FA 2000 Detailed Presentation

BSET EQ
COMPANY PROFILE
BSET EQ WAS FOUNDED IN 1996
PROVIDING ONE STOP SHOP FOR PLASMA SOLUTIONS
MORE THAN 100 PLASMA SYSTEMS SOLD
WORLDWIDE SALES AND SERVICE REPRESENTATION

FA-2000 SERIES
MULTI-PURPOSE RIE SYSTEMS

ASSISTED RIE
APPLICATIONS FOR THE FA2000 SERIES
RESEARCH & DEVELOPMENT
WAFER LEVEL FAILURE ANALYSIS
PACKAGE LEVEL FAILURE ANALYSIS
INDUSTRY LEADER FOR PLASMA
DECAPSULATION BY
CO2 SNOW FILLERBLAST

RESEARCH AND DEVELOPMENT
TRENCH ETCH IN SILICON
TRENCH ETCH IN POLYMER
PHOTOS COURTESY OF UNIVERSITY OF SOUTHERN ILLINOIS CARBONDALE

PASSIVATION REMOVAL
SINGLE PROCESS TWO STEPS
ISOTROPIC POLYIMIDE REMOVAL
O2 PLASMA 2000 Mt 100 WATTS @ 13.56MHz 10 MINUTES
ANISOTROPIC SILICON NITRIDE REMOVAL
CF4/O2 PLASMA 200 mT, 150 WATTS @ 13.56 MHz 3 MINUTES
BEFORE
AFTER

FUNCTIONAL DELAYERING
PACKAGES AND 150 mm - 200 mm WAFERS ACCOMIDATED
HIGH END OPTIONS AVAILABLE
I.P.C.
METAL ETCH
ENDPOINT DETECTION

SOLAR CELL TEXTURING
USING THE FA2000C-RIE
DRY ETCHING USING
FLUORINE AND CHLORINE CHEMISTRY
REDUCE REFLECTANCE IMPROVE EFFICIENCY

FA2000 WITH DIGILEM LASER ENDPOINT DETECTOR

BSET EQ
NEW REVELATIONS FOR PLASMA IN THE
FAILURE ANALYSIS LABORATORY
New device technologies include new metallization and easily
stressed architectures in integrated circuit designs.
Continued developments with organic substrates in packaging make
failure analysis more difficult today.
These newer package technologies are often unsuitable for other
decapsulation methods.
More and more we see acid systems ACTUALLY being
eliminated from the list of choices for decap.
SOON, AMONG YOUR EXISTING RIE TOOLS WE WILL SEE THE
ABSOLUTE NECESSITY FOR
SPECIALIZED PLASMA DECAPSULATORS TO COMPLEMENT YOUR
OTHER TOOLS AND METHODS FOR PACKAGE DECAPSULATION

PLASMA DECAPSULATION
AN OVERVIEW OF THE PAST
SOME MAY RECALL
A disadvantage of plasma decapsulation technology has been slow removal of
epoxy and plastic molding materials.The cause of this problem is the build up of
filler materials, such as silicon dioxide and quartz based fillers, which do not
etch as quickly as organic components in the molding material.
The result, is the buildup of these fillers that masks further etching. This
causes a failure to decapsulate the device. An abandoned solution was the use
of N2 gas to "blow" away the filler buildup.
New molding materials, an increase in filler density and the use of hard
( green ) epoxies in advanced packages made this approach ineffective.
Process times with previous makeshift systems
could take more than 72 hours !!!

THE BSET EQ FA2000P
AN OVERVIEW OF THE PAST
AT THE TURN OF THE CENTURY THE INDUSTRY HAD SEEN THE SUCCESS
OF THE BGA PACKAGE.
ORGANIC SUBSTRATES IN PACKAGING HAD BECOME A RAGE WITH NEW
TECHNOLOGIES BEING INTRODUCED AT A FAST AND CONTINUOUS PACE.
WITH ACID TECHNIQUES BEING PARTICULARLY UNKIND TO ORGANIC
LAMINANTS IT WAS DIFFICULT TO INVESTIGATE THE INTEGRITY OF THE
2 ND BONDS ON THE NEW SUBSTRATES.
THE GINTIC INSTITUTE ( Then known as ) IN SINGAPORE HAD RECEIVED
FUNDING TO FIND A SOLUTION TO THE NEW CHALLEGES IN
DECAPSULATION.
AMONG THE CAPITAL REQUESTS IN THE PROJECT WAS THE THE
REQUEST FOR A PLASMA DECAPSULATOR…….
THAT WORKED !!!

BSET EQ SUBMITS PROPOSAL FOR A NEW
PLASMA DECAP SYSTEM AND WINS THE BID
The FA2000Ps’ application oriented chamber design and BSET EQ’s
Fillerblast provide the best system available in plasma decap.
Use of CO2 snow blast instead of N2 significantly enhances removal of
fillers. A special manifold forms dry ice, which acts as a fine medium that
is very effective in removing filler buildup. The plasma maintains a
constant and automated etch rate, which makes for a much more
efficient removal of the molding material. The FA-2000 Fillerblast
system also allows for an automatic change over to less aggressive CO2
blasts, or even extra gentle N2 blasts, to help preserve wire bonding.
With the FA2000P etch rates for many compounds Reach an
unprecidented 3 mil per hour.
A PLASMA DECAPSULATOR THAT WORKS !!!

THE FA2000P IS SPECIALLY DESIGNED FOR DECAP
OPERATES AT WIDE TEMPERATURE RANGE
OPERATES IN LOW AND HIGH PRESSURE REGIMES
UTILIZES CO2 SNOW FILLERBLAST
TECHNOLOGY
PROVIDING 100% SELECTIVITY
BETWEEN OXIDE AND EPOXY
……. AND ……..
PLASMA DECAP WITH
3 MIL /HOUR EPOXY ETCH !!!

NO ACIDS AND NO WASTE DISPOSAL
SELECTIVE ETCH PROTECTS….
COPPER, DIELECTRICS, COMPOSITES AND LAMINATES IN SUBSTRATES
1 ST AND 2nd BONDS EXPOSED
LOW MAINTENANCE COSTS

HOW DOES THE FILLERBLAST WORK
A PROPRIETARY NOZZLE APPARATUS UTILIZES CO2
SNOW BLAST AND N2 GAS TO PHYSICALLY ABLATE
THE SURFACE OF ETCH BLOCKING FILLERS
DOES THE FILLERBLAST DAMAGE
WIRES OR BOND SITES
NO, EVEN LONG WIRES ARE LEFT INTACT

FIRST AND SECOND BONDS EXPOSED

HIGH SELECTIVITY IN FLIP CHIP AND C.O.B.
BGA TECHNOLOGY EXPOSED…...

MULTIPLE DEVICES DECAPPED
TINY OR AWKWARD DEVICES ACCOMIDATED !!!

BSET EQ
NEW DEVELOPMENTS AND POSITIONS FOR PLASMA DECAPSULATION
IN THE FAILURE ANALYSIS LABORATORY
As we have stated before the field of failure analysis as related to semiconductor devices is
presented with continuous challenges in the methods with which we open packages.
Recently we have seen and been involved with techniques that due to the growing complexity of
our subjects, require more than one decapsulation tool to obtain success.
BSET EQ has spent the better part of a decade constantly improving the FA2000P.
We are proud to be recognized by other companies involved with other decapsulation techniques
as the leader in plasma decapsulation.
Collectively we have found that each technique complements the other and through a new level of
cooperation will provide a new set of solutions for the industries challenges.
TODAY WE HAVE DISCUSSED THE FOUR METHODS
THAT PROVIDE YOU WITH
TOTAL SOLUTION IN DECAPSULATION

CURRENTLY WE ARE INTEGRATING
BSET EQ TECHNOLOGY INTO A LASER
TOOL.
THE HYBRID SOLUTION
WILL BE AT BETA SITE FOR PROVING
IN THE FIRST QUARTER OF 2009

BSET EQ
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WWW.BSETPLASMAS.COM