Semiconductor Fabrication Equipment - Liquidation Auction ...
Semiconductor Fabrication Equipment - Liquidation Auction ...
Semiconductor Fabrication Equipment - Liquidation Auction ...
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Major Sealed Bid Sale<br />
On Behalf of:<br />
Applied Materials P5000 CVD-TEOS<br />
Applied Materials P5000 Etch<br />
Starting: Thursday, January 11, 2011<br />
Ending: Monday, February 28, 2011<br />
<strong>Auction</strong>eer’s Note:<br />
HGP is pleased to be selected to conduct this Major<br />
Sealed Bid Sale of assets from Hewlett Packard.<br />
This Major Sealed Bid Sale will feature well maintained<br />
Mapping Systems, Etchers, Steppers, Wet Benches,<br />
Metrology <strong>Equipment</strong> and Much More.<br />
Please view our website at www.HGPauction.com for the<br />
bidding instructions and the full terms of the sale. Thank<br />
you for your interest, and we look forward to providing<br />
you quality equipment sales and World Class Service.<br />
Beckman Allegra X-12R with Rotor<br />
Best Regards,<br />
Ross and Kirk Dove<br />
Managing Partners<br />
Heritage Global Partners<br />
Preview Available by Appointment:<br />
1000 NE Circle Boulevard<br />
Corvallis, OR 97330<br />
Contact:<br />
All Interested Parties Should Contact:<br />
George Wandachowicz<br />
email: gw@hgpauction.com<br />
phone: +1 (858) 847-0656<br />
Buyer’s Premium: 15% cash buyers; 18% for credit card<br />
purchasers (refer to term 7 in the <strong>Auction</strong> Terms and<br />
Conditions for details).<br />
KLA-Tencor RS-55 Mapping System<br />
DNS SD-80BW Litho-Developer<br />
SALE WILL BE CONDUCTED IN ENGLISH<br />
AND WILL ACCEPT US CURRENCY ONLY<br />
Applied Material Precision 5000<br />
KLA-Tencor Surfscan-6200
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