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CV - Mechanical and Aerospace Engineering - University at Buffalo

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• NYSP2I –63615: D<strong>at</strong>a Driven Optimiz<strong>at</strong>ion of <strong>Buffalo</strong> Wastew<strong>at</strong>er Tre<strong>at</strong>ment Plans (WWTPs).<br />

Start D<strong>at</strong>e: February 2013 (Role PI, $ 30,000).<br />

Completed (Before <strong>University</strong> <strong>at</strong> <strong>Buffalo</strong>-SUNY) (Total $ 1,551,772)<br />

• NSF CMMI EDI–0928837: Collabor<strong>at</strong>ive Research: Knowledge Represent<strong>at</strong>ion <strong>and</strong> Design<br />

for Managing Product Obsolescence. Funded by <strong>Engineering</strong> Design <strong>and</strong> Innov<strong>at</strong>ion/NSF/EDI.<br />

Start D<strong>at</strong>e: August 2009 (Role PI, $ 101,772).<br />

• DARPA (i-FAB, BAA-11-20): Reasoning about Manufacturability <strong>and</strong> Design Changes<br />

via Graph-Grammar Based Search Funded by DARPA. Start D<strong>at</strong>e: May 2011 (Role PI,<br />

$400,000, Subcontracted to MCT@NASA AMES through PARC, Multi team proposal totaling<br />

$2.3 Million Dollars with 4 PIs from various research centers <strong>and</strong> universities).<br />

• DARPA (META-II, BAA-10-59): Formal Co-verific<strong>at</strong>ion of Correctness of Large Scale<br />

Cyber-Physical Systems during Design. Funded by DARPA. Start D<strong>at</strong>e: October 2010 (Role<br />

PI, $750,000, Subcontracted to MCT@NASA AMES through PARC, Multi team proposal<br />

totaling $3.5 Million Dollars with 4 PIs from various research centers <strong>and</strong> universities).<br />

• Niagara Bottling LLC: Comput<strong>at</strong>ional Design Optimiz<strong>at</strong>ion of W<strong>at</strong>er Bottle Packaging Systems.<br />

Funded by Niagara Bottling LLC. Start D<strong>at</strong>e: September 2010 (Role PI, $5,000,<br />

Fresno St<strong>at</strong>e).<br />

• Hewlett Packard (HP): Distributed Comput<strong>at</strong>ional Design Environment (DiCoDE). Funded<br />

by HP. Start D<strong>at</strong>e: May 2009 (Role PI, $280,000, Fresno St<strong>at</strong>e).<br />

• PELCO by Schneider Electric: Lean Manufacturing of Assembly Lines. Funded by PELCO.<br />

Start D<strong>at</strong>e: June 2008 (Role PI, $15,000, Fresno St<strong>at</strong>e).<br />

TEACHING<br />

At <strong>University</strong> <strong>at</strong> <strong>Buffalo</strong>-SUNY<br />

• MAE 600 Machine Learning in Comput<strong>at</strong>ional Shape Synthesis (Gradu<strong>at</strong>e, Fall 2013)<br />

• MAE 376 Applied M<strong>at</strong>hem<strong>at</strong>ics for MAE (Undergradu<strong>at</strong>e, Fall 2013)<br />

• MAE 477/577 Computer Aided Design Applic<strong>at</strong>ions (Undergradu<strong>at</strong>e/Gradu<strong>at</strong>e, Spring 2013)<br />

At California St<strong>at</strong>e <strong>University</strong>, Fresno (Fresno St<strong>at</strong>e)<br />

• Advanced <strong>Engineering</strong> M<strong>at</strong>hem<strong>at</strong>ics (Gradu<strong>at</strong>e, Fall 2007)<br />

• ME 32: M<strong>at</strong>erial Science Lab (Undergradu<strong>at</strong>e, Fall 2007, Fall 2009)<br />

• <strong>Engineering</strong> Product Design (Undergradu<strong>at</strong>e, Fall 2007, Fall 2008, Fall 2009, Fall 2010)<br />

• Design of Machine Elements (Undergradu<strong>at</strong>e, Fall 2007, Fall 2008)<br />

• Theory of Machines <strong>and</strong> Mechanisms (Undergradu<strong>at</strong>e, Spring 2008, Spring 2009, Spring<br />

2010)<br />

• Machine Design (Undergradu<strong>at</strong>e, Spring 2008, Spring 2009, Spring 2010)<br />

• <strong>Engineering</strong> Graphics (Undergradu<strong>at</strong>e, Spring 2009, Fall 2009, Spring 2010, Fall 2012)<br />

DEPARTMENTAL SERVICE<br />

• Digital Additive Manufacturing Center (<strong>University</strong> <strong>at</strong> <strong>Buffalo</strong>-SUNY), Founding Faculty<br />

Member<br />

2

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