40/115°C,15min dwell/

Vibration, Variable
Frequency
20-2,000-10 Hz, log or linear sweep rate,
20 G about 1 min, 1.5 mm, 3X/axis
Mechanical Shock 1,500 G, 0.5 ms pulse, 5 shocks each 6 axis *
Thermal Shock –40/125°C,15min dwell/

Color Temperature Characteristics
The following tables describe color temperature of Pacific-S series.
Product code below use “x” instead of power、substrate and package code, for example
instead of PA015CCUH-001 with PAxxxCxxx-xxx.
Table 6.
Order Code Color λd / CCT
Min. Max
PAxxxCxxx-xxx Cool White 5000 10000 K
PAxxxNxxx-xxx Neutral White 3700 5000 K
PAxxxWxxx-xxx Warm White 2600 3700 K
Notes for Table 6:
1. CCT is measured with an accuracy of ± 200K.
Color Spectrum
Cool White Color Spectrum
urement>
Unit
Cool White Spectrum
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050
Wavelength(nm)
Revision :3.1 Page 10 of 13

Neutral White Color Spectrum
part, integrated measurement>
Warm White Color Spectrum
Neutral White Spectrum
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050
Wavelength(nm)
Warm White Spectrum
Revision :3.1 Page 11 of 13

Revision :3.1 Page 12 of 13

Recommend Heat Sink Surface Area
The following tables describe recommend heat sink surface area to make sure the junction
temperature Tj below 70°C and ensure the product’s life time of Pacific-S series.
Chip Distribution
Square
Circle
*Note 1
Note 1 : Describe about die distribution.
Square : example as below
Circle : example as below
Table 7.
Wattage
Suggested Surface
(W)
Area
(cm 2 )
5 150
7 300
10 500
15 800
20 1000
30 2500
40 3200
50 4000
60 >4000
100 >15000
120 >20000
10 500
15 500
20 500
Test point
Revision :3.1 Page 13 of 13

How to measure the junction temperature
It’s very easily to make sure the junction temperature by measure the temperature of test
point designed on the substrate near the chips. By choose suitable heat sink and measure
the test point temperature to make sure the junction temperature at least below 80°C .
1. Attach product on the heat-sink
with high heat conductive paste.
Test point.
Via diameter 1.0mm
2. Let the thermal wire contact the
via bottom metal and fixed.
Suggest thermal wire diameter
below 0.15mm
Thermal meter
3. Light on and waiting for heat equilibrium.
The equilibrium time depend on the
heat-sink size you chose. Normally 2.5hr
waiting time is necessary.
4. Read temperature and plus 3 degree will
be the junction temperature.
Revision :3.1 Page 14 of 13

Assembly
We suggested using Pacific-S will be easier to apply to in lighting application. It’s can use
screws to fix at lampshade or metal utilities. We strongly recommended using as graphite
between lampshade or utilities metal.
Drawing Not to Scale
For the Circle emitter products (015-002), preferred screw mounting locations are indicated in
Figure7.
Graphite
Heat Sink
Screw
Emitter
Graphite 0.5t/mm (Reference)
Pacific-S series (Reference)
Heat Sink (Reference)
Revision :3.1 Page 15 of 13