Numerical and Experimental Analysis of Natural ... - COMSOL.com

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COMSOL Modelling The considered physical system is outlined by parallel boards (Printed Circuit Board) surrounded by air and arranging on multiple heat sources (Chip) COMSOL Conference 2008 - Hannover 18
COMSOL Modelling Governing equations for solving thermal and dynamical fields read as: r Dv ρ μ Dτ = −∇ + r + ∇ ∂ ρ r + ∇⋅ = ∂τ r 2 p F v ( ρv ) 0 DT ρCP = ∇⋅( λ∇⋅ T) + q Dτ COMSOL Conference 2008 - Hannover 19
Page 1 and 2: Presented at the COMSOL Conference
Page 3 and 4: Outlines Introduction to DIMM Exp
Page 5 and 6: Introduction The actually most used
Page 7 and 8: Introduction The numerical model (a
Page 9 and 10: Introduction Tools Infrared thermo-
Page 11 and 12: Experimental set-up The experimenta
Page 13 and 14: Experimental set-up The experimenta
Page 15 and 16: Experimental set-up Frontal black b
Page 17: Outlines Introduction to DIMM Exp
Page 21 and 22: COMSOL Modelling Only in chip sub-d
Page 23 and 24: COMSOL Modelling Influence of compu
Page 25 and 26: Outlines Introduction to DIMM Exp
Page 27 and 28: Results Transient analysis: : compa
Page 29 and 30: Results Numerical Vs Experimental:
Page 31 and 32: Results Numerical Vs Experimental:
Page 33 and 34: Results Steady solution: : comparis
Page 35 and 36: Results Convective heat transfer co
Page 37 and 38: Conclusions ‣ This study highligh

Numerical and Experimental Analysis of Natural ... - COMSOL.com

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