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Technical Progr<strong>am</strong> [ <strong>thursday</strong> ] MORNING <strong>sessions</strong> B. W. Jaekel, Siemens AG, Erlangen, Germany; A. N. Mladenovic, University of Nis, Nis, Yugoslavia; M. Peric, University of Nis, Nis, Yugoslavia; D. Vuckovic, University of Nis, Nis, Yugoslavia; N. Cvetkovic, University of Nis, Nis, Yugoslavia; S. Aleksic, University of Nis, Nis, Yugoslavia 9:<strong>30</strong>–10 a.m. Low Frequency Electromagnetic Field Exposure Study with Posable Human Body Model X. Chen, ITIS Foundation, Zurich, Switzerland; S. Benkler, SPEAG Schmid & Partner Engineering AG, Zurich, Switzerland; C. Li, ITIS Foundation, Zurich, Switzerland; N. Chavannes, SPEAG Schmid & Partner Engineering AG, Zurich, Switzerland; N. Kuster, ITIS Foundation, Zurich, Switzerland Break U Capturing the Electromagnetic Environment 1 Continued from page 38 10:<strong>30</strong>–11 a.m. Specific Absorption Rate Evaluation for People using Wireless Communication Device in Vehicle K. Chan, S. Leung, Y. Siu, City University of Hong Kong, Hong Kong, Hong Kong Special Session: Modeling/Simulation Validation TH-AM-3 | Room 209/210 8:<strong>30</strong> AM-<strong>noon</strong> Sponsored by TC3 Chairs: Dr. Andy Drozd, Andro Consulting & Dr. Bruce Arch<strong>am</strong>beault, IBM Abstract This special session will explore the new modeling and simulation validation standard and explore the new Feature Selective Validation (FSV) technique for use in quantifying the quality of the agreement between the initial model result and the validation (whether measurements or other simulation). 8:<strong>30</strong>–9 a.m. Antenna Co-Site Performance Analysis for Complex Systems Using Feature Selective Validation I. Kasperovich, A. L. Drozd, A. A. Croneiser, C. E. Carroll, ANDRO Computational Solutions, LLC, Rome, U.S.A. 9–9:<strong>30</strong> a.m. Quantifying the Quality of Agreement between Data for Multiple Data Sets B. Arch<strong>am</strong>beault, IBM, Raleigh, U.S.A.; J. Diepenbrock, IBM, Raleigh, U.S.A. 9:<strong>30</strong>–10 a.m. Applying Feature Selective Validation (FSV) as an Objective Function for Data Optimization S. Pan, H. Wang, J. Fan, Missouri University of Science and <strong>Technology</strong>, Rolla, U.S.A. Break 10:<strong>30</strong>–11 a.m. Challenges in Developing a Multidimensional Feature Selective Validation Implementation B. Arch<strong>am</strong>beault, IBM, Raleigh, U.S.A.; A. Duffy, De Montfort University, Leicester, United Kingdom; H. Sasse, De Montfort University, Leicester, United Kingdom; X. Li, De Montfort University, Leicester, United Kingdom; M. Scase, De Montfort University, Leicester, United Kingdom; M. Shafiullah, De Montfort University, Leicester, United Kingdom; A. Orlandi, University of L'Aquila, L'Aquila, Italy; D. De Febo, University of L'Aquila, L'Aquila, Italy 11-11:<strong>30</strong> a.m. Comparison of Measured and Computed Near and Far Fields of a Heatsink using the Feature Selective Validation (FSV) Method A. U. Bhobe, P. Sochoux, Cisco Systems, San Jose, U.S.A. 11:<strong>30</strong>-<strong>noon</strong> Validating the FSV Method Using Reverberation Ch<strong>am</strong>ber Measurements G. J. Hankins, D. Lewis, The Boeing Company, Seattle, U.S.A. Transmission Line Noise Concerns TH-AM-4 | Room 207/208 Sponsored by TC9 Chairs: Michael McInerney, U.S. Army Engineer Research and Development Center & Fin O'Connor, Alion Science 8:<strong>30</strong>–9 a.m. Modeling Connector Contact Condition Using a Contact Failure Model with Equivalent Inductance Y. Hayashi, Tohoku University, Sendai, Japan; S. Wu, Missouri University of Science and <strong>Technology</strong>, Rolla, U.S.A.; J. Fan, Missouri University of Science and <strong>Technology</strong>, Rolla, U.S.A.; T. Mizuki, Tohoku University, Sendai, Japan; H. Sone, Tohoku University, Sendai, Japan 9–9:<strong>30</strong> a.m. Predicting CM Radiation from Strip Line Structure by Equivalent Circuit Model Y. Kayano, H. Inoue, Akita University, Akita, Japan 9:<strong>30</strong>–10 a.m. Lumped-Element Circuit Model of Ferrite Chokes A. Orlando, Missouri University of Science and <strong>Technology</strong>, 40 interference technology emc Symposium guide 2010
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