High-Performance, Fully-Differential Audio Op Amp (Rev. B)
High-Performance, Fully-Differential Audio Op Amp (Rev. B)
High-Performance, Fully-Differential Audio Op Amp (Rev. B)
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OPA1632<br />
SBOS286B –DECEMBER 2003–REVISED JANUARY 2010<br />
www.ti.com<br />
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with<br />
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.<br />
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more<br />
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.<br />
PACKAGE/ORDERING INFORMATION (1)<br />
SPECIFIED<br />
PACKAGE TEMPERATURE PACKAGE TRANSPORT<br />
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING ORDERING NUMBER MEDIA, QUANTITY<br />
OPA1632<br />
SO-8 D −40°C to +85°C OPA1632<br />
OPA1632D Rails, 100<br />
OPA1632DR Tape and Reel, 2500<br />
MSOP-8<br />
OPA1632DGN Rails, 100<br />
DGK −40°C to +85°C 1632<br />
PowerPAD OPA1632DGNR Tape and Reel, 2500<br />
(1) For the most current package and ordering information see the Package <strong>Op</strong>tion Addendum at the end of this document, or see the TI<br />
web site at www.ti.com.<br />
ABSOLUTE MAXIMUM RATINGS (1)(2)<br />
Over operating free-air temperature range (unless otherwise noted).<br />
OPA1632<br />
Supply Voltage, ±V S ±16.5 V<br />
Input Voltage, V I ±V S V<br />
Output Current, I O 150 mA<br />
<strong>Differential</strong> Input Voltage, V ID ±3 V<br />
Maximum Junction Temperature, T J +150 °C<br />
<strong>Op</strong>erating Free-Air Temperature Range –40 to +85 °C<br />
Storage Temperature Range, T STG –65 to +150 °C<br />
Human Body Model (HBM) 1 kV<br />
ESD Ratings Charged Device Model (CDM) 500 V<br />
Machine Model (MM) 200 V<br />
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may<br />
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond<br />
those specified is not supported.<br />
(2) The OPA1632 MSOP-8 package version incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be<br />
connected to a thermally-dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction<br />
temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the<br />
PowerPAD thermally-enhanced package.<br />
UNIT<br />
PIN CONFIGURATION<br />
OPA1632<br />
MSOP-8, SO-8<br />
(TOP VIEW)<br />
V IN<br />
1<br />
8<br />
V IN+<br />
V OCM<br />
2<br />
7<br />
Enable<br />
V+<br />
3<br />
6<br />
V<br />
V OUT+<br />
4<br />
5<br />
V OUT<br />
2 Copyright © 2003–2010, Texas Instruments Incorporated<br />
Product Folder Link(s): OPA1632
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