TAlYO - ITC Intercircuit
TAlYO - ITC Intercircuit
TAlYO - ITC Intercircuit
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Wir garantieren folgende Leistungen:<br />
VIA HOLE PLUGGING<br />
SERVICE<br />
- Lieferung der Leiterplatten in sauberem und vorgereinigtem Zustand<br />
- Die Bohrungen müssen frei von Verschmutzung sein<br />
- Abzuklebende Plugging Service: Bereiche (Registrierbohrungen) sind mitzuteilen Advantages over conventional screen printing<br />
- Bohrungen müssen metallisiert sein<br />
processes:<br />
- Die Platten müssen sauber entgratet sein<br />
I.T.C. <strong>Intercircuit</strong> Production GmbH<br />
✦ Air-bubble-free hole filling<br />
in Germany has been providing our<br />
✦ Less residue after curing process by prior<br />
Prozessablauf:<br />
„Via Hole Plugging“<br />
scraping of the panel in a special designed<br />
as a new sector since 10 years now<br />
chamber.<br />
- Der Kunde liefert die gebohrte, metallisierte und vorgereinigte ✦ Platte Highest zu I.T.C. Aspect Ratio is possible<br />
- Zur Beseitigung der Restfeuchte werden die Platten im Trockenofen<br />
Planar sealing of buried vias.<br />
✦ Highest getempert flexibility<br />
- Es folgt der eigentliche Pluggingprozess<br />
Hole Plugging is a key-process of SBU / Micro via – ✦ Low paste consumption<br />
- Nach dem Pluggen werden die Platten ca. 60 Minuten bei 150°C getrocknet<br />
� ���������� - Technology. Nach dem ���������������������<br />
Abkühlen (Through können Hole, Blind die Platten Hole, Buried dann geschliffen Vias) werden ✦ Filling of Blind/Buried Vias & Through holes<br />
- Zum Abschluss werden Stichprobenmessungen der Kupferschicht in durchgeführt one step<br />
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- Erstellung eines Prüfprotokolls mit prozessrelevanten Angaben. ✦<br />
We have 3 models of our THP Series:<br />
THP series can use � all common paste types<br />
Overview:<br />
Dienstleistung Plugging im Lohn<br />
- Luftblasenfreies Verfüllen der Bohrungen mit Durchgangs – und Sacklöchern<br />
Voraussetzungen:<br />
➡ Absolutely air-bubble-free hole filling.<br />
➡ Plugging process is done with vacuum.<br />
➡ Selective plugging is possible<br />
➡ Partial June 10,2008 plugging is possible<br />
I.T.C. <strong>Intercircuit</strong> Production GmbH, Innere Gewerbestr. 8<br />
Ortsteil Meinersdorf , 09235 Burkhardtsdorf<br />
Straschu<br />
Leiterplatten GmbH<br />
THP 30 new (THP 10) Herrn THP Dipl.-Chem. 35 Helmut Marczinske THP XXL<br />
View of the machine with full open working area<br />
All of our Plugging - Machines An were der Schmiede designed 15 and patented by I.T.C. <strong>Intercircuit</strong><br />
26135 Oldenburg<br />
!<br />
!<br />
<strong>TAlYO</strong><br />
AMERICA"<br />
The Solder Mask hper=<br />
Always on your side.<br />
Partial closed lower cover for the<br />
work with smaller panel size<br />
THP35 XXL� the machine for the real hole filling challenge.<br />
� Panel size up to 30� x 40�.<br />
� Blind and through hole filling in one single process step.<br />
� Compatible to all types of paste.<br />
� Integrated heat and cooling system.<br />
München, 12. Oktober 20<br />
18. Juni 20<br />
RH<br />
Taiyo THP-100DX1 USA-VF<br />
➡ Reference holes are masked before processAngebot<br />
Nr. 09-10-2815<br />
Technical Datas<br />
/ 10-06-22930<br />
on:<br />
➡ Plugging of via holes on external layers for<br />
www.taiyo-america.com<br />
late copper stacking<br />
➡ Plugging of via holes on inner layers for<br />
Dear Valued Customer:<br />
Dienstleistung Further pastes Plugging available bei I.T.C. on Production request GmbH in Meinersdorf<br />
the following RCC lamination<br />
➡ Perfect Requirements planarity of Taiyo of the America's panel Environmental by using Program and the Sony Green Partner status of<br />
special our company grinding result methods. in offering only products compliant with Directive 2002/95/EC of the<br />
➡ Aspect European Ratio: Parliament 1:40 and of the Council of 27 January 2003 on the restriction of the use of<br />
certain hazardous substances in electrical md electronic equipment, the RoHS directive,<br />
➡ Smallest and Directive Hole: 2003/11/EC, 0,1 after plating the 24* amendment to Council Directive 76/769/EEC.<br />
➡ Largest Hole: 2mm dependent on AS 1:2<br />
➡ Measurement Taiyo America of requires the copper a certification layer thickness statement after or declaration from all suppliers or distributors<br />
stating that no mercury, hexavalent chromium, polybrominated biphenyls (PBBs),<br />
grinding polybrominated (random diphenyl examination) ethers (PBDEs ), lead in excess of 100 ppm, or cadmium in excess of 5<br />
ppm are added to, or known to be present in the raw materials supplied This certification is kept<br />
Board on dimensions:<br />
file for each raw material.<br />
Minimum: 100 mm x 150 mm<br />
Based upon the data from our raw material suppliers, we expect our products to contain no<br />
Maximum: mercury, hexavalent 610mm chromium, x 762 mm polybro<br />
Max ethers XXL: (PBDEs), 762mm including x DecaBDE. 1.000mm<br />
<strong>ITC</strong> <strong>Intercircuit</strong> Plugging Room<br />
Dienstleistung Plugging im Lohn<br />
Prior issues of this letter did not spe<br />
_____________________________________________________________________________________<br />
Court of Justice annulled the RoHS<br />
I.T.C. July INTERCIRCUIT 1,2008. On and after PRODUCTION that date, Deca-BDE GMBH, (one type Innere of PBDE) Gewerbe will be subject Str. to 8, the D-09235 same Burkhardtsdorf/Meinersdorf<br />
restriction as all other PBDE substances. www.itc-intercircuit.de<br />
If you need further information please contact Phillip Harrison.
Grinding after the Plugging Process:<br />
<strong>ITC</strong> PD 30“ Manual Grinding Machine:<br />
Our <strong>ITC</strong> PD 30“ removes excessive plugging<br />
paste from panels and inner layers after hole<br />
plugging process. A uniform plane surface is<br />
achieved.<br />
A partial loop through of the copper layer is<br />
prevented by specified movement of linear<br />
guides.<br />
2 Pieces PD 30 Grinding Machines! WISE Flatstar<br />
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<strong>ITC</strong> Hole Plugging Results:<br />
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WISE FLATSTAR: Automatic Wet Grinder:<br />
The WISE Flatstar removes the Plugging paste<br />
automatically in wet process.<br />
A uniform plane surface is achieved.<br />
You find the advantage of Flatstar in high<br />
throughput per hour.<br />
Max. Board width: 650 mm<br />
further information please visit the webpage:<br />
www.wisecompany.it<br />
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We would plug a test order of 1 - 5 panels and afterwards submit you an individual price offer<br />
T<br />
Contact<br />
I.T.C. <strong>Intercircuit</strong> Production GmbH<br />
��Absolutely air-bubble-free hole filling � Aspect ratio: up to 40:1<br />
��Plugging process Burkhardtsdorf/Deutschland is done with push/pull system. Tel: 037 � 21/39 Min. hole 92-0, size: Fax: .0.1mm 037 after 21/39 plating 92-18<br />
��Selective plugging is possible E-Mail: production@itc-intercircuit.de<br />
� Max hole size: AR 1:2<br />
��Partial plugging is possible<br />
��Reference holes are masked<br />
Please ask for Mr. � Christian Min. panel size: List 100mm x 150mm<br />
� Max panel size: 610mm x 762mm<br />
��Plugging of via holes on external layers for � Paste: Peters PP 2795<br />
later copper stacking � *Taiyo paste THP-100DX1 USA-VF<br />
��Plugging of via Test holes on inner our layers for Service - come was specially and designed for visit <strong>ITC</strong> hole us<br />
the following RCC lamination plugging machines<br />
��Perfect planarity of the panel surface by � All panels are inspected, cleaned & baked<br />
T
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