Brochure - Oerlikon

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Most Productive
Packaging Solution
Outperforming Technology Requirements
LIECHTENSTEIN
Headquarters
OC Oerlikon Balzers Ltd.
Iramali 18
P.O. Box 1000
9496 Balzers
Liechtenstein
T: +423 388 4770
info.systems@oerlikon.com
S: sales.systems@oerlikon.com
CS: service.systems@oerlikon.com
Germany
Regional Office
Oerlikon Deutschland
Vertriebs GmbH
Karl-Hammerschmidt-Strasse 34
85609 Aschheim-Dornach
Germany
T: +49 89 75 505 100
S: sales.systems.mn@oerlikon.com
CS: service.systems.mn@oerlikon.com
AMERICAS
Regional Office
Oerlikon USA Inc
970 Lake Carillion Dr, Suite 300
St. Petersburg FL 33716
United States
T: +1 887 948 0260
S: sales.systems.sp@oerlikon.com
CS: service.systems.sp@oerlikon.com
Taiwan (R.O.C.)
Central Hub
DKSH Taiwan Ltd.
China
DKSH China Ltd.
13F-1, No.100, Sec. 1,
Jiafong 11th Rd.
Jhubei City, Hsinchu County 302
Taiwan (R.O.C.)
1801 Hongmei Road
Innov Tower / Block A Unit 2208
Shanghai
China
T: +886 3 657 8788
S: jason.chen@dksh.com
CS: ben.lin@dksh.com
T: +86 21 5383 8811
S: christy.liu@dksh.com
Japan
Hakuto Co., Ltd.
1-13. Shinjuku 1-Chome
Shinjuku-ku
Tokyo 160-8910
Japan
S: +81-3-3225-8992
CS: +81-3-3225-8992
S: HKT-oerlikon@hakuto.co.jp
Malaysia *
ZMC Technologies
(Malaysia) Sdn Bhd
No. 1-3-23 Krystal Point 2
Lebuh Bukit Kecil 6
Penang 11900
Malaysia
T: +60 4 646 4586
S: yf_lau@zmc.net
CS: pf_lau@zmc.net
STL: julie_khoo@zmc.net
Singapore *
ZMC Technologies
(Singapore) Pte Ltd
10 Ubi Crescent #05-92/93/94/95
Lobby E, Ubi Techpark
Singapore 408564
Singapore
T: +65 6285 1161
S: steven_ho@zmc.net
CS: jiang_ez@zmc.net
STL: carmen_leong@zmc.net
South Korea
Woowon Technology Co., Ltd
1903 Parkview Office Tower
6 Jeongja-dong, Bundang-gu
Seongnam-si, Kyeonggi-do
463-863 South Korea
T: +82 31 783 4770
S: hongson@wwtech.co.kr
CS: harrylee@wwtech.co.kr
KEY: T: Telephone, S: Sales, CS: Customer service, STL: Support, training & logistics. *Including Indonesia / Thailand / Philippines
HEX/6P/EN/06_2012
www.oerlikon.com/systems

HEXAGON
Advanced packaging sputtering solution for high volume production
HEXAGON
Applications
HEXAGON
Technical Information
Innovation has a name –
Cost of ownership does too
At Oerlikon, we understand the pressure you
have to lower your cost per wafer. That’s why our
newest tool for advanced packaging more than
doubles wafer throughput, has a 50% smaller
footprint than its competitors, and runs up to
5’000 wafers before requiring maintenance.
The revolving
carousel on HEXAGON
Productivity
Features
Under Bump & Re-distribution Metallization
Throughput
Footprint & Layout
Cost per Wafer
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Highest throughput
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Smallest footprint
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Lowest energy consumption
Reliability
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Proven process components
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Proven material handling systems
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Proven control backbone
Availability
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Designed for processing organic passivated wafers
300mm or 200/300mm Bridge Capability
Process Capabilities
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Thermal pre-treatment (Degas)
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Low temperature ICP etching
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DC/DC-pulsed sputtering
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Fast wafer transfer to minimize contamination
Process Chambers
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Integrated stainless steel process chambers
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Full process isolation
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UHV pumping and vacuum capability
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System integration and packaging are responsible for the functionality,
quality and economy of microelectronic products.
UBM and RDL films like Ti-Cu, WTi-Cu, Ti- NiV- Cu etc. are commonly used
in todays advanced packaging industry. The HEXAGON provides:
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Low contact resistance
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No damage ICP etching
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Good adhesion to the chip surface
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Low stress metal stack
HEXAGON is the ideal solution for the latest generation ICs,
organic passivated- or reconstituted (mold) wafers
Oerlikon is the market leader in UBM and RDL metallization
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70 wafers-per-hour (Wph) handling limit
UBM processing with BKM (20nm Etch): 60 Wph
Productivity
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Over 85% typical availability
Up to 5’000 wafers maintenance intervals
Less than 6 hours total equipment maintenance time
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Breakage rate less than 1:20’000
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Meantime between failure over 500 hours
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12m 2 equipment mainframe
5m 2 support and control systems
17m 2 total installation area
Less than half of any other
commercially available system
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Highest wafer output per maintenance interval
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Temperature controlled process chambers
Maintainability
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Drop-in shield kits
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Powered source handling
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Automated maintenance services
Chucks
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Temperature controlled (heated or cooled)
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Full face, clamped, ESC, floating
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RF or DC biased
Transfer System
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Up to four FOUP atmospheric front end stations
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High throughput synchronous motion indexer
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Wafer position monitoring
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Mechanically confined wafer transfers
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Cryogenic gates and toroidal chamber design
Thin Wafer & Backside Metallization
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Backside metallization with up to 4 metals on thin wafers is typically used for power
devices, micro-processors, graphic chips, TSV wafers etc. Very thin wafers are
typically bonded to a glass carrier, alternatively the TAIKO ® grinding process provides
enhanced stability for very thin wafers.
Handling reliability for thin wafers is one of the key advantages of the HEXAGON
Oerlikon is the market leader in backside metallization
Below: At just 12m 2 the HEXAGON mainframe
for open source isolation
Operability
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Fully pre-integrated systems for fast installation
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High spare part overlap with previous generation
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> 90% process matching with previous generation
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> 90% control and operation compatibility
with previous generation
HEXAGON
HEXAGON