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IGBT Power Modules

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PERFORMANCE & THERMAL MANAGEMENT<br />

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Improved Low Profile Packages<br />

SP1 (12mm)<br />

SP3 (12mm)<br />

SP4 (17mm)<br />

SP6 (17mm)<br />

SP6-P (12mm)<br />

SP1 SP3<br />

SP4 SP6<br />

SP6-P<br />

Industry Standard Packages<br />

SOT-227 (Isotop ® )<br />

34mm & 62mm Types<br />

D1 (34 mm Wide)<br />

D3 (62 mm Wide)<br />

D4 (62 mm Wide)<br />

SOT-227<br />

D1<br />

D3<br />

D4<br />

SM1<br />

SM2<br />

SM3<br />

SD1<br />

SD2<br />

Mini-Mod<br />

Surface Mount<br />

Package Advantages<br />

SP6 - SP APTmodule<br />

MODULE<br />

Mini-Mod<br />

TO-249 9-pin TO-249<br />

12 mm<br />

ISOTOP ®<br />

Non Isolated<br />

TO-249<br />

TO-244A<br />

Twin Tower<br />

SP1 package:<br />

-Replaces 2 SOT-227 parts<br />

-Improved assembly time and cost<br />

-Height compatible with SOT-227 package<br />

-Copper base plate for improved perfromance<br />

VJ<br />

Half Pack<br />

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SP6 package offers the same footprint and the same<br />

pinout location as the popular 62mm package but<br />

with lower height, leading to:<br />

- Reduced stray inductance<br />

- Reduced parasitic resistance<br />

- Higher efficiency at high frequency<br />

SP3 package:<br />

-Replaces up to 4 SOT-227 parts<br />

-Reduced assembly time and cost<br />

-Height compatible with SOT-227 package<br />

-Copper base plate for high reliability<br />

17<br />

SP6-P package:<br />

-Replaces up to 6 SOT-227 parts<br />

-Height compatible with SOT-227 package<br />

-Low inductance solder pins<br />

-High current capability

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