Presentations ( 1.2MB) - Tokyo Electron Limited (TEL)
Presentations ( 1.2MB) - Tokyo Electron Limited (TEL)
Presentations ( 1.2MB) - Tokyo Electron Limited (TEL)
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SPE Business – other highlights<br />
► Thermal processing system<br />
► 3DI<br />
• Customer evaluation progressed in high-performance ALD equipment<br />
(NT333). Obtained POR for use in next generation memory<br />
• Shipped TSV processing equipment to pilot lines of several customers<br />
(Wafer bonder/debonder, Deep Si etch system, Dielectric liner deposition)<br />
• Shipments of bonders for C-MOS sensors are strong<br />
► Technology for the volume production of new<br />
memory STT-MRAM (jointly developed with Tohoku University)<br />
• Started development of a range of production equipment for volume<br />
production from 2015<br />
33<br />
Corp IR/October 31, 2012
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