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Fine Pitch Stacking Connectors (Parallel Board-to-Board)

Fine Pitch Stacking Connectors (Parallel Board-to-Board)

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<strong>Fine</strong> <strong>Pitch</strong> SMT <strong>Stacking</strong> <strong>Connec<strong>to</strong>rs</strong><br />

(<strong>Parallel</strong> <strong>Board</strong>-<strong>to</strong>-<strong>Board</strong>)<br />

AMPMODU System 50 <strong>Connec<strong>to</strong>rs</strong><br />

Surface-Mount <strong>Connec<strong>to</strong>rs</strong>, 1.27 [.050] Centers, <strong>Board</strong>-<strong>to</strong>-<strong>Board</strong><br />

Product Facts<br />

■ Surface-mount option for<br />

parallel board-<strong>to</strong>-board<br />

applications; completely<br />

intermateable with<br />

AMPMODU System 50<br />

through-hole board-<strong>to</strong>-board<br />

and cable-<strong>to</strong>-board systems<br />

■ Dual-row, vertical,<br />

shrouded header and<br />

receptacle assemblies<br />

■ Available in select sizes<br />

from 10 through 100<br />

positions<br />

■ High Density; contacts<br />

spaced on 1.27 x 2.54 [.050<br />

x .100] centers; compact<br />

footprint<br />

■ Compatible with standard<br />

surface-mount processes<br />

■ Stand-offs for free drainage<br />

of flux cleaning solutions;<br />

visible solder joints for easy<br />

inspection<br />

■ Simple, low insertion-force<br />

holddown for process<br />

retention and long-term<br />

strain relief for solder joints<br />

■ Available in tape and reel<br />

packaging for au<strong>to</strong>matic<br />

placement.<br />

■ Recognized under the<br />

Component Program of<br />

Underwriters<br />

R<br />

Labora<strong>to</strong>ries Inc.,<br />

File No. E28476<br />

■ Certified by Canadian<br />

Standards<br />

R<br />

Association,<br />

File No. LR 7189<br />

The high-density surfacemount<br />

connec<strong>to</strong>r is another<br />

mounting option in the<br />

AMPMODU System 50 connec<strong>to</strong>r<br />

family.<br />

This surface-mount system<br />

is <strong>to</strong>tally intermateable with<br />

the AMPMODU System 50<br />

thru-hole and cable-<strong>to</strong>board<br />

connec<strong>to</strong>rs.<br />

Additionally, the design of<br />

the mating interface has not<br />

been changed, ensuring<br />

the same high reliability as<br />

the thru-hole product.<br />

The surface-mount system<br />

includes dual-row, vertical,<br />

shrouded header and<br />

receptacle assemblies in<br />

select sizes from 10<br />

through 100 positions. It<br />

meets the tight dimensional<br />

requirements of surfacemount<br />

technology. The simple,<br />

low insertion-force<br />

holddown provides both<br />

processing retention and<br />

long-term strain relief for the<br />

solder joints in the headers<br />

and receptacles.<br />

1.27mm AMPMODU System 50<br />

<strong>Connec<strong>to</strong>rs</strong><br />

See Catalog 1307819 for<br />

additional AMPMODU product<br />

offerings.<br />

Catalog 889092 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514<br />

Revised 9-06 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628<br />

specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013<br />

www.tycoelectronics.com are standard equivalents. <strong>to</strong> change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967<br />

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