2012-2013 Product Catalog - Polysciences, Inc.
2012-2013 Product Catalog - Polysciences, Inc.
2012-2013 Product Catalog - Polysciences, Inc.
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Electronic Adhesives & Encapsulants<br />
Encapsulants for Fragile Substrates<br />
<strong>Catalog</strong> # Size<br />
LoSTRESS Liquid Encapsulant<br />
LoSTRESS Epoxy encapsulants have a low modulus of elasticity which puts minimal cure stress<br />
on fragile ceramic and/or flexible substrates. These encapsulants are novel, epoxy-based 100%<br />
solids, single component liquid semiconductor encapsulants designed for devices requiring high<br />
toughness, flame retardancy and strong adhesion to various substrates such as metal, ceramic<br />
and organic. LoSTRESS is especially suitable for SAW filter applications. LoSTRESS can<br />
virtually eliminate warp on ceramic substrates due to the low cure stress. Dam and fill and glob<br />
top versions are available.<br />
Specific<br />
Gravity<br />
Viscosity<br />
@ 25°C<br />
(CPS)<br />
Tg<br />
(°C)<br />
Modulus<br />
@ 25°C<br />
(Mpa)<br />
CTE a1<br />
(ppm/°C)<br />
CTE a2<br />
(ppm/°C)<br />
Cure<br />
Schedule<br />
(°C)<br />
JEDEC<br />
Level<br />
Reflow<br />
Temp<br />
(°C)<br />
Form<br />
1.12 9K 4000
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