Fine Pitch Stacking Connectors (Parallel Board-to-Board)
Fine Pitch Stacking Connectors (Parallel Board-to-Board)
Fine Pitch Stacking Connectors (Parallel Board-to-Board)
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<strong>Fine</strong> <strong>Pitch</strong> SMT <strong>Stacking</strong> <strong>Connec<strong>to</strong>rs</strong><br />
(<strong>Parallel</strong> <strong>Board</strong>-<strong>to</strong>-<strong>Board</strong>)<br />
AMPMODU System 50 <strong>Connec<strong>to</strong>rs</strong><br />
Surface-Mount <strong>Connec<strong>to</strong>rs</strong>, 1.27 [.050] Centers, <strong>Board</strong>-<strong>to</strong>-<strong>Board</strong><br />
Product Facts<br />
■ Surface-mount option for<br />
parallel board-<strong>to</strong>-board<br />
applications; completely<br />
intermateable with<br />
AMPMODU System 50<br />
through-hole board-<strong>to</strong>-board<br />
and cable-<strong>to</strong>-board systems<br />
■ Dual-row, vertical,<br />
shrouded header and<br />
receptacle assemblies<br />
■ Available in select sizes<br />
from 10 through 100<br />
positions<br />
■ High Density; contacts<br />
spaced on 1.27 x 2.54 [.050<br />
x .100] centers; compact<br />
footprint<br />
■ Compatible with standard<br />
surface-mount processes<br />
■ Stand-offs for free drainage<br />
of flux cleaning solutions;<br />
visible solder joints for easy<br />
inspection<br />
■ Simple, low insertion-force<br />
holddown for process<br />
retention and long-term<br />
strain relief for solder joints<br />
■ Available in tape and reel<br />
packaging for au<strong>to</strong>matic<br />
placement.<br />
■ Recognized under the<br />
Component Program of<br />
Underwriters<br />
R<br />
Labora<strong>to</strong>ries Inc.,<br />
File No. E28476<br />
■ Certified by Canadian<br />
Standards<br />
R<br />
Association,<br />
File No. LR 7189<br />
The high-density surfacemount<br />
connec<strong>to</strong>r is another<br />
mounting option in the<br />
AMPMODU System 50 connec<strong>to</strong>r<br />
family.<br />
This surface-mount system<br />
is <strong>to</strong>tally intermateable with<br />
the AMPMODU System 50<br />
thru-hole and cable-<strong>to</strong>board<br />
connec<strong>to</strong>rs.<br />
Additionally, the design of<br />
the mating interface has not<br />
been changed, ensuring<br />
the same high reliability as<br />
the thru-hole product.<br />
The surface-mount system<br />
includes dual-row, vertical,<br />
shrouded header and<br />
receptacle assemblies in<br />
select sizes from 10<br />
through 100 positions. It<br />
meets the tight dimensional<br />
requirements of surfacemount<br />
technology. The simple,<br />
low insertion-force<br />
holddown provides both<br />
processing retention and<br />
long-term strain relief for the<br />
solder joints in the headers<br />
and receptacles.<br />
1.27mm AMPMODU System 50<br />
<strong>Connec<strong>to</strong>rs</strong><br />
See Catalog 1307819 for<br />
additional AMPMODU product<br />
offerings.<br />
Catalog 889092 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514<br />
Revised 9-06 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628<br />
specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013<br />
www.tycoelectronics.com are standard equivalents. <strong>to</strong> change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967<br />
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