Hangzhou Silan Microelectronics Co., Ltd

Silan 士兰微电子 

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Hangzhou Silan Microelectronics Co., Ltd 

Company Confidential, don’t copy 

www.silan.com.cn

Company Overview 

Subsidiaries 

Agenda 

Product & Technology 

Customer & Supplier 

Quality Control 

© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.

Mission 

To be one of the most excellent semiconductor 

devices and integrated circuits design and 

manufacturing companies. 


Profile 

• Silan was founded in Oct. 

1997 with head office in 

Hangzhou, China. 

• In March 2003, Silan made 

an IPO as the first IC design 

company on the Shanghai 

Stock Exchange (SSE) . 

• At the end of the third 

quarter of 2010, Silan had a 

total assets of more than 

300M US$. 

• The total share capital of 

Silan amounted to 434.08 

million shares. 

• Engaged in semiconductor IC 

design and manufacturing, 

Silan provides high quality 

ICs and semiconductor 

devices to customers. 

• During 13-year development, 

Silan has become a 

comprehensive company in IC 

design, manufacturing and 

marketing and joined the front 

ranks of IC industry in China. 

• Silan has become unique in 

the high voltage &high power 

special IC process developed 

in IDM mode. 

• Silan’s present three core 

business: 

‣ ICs and discrete devices 

based on Silan’s own special 

process of high voltage, high 

power and high frequency; 

‣ Digital audio/video SOC 

based on Disc servo 

technology; 

‣ High-brightness LED chips 

and devices; 


Location & Subsidiaries 

Chengdu Silan Semiconductor 

Manufacturing Ltd 

Silan R&D Center in USA 

Silan Microelectronics 

(Korea office) 

Silan-IC Co.,Ltd 

Shenzhen Shenlan 

Microelectronics 

Chengdu 

Hangzhou 


(Taiwan office) 

Silan Azuer Co.,Ltd 


(headquarters) 

Youwang Microelectronics 

Silan Test Factory in Binjiang 


Hangzhou Multi-Color Optoelectrical Co., Ltd 

was founded in July 2009 for LED packaging. 

Silan completed a private placement of 

30 million additional shares in Sep. 2010. 

Milestones 

New fab of Silan Azure was 

completed In Oct.2007. 

Silan Azure was founded in Dec. 2004 for high 

brightness LED manufacturing. 

The test factory in Binjiang was put into 

operation the same year. 

The foundation-laying ceremony of Chengdu Silan 

Semiconductor Manufacturing Ltd. was held at 

Chenddu Aba Industrial Park in Nov. 2010. 

Power module packaging 

was launched in Dec. 2010. 

IPO initiated with A-stock in March 2003. 

600460 

Silan-IC was founded in Jan. 2001. 

Start the silicon chip manufacturing. 

Salan was founded in Jan. 2000. 

Expand South China and Hong Kong markets. 

Silan was founded in Sep.1997. 


Silan Microelectronics Co.,Ltd 

Structure 

Main subsidiaries 

Silan-IC 

Silan Azure 

Product Line R&D Dept. Sale Dept. 

Test factory in 

Binjiang 

Management 

Dept. 

Power Management 

& Driver 

ASIC Tech. 

Shenzhen Sale (I) 

Wafer Test Dept. 

Quality Management 

Mixed Signal and R.F. 

Mixed Signal Tech. 

Shenzhen Sale (II) 

Final Test Dept. 

R&D Management 

Digital Audio/Video 


Product 

Shenzhen Sale (III) 

Test Technology 

Development Dept. 

Production Management 

MCU 

MCU R&D 

Shenzhen Sale (IV) 

Sale Management 

Video Surveillance 

Image Processing 

Shenzhen Sale (V) 

Discrete Devices 

SOC Embedded 

Software 

Hangzhou Sale (I) 

Processor Tech. 

Device Dept. 

Back-end Design Tech. 

Sale Overseas 

Test Verification Tech. 


Wafer fab 

Wafer manufacturing base in Xiasha includes Silan-IC wafer fabs and Silan Azure LED 

manufacturing fab 

Silan-IC cover area: 125,400 M 2 for three wafer 

fabs 

Silan Azure cover 

area: 50000 M 2 

110 KV 

Substation 

3 

4 

5 

6 

2 

21 

No. 19 Road 

FAB 3 

Building 

FAB 1 

Running 

FAB 2 

Running 

号 

路 

Under Planning 

LED chip FAB 

Running 

No. 10 Road 

Running Building Under Planning 


Silan-ic (wafer fab) 

• Located in Hangzhou Xiasha Economic and 

Technology Development Area; 

• Founded in Jan. 2001, and the first wafer fab line 

(Fab 1) began to be built in May; 

• Fab 2 began to run in Oct. 2005; 

• Total investment has reached over RMB800 million 

at the end of 2009. 

• 1# clean-room: 3600 M 2 ; 

• Process: 1.5-3.0µm bipolar and bipolar based 

discrete device process; 

• Production capacity: 85000 pcs per month (will 

expand to 110k pcs). 

• 2# clean-room: 7000 M 2 ; 

• Process: 0.6-0.8µm BiCMOS/ BCD/ VDMOS, etc; 

• Production capacity: 35000 pcs per month(will 

expand to 90k pcs). 

• 3# clean-room: Began to be built in Oct. 2010, 

10000 M2 in plan for 8-inch wafer fab. 


Slian Chengdu manufacturing factory 

• Silan chengdu manufacturing factory is located in Chengdu-Aba Industrial, where is about a 50-minute drive away 

from Chengdu Shuangliu Airport; 

• Cover a total area of 310,770 M 2 , with the first phase of about 73,000 M 2 started building in Nov. 2010; 

• It will run in fourth quarter of 2011 and plan for the following businesses: 

(1)ICs and power devices manufacturing (2)High-brightness LED chips manufacturing 

(3)Power module packaging 

(4)LED product and component packaging 

First phase construction of Chengdu Silan Semiconductor Manufacturing Ltd. 


Silan Azure (LED chip) 

With 800KK/Month production capacity 

• Special located in the design and manufacturing of GaN highbrightness 

R/G/B LED chips; 

• Total investment has reached RMB 700 million; 

• High-quality LED ICs are well received by our customers and widely 

used in large LED screen; 

• Continuously explore the LED illumination applications. 

12 MOCVDs are provided 

Green LED Chip Blue LED Chip Red LED Chip 


Multi-color (LED packaging) 

• Multi-color is engaged in full color R/G/B LED chips packaging. The products have 

been used in large display screen at Tiananmen Square and already accepted by 

high-end customers at home and abroad; 

• Each package capacity for lamp and SMD is 30KK/month; 

• Features: 

(1) No attenuation: 30mA, 25 ℃, 1000 hours aging, attenuation

R&D center 

• The R&D Center employs talented professionals and has formed a group with more than 

250 design engineers, 100 of which hold a Master’s or Doctor’s degree. 

• Silan is constructing a R&D platform for both technology and product, during which we 

will take advantage of our technical priority and improve management. 

Technology Departments Management Structure Product Lines 

ASIC Tech. 

Mixed Signal Tech. 

Digital Audio/Video Product 

MCU R&D 

Image Processing 

SOC Embedded software 

Processor Tech. 

Back-end Design Tech. 

Test Verification Tech. 

R&D management 

Dept. 

Power Management & Driver 

Mixed Signal & R.F. 


MCU 



Consumer ICs 

Based on the Integrated Products Development (IPD) system, Silan 

R&D Center uses an effective matrix organization to separately 

develop various aspects of IC technology. We emphasize the 

accumulation of core technology, and re-usable IP core. 


Core technology 

• Based on continuous technology accumulation, Silan is able to design complex SOC (system on 

chip) ICs and has the ability to offer total system solutions (including system solution, software 

and IC) to our customers. 

R.F/Analog Tech. 

Audio/Video Tech. 

Discrete Device 

Core technology 

Power Management 

Platform 

MCU/DSP Product 

Platform 

BiCMOS/BCD Process Platform 


Research on High Voltage Special Process 

• Because the high voltage process and product platform development is a very 

complex activity involving a wide range of technical inputs, Silan insists on the R&D 

in the following aspects: 

Process platform constructing 

Device structure research, 

Model parameter design environment 

building 

Circuit design validation 

Application system research 

Package tech. research 

Quality evaluation system 


Road map of wafer fab process 

HV BCD 

1µm 600V high voltage IC process 

2µm 600V high voltage IC process(for high voltage driver) 

2µm 1200V high voltage IC process 

1µm 600V high voltage BCD process Built-in 

600V high power lateral super junction MOS 

LV BCD 

0.8µm complementary 25V BCD process 

0.8µm 50V BCD process 



0.6µm BCD process 

BiCMOS 

0.8µm 9V BiCMOS process 

0.8µm 25V BiCMOS process 

0.8µm high frequency BiCMOS process 

0.6µm BiCMOS process 

Bipolar 

1.5µm high voltage bipolar process 

0.8µm complementary bipolar process 

SBD 

40V-200V common SBD 

600V planar SBD 

Trench SBD with large current 

Super-junction SBD 

FRD 

200V-600V planar FRD 

800V-1200V planar structure FRD 

IGBT 

600V planar PT-IGBT 

1200V grooved-gate NPT IGBT 

HV MOSFET 

S-Rin TM structure 

F-Cell TM structure 

First generation super-junction MOSFET of Silan 

2007 2008 2009 2010 2011 


Product line 


Strategy 

Based on advanced BCD/high-voltage IC process of Silan, 

develop green power products with high efficiency and low 

standby power dissipation, LED illumination driver, DC 

variable-frequency motor driver with Silan’s advanced 

power and motor driver structure. 

Category 

• AC-DC converter 

• DC-DC converter 

• LED driver 

• DC brushless motor driver 

• Digital audio power amplifier 


Product line 

Mixed Signal and R.F. 

Strategy 

Develop high integration and high cost-performance toy 

remote control IC with R.F., MCU and power driver 

functions. 

Based on high-frequency BiCMOS process of Silan-IC, 

develop high-frequency tuner IC used in set-top box and 

digital TV. 

Category 

• High integration toy remote control IC 

• Remote control codec IC 

• Video processing IC 

• High-frequency tuner IC 


Product line 


Strategy 

Develop SOC products based on disc servo/digital audio 

/video decode technology; and expend its business in 

segment market with the high cost-performance 

application solutions . 

Category 

• CD servo IC and system solution 

• MP3/WMA digital audio decoder and system solution 

• CHD-15 red light high-definition digital media player 

and system solution 


Product line 

MCU 

Strategy 

Based on 4-bit/8-bit MCU, develop MCU products for 

household appliances control. 

Category 

• Audio system control IC 

• Household appliance control IC 

• Programmable remote control IC 


Product line 


Strategy 

Develop high integration multi-channel H.264 video 

encoder with high cost-performance and provide digital 

video surveillance solutions for customers. 

Category 

• Multi-channel video Encoder 

• Single-channel video SOC 


Product line 

Discrete Device 

Strategy 

Based on the advanced process of Silan fab line and 

powerful production capacity, develop various 

semiconductor discrete devices and provide best service 

for our customers. 

Category 

• High Voltage MOSFET 

• Schottky Diode 

• Current Regulative Diode 

• Fast Recovery Diode 

• TVS&ESD Protection Diode 

• Switching Diode 

• Zener Diode 


Revenue 

280 

Anticipation 

260 

240 

220 

200 

Calculated at current 

exchange rates 

Million U.S. $ 

224 

180 

160 

140 

127 

134 

141 

120 

110 

100 

80 

60 

61 

77 

40 

20 

1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 

2009 

2010 

2011 

Others:16% 

DC-DC:15% 

LDO:42% 

AC-DC:27% 

Market Ratio 

Product Ratio 

Product Ratio Of 



Main customers 

Power 

Management ICs 

CD Servo & 

Digital 

Audio/Video ICs 

Consumer ICs 

Car Products 


Discrete 

Devices(Die) 


Subcontractors 

Assembly Factory 

Wafer Foundry 


Quality control 

Consider the customer’s strict requirements for the quality as 

the chance and challenge of improving Silan’s quality control. 

Continuous quality improvement for the high quality standard in 

the whole world. 

Mature product function parameters and quality control system 

for product preparation before it is put into use. 

Careful and precise product failure analysis flow. 

Has been authorized ISO9001 quality certification//ISO14001 

environmental management system and SONY GP certification. 


Support 

Finish in 5 

workdays 

Customer 

Immediate 

Response 

Customer support 

/sale/product application 

engineer 

Q R A 

Sale manager 

Product manager 

Sale engineer 

Design engineer 

Product engineer 

Silan foundry 

Supplier 

Actual average 4.13 days in 2010! 


Audits of Customers and Partners 

Customer 

Approval 

Received Date Authorizer Certification No. or Code 

ECO partner 2007-07-01 Samsung D6C3 SLHK Limited 

/ 2010-06-03 LG Innotek / 

/ 2010-06-28 Osram ZSIN 

/ 2010-08-05 EXAR / 

/ 2010-08-18 FSP / 

/ 2010-08-20 Panasonic / 

/ 2010-09-14 SEMCO / 

/ 2010-09-15 Hisense / 

/ 2010-09-20 DVE / 

SONY GP 2010-10-05 Sony SOEM12104 


QRA quality certificate 

SILAN certified by CQM 

for ISO9001:2008 

SILAN certified by CQM 

for ISO14001:2004 

SILAN certified by 

SONY GP 


Failure analysis 

Acquisition of 

failure information 

Appearance 

Inspection 

Open/short 

UI-JT test 

Electrical 

Characteristics Test 

• Hand test 

• Auto test 

Non-destructive 

Package Inspection 

• X-ray 

• Ultrasonic inspection 

Decap 

Internal 

Inspection Failure Position Delayer Failure Analysis 

• Die surface 

defect inspection 

• Bonding defect 

inspection 

• Microscope 

• Scanning Electron 

microscope 

• Liquid analysis 

• Photonic analysis 

• Dry etching 

• Wet etching 

• Manual probe test 

• Aggregation particle 

number analysis 

Failure Mechanism 

Failure analysis report 


Test 

For the important quality control during IC design and 

manufacture, Silan has the considerable ability in wafer and 

IC final testing. At present, more than ten thousand wafers 

and tens of millions of ICs can be tested per month. 

The well controlled test system guarantees the product 

quality and meets the requirements of the increasing 

production capacity. 


Test equipment design 

Besides IC design, Silan also 

has the ability to self-design 

the test equipments. Now, the 

second generation of discrete 

device test system, analog IC 

test system and the third 

generation of digital IC test 

system are in mass production. 

In addition, the new generation 

mixed signal test system M800 

with high performance has 

been successfully designed 

and put into use. 

Automatic test handlers of different types are 

manufactured for final testing ICs with different 

packages of DIP, SIP, SOP, TO-92, TO-220, 

and QFP, etc. 

The technology of all above test equipments 

has reached the domestic leading level, and 

we have used more than 200 sets in 

production line. 


For 

为 

Customer 

客户 

Offer attractive, value-added products and services 

For Staff 

For Shareholder 

Provide individual development and 

prosperous career opportunities 

Maximize return on investment and 

ensure a bright long term future 

For Society 

Create wealth through hard work, and contribute to 

benefit the community 


http://www.silan.com.cn

Hangzhou Silan Microelectronics Co., Ltd

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